JP2015015423A5 - - Google Patents

Download PDF

Info

Publication number
JP2015015423A5
JP2015015423A5 JP2013142535A JP2013142535A JP2015015423A5 JP 2015015423 A5 JP2015015423 A5 JP 2015015423A5 JP 2013142535 A JP2013142535 A JP 2013142535A JP 2013142535 A JP2013142535 A JP 2013142535A JP 2015015423 A5 JP2015015423 A5 JP 2015015423A5
Authority
JP
Japan
Prior art keywords
active region
region
substrate
semiconductor device
gate electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013142535A
Other languages
English (en)
Japanese (ja)
Other versions
JP6244699B2 (ja
JP2015015423A (ja
Filing date
Publication date
Priority claimed from JP2013142535A external-priority patent/JP6244699B2/ja
Priority to JP2013142535A priority Critical patent/JP6244699B2/ja
Application filed filed Critical
Priority to US14/313,529 priority patent/US9748231B2/en
Priority to KR20140078816A priority patent/KR20150006348A/ko
Priority to CN201410307590.2A priority patent/CN104282681B/zh
Publication of JP2015015423A publication Critical patent/JP2015015423A/ja
Publication of JP2015015423A5 publication Critical patent/JP2015015423A5/ja
Priority to KR1020160175626A priority patent/KR101762080B1/ko
Publication of JP6244699B2 publication Critical patent/JP6244699B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013142535A 2013-07-08 2013-07-08 半導体装置 Expired - Fee Related JP6244699B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013142535A JP6244699B2 (ja) 2013-07-08 2013-07-08 半導体装置
US14/313,529 US9748231B2 (en) 2013-07-08 2014-06-24 Semiconductor device
KR20140078816A KR20150006348A (ko) 2013-07-08 2014-06-26 반도체 장치
CN201410307590.2A CN104282681B (zh) 2013-07-08 2014-06-30 半导体器件
KR1020160175626A KR101762080B1 (ko) 2013-07-08 2016-12-21 반도체 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013142535A JP6244699B2 (ja) 2013-07-08 2013-07-08 半導体装置

Publications (3)

Publication Number Publication Date
JP2015015423A JP2015015423A (ja) 2015-01-22
JP2015015423A5 true JP2015015423A5 (https=) 2016-05-19
JP6244699B2 JP6244699B2 (ja) 2017-12-13

Family

ID=52132213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013142535A Expired - Fee Related JP6244699B2 (ja) 2013-07-08 2013-07-08 半導体装置

Country Status (4)

Country Link
US (1) US9748231B2 (https=)
JP (1) JP6244699B2 (https=)
KR (2) KR20150006348A (https=)
CN (1) CN104282681B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101776926B1 (ko) 2010-09-07 2017-09-08 삼성전자주식회사 반도체 소자 및 그 제조 방법
KR102494918B1 (ko) 2017-09-12 2023-02-02 삼성전자주식회사 반도체 소자
KR102567631B1 (ko) * 2018-08-03 2023-08-16 삼성전자주식회사 반도체 장치 및 그 제조 방법
KR102756304B1 (ko) * 2020-01-14 2025-01-17 에스케이하이닉스 주식회사 페이지 버퍼를 구비하는 반도체 메모리 장치

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0390327U (https=) * 1989-12-26 1991-09-13
JP4029257B2 (ja) * 2001-02-08 2008-01-09 セイコーエプソン株式会社 半導体装置、メモリシステムおよび電子機器
JP2005197345A (ja) * 2004-01-05 2005-07-21 Hitachi Ltd 半導体装置
US7141116B2 (en) * 2004-09-08 2006-11-28 Samsung Electronics Co., Ltd. Method for manufacturing a silicon structure
JP2007266377A (ja) * 2006-03-29 2007-10-11 Fujitsu Ltd 半導体装置
JP2007294629A (ja) 2006-04-25 2007-11-08 Elpida Memory Inc 半導体装置及びその製造方法
JP2009130167A (ja) * 2007-11-26 2009-06-11 Renesas Technology Corp 半導体装置およびその製造方法
KR20090056255A (ko) 2007-11-30 2009-06-03 주식회사 하이닉스반도체 반도체 메모리 소자 및 그의 제조 방법
US20090189198A1 (en) * 2008-01-25 2009-07-30 Toshiba America Electronic Components, Inc. Structures of sram bit cells
JP2009252825A (ja) 2008-04-02 2009-10-29 Panasonic Corp 半導体装置およびその製造方法
US8193062B2 (en) * 2009-09-25 2012-06-05 International Business Machines Corporation Asymmetric silicon-on-insulator SRAM cell
JP5576095B2 (ja) * 2009-11-12 2014-08-20 ルネサスエレクトロニクス株式会社 Sram
JP2011243684A (ja) * 2010-05-17 2011-12-01 Renesas Electronics Corp Sram
JP5605134B2 (ja) 2010-09-30 2014-10-15 富士通セミコンダクター株式会社 半導体装置及びその製造方法
KR20120101911A (ko) * 2011-03-07 2012-09-17 삼성전자주식회사 에스램 셀
JP5705053B2 (ja) * 2011-07-26 2015-04-22 ルネサスエレクトロニクス株式会社 半導体装置
US9076552B2 (en) * 2013-07-08 2015-07-07 Globalfoundries Inc. Device including a dual port static random access memory cell and method for the formation thereof

Similar Documents

Publication Publication Date Title
CN105226101A (zh) 结型场效应晶体管及其制造方法
JP2013149955A5 (ja) 半導体装置の作製方法
JP2012160716A5 (https=)
CN106952910A (zh) 半导体结构及其制造方法
US10593781B2 (en) Semiconductor device and fabrication method thereof
TWI565053B (zh) 高壓半導體裝置與其製造方法
JP2016048710A5 (https=)
CN108346696A (zh) Ldmos器件及其制造方法
JP2015015423A5 (https=)
CN105762103B (zh) 半导体结构及其形成方法
CN108807281B (zh) 半导体器件及其形成方法
CN108074973A (zh) 半导体结构及其形成方法
CN107591328A (zh) 半导体结构及其形成方法
CN107680955A (zh) 静电放电保护器件、半导体装置及制造方法
JP5460244B2 (ja) 半導体装置の製造方法
CN106328505B (zh) 半导体结构的形成方法
JP2011210901A5 (https=)
CN103700632B (zh) Cmos晶体管及其制作方法、显示面板和显示装置
US9054185B2 (en) Semiconductor device
US10727130B2 (en) Semiconductor device and fabrication method thereof
CN107546276A (zh) 带有注入式背栅的集成jfet结构
CN107275400B (zh) 半导体结构及其形成方法
TWI614898B (zh) 終止區結構及其製造方法
CN106033722B (zh) 基于cmos制造工艺的齐纳管的制造方法
CN102623505A (zh) 基于垂直双栅的抗辐照晶体管及其制备方法