JP2014534611A5 - - Google Patents

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Publication number
JP2014534611A5
JP2014534611A5 JP2014531934A JP2014531934A JP2014534611A5 JP 2014534611 A5 JP2014534611 A5 JP 2014534611A5 JP 2014531934 A JP2014531934 A JP 2014531934A JP 2014531934 A JP2014531934 A JP 2014531934A JP 2014534611 A5 JP2014534611 A5 JP 2014534611A5
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JP
Japan
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interposer
sensing device
image sensing
based image
light detection
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JP2014531934A
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Japanese (ja)
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JP2014534611A (ja
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Priority claimed from US13/622,155 external-priority patent/US8748828B2/en
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Publication of JP2014534611A publication Critical patent/JP2014534611A/ja
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JP2014531934A 2011-09-21 2012-09-19 高速画像取得システム及び高速画像検査システム用の、インターポーザをベースにした画像センサ Pending JP2014534611A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161537167P 2011-09-21 2011-09-21
US61/537,167 2011-09-21
US13/622,155 US8748828B2 (en) 2011-09-21 2012-09-18 Interposer based imaging sensor for high-speed image acquisition and inspection systems
US13/622,155 2012-09-18
PCT/US2012/056167 WO2013043762A1 (en) 2011-09-21 2012-09-19 Interposer based imaging sensor for high-speed image acquisition and inspection systems

Related Child Applications (1)

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JP2018111936A Division JP2018198427A (ja) 2011-09-21 2018-06-12 インターポーザベースの画像センシングデバイス、及び、検査システム

Publications (2)

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JP2014534611A JP2014534611A (ja) 2014-12-18
JP2014534611A5 true JP2014534611A5 (https=) 2015-11-12

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JP2014531934A Pending JP2014534611A (ja) 2011-09-21 2012-09-19 高速画像取得システム及び高速画像検査システム用の、インターポーザをベースにした画像センサ
JP2018111936A Pending JP2018198427A (ja) 2011-09-21 2018-06-12 インターポーザベースの画像センシングデバイス、及び、検査システム

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JP2018111936A Pending JP2018198427A (ja) 2011-09-21 2018-06-12 インターポーザベースの画像センシングデバイス、及び、検査システム

Country Status (8)

Country Link
US (2) US8748828B2 (https=)
EP (1) EP2758994B1 (https=)
JP (2) JP2014534611A (https=)
KR (2) KR20140078687A (https=)
CN (2) CN104025295B (https=)
IL (1) IL231596B (https=)
TW (2) TWI583196B (https=)
WO (1) WO2013043762A1 (https=)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9793673B2 (en) 2011-06-13 2017-10-17 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
US8873596B2 (en) 2011-07-22 2014-10-28 Kla-Tencor Corporation Laser with high quality, stable output beam, and long life high conversion efficiency non-linear crystal
US10197501B2 (en) 2011-12-12 2019-02-05 Kla-Tencor Corporation Electron-bombarded charge-coupled device and inspection systems using EBCCD detectors
US9496425B2 (en) 2012-04-10 2016-11-15 Kla-Tencor Corporation Back-illuminated sensor with boron layer
US9601299B2 (en) 2012-08-03 2017-03-21 Kla-Tencor Corporation Photocathode including silicon substrate with boron layer
US9151940B2 (en) 2012-12-05 2015-10-06 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
US8929406B2 (en) 2013-01-24 2015-01-06 Kla-Tencor Corporation 193NM laser and inspection system
US9529182B2 (en) 2013-02-13 2016-12-27 KLA—Tencor Corporation 193nm laser and inspection system
US9448343B2 (en) 2013-03-15 2016-09-20 Kla-Tencor Corporation Segmented mirror apparatus for imaging and method of using the same
US9608399B2 (en) 2013-03-18 2017-03-28 Kla-Tencor Corporation 193 nm laser and an inspection system using a 193 nm laser
US9478402B2 (en) 2013-04-01 2016-10-25 Kla-Tencor Corporation Photomultiplier tube, image sensor, and an inspection system using a PMT or image sensor
US9347890B2 (en) 2013-12-19 2016-05-24 Kla-Tencor Corporation Low-noise sensor and an inspection system using a low-noise sensor
US9748294B2 (en) 2014-01-10 2017-08-29 Hamamatsu Photonics K.K. Anti-reflection layer for back-illuminated sensor
US9410901B2 (en) 2014-03-17 2016-08-09 Kla-Tencor Corporation Image sensor, an inspection system and a method of inspecting an article
US9804101B2 (en) 2014-03-20 2017-10-31 Kla-Tencor Corporation System and method for reducing the bandwidth of a laser and an inspection system and method using a laser
US9432121B2 (en) 2014-06-05 2016-08-30 Xilinx, Inc. Optical communication circuits
DE102014213734B4 (de) * 2014-07-15 2021-01-21 Siemens Healthcare Gmbh Bildgebende Vorrichtung für elektromagnetische Strahlung
US9767986B2 (en) 2014-08-29 2017-09-19 Kla-Tencor Corporation Scanning electron microscope and methods of inspecting and reviewing samples
US9419407B2 (en) 2014-09-25 2016-08-16 Kla-Tencor Corporation Laser assembly and inspection system using monolithic bandwidth narrowing apparatus
US9923004B2 (en) 2014-09-30 2018-03-20 Qualcomm Incorporated Hardware acceleration of computer vision feature detection
US9838635B2 (en) 2014-09-30 2017-12-05 Qualcomm Incorporated Feature computation in a sensor element array
US9940533B2 (en) 2014-09-30 2018-04-10 Qualcomm Incorporated Scanning window for isolating pixel values in hardware for computer vision operations
US20170132466A1 (en) 2014-09-30 2017-05-11 Qualcomm Incorporated Low-power iris scan initialization
US9554100B2 (en) 2014-09-30 2017-01-24 Qualcomm Incorporated Low-power always-on face detection, tracking, recognition and/or analysis using events-based vision sensor
US10515284B2 (en) 2014-09-30 2019-12-24 Qualcomm Incorporated Single-processor computer vision hardware control and application execution
US10728450B2 (en) 2014-09-30 2020-07-28 Qualcomm Incorporated Event based computer vision computation
US9986179B2 (en) 2014-09-30 2018-05-29 Qualcomm Incorporated Sensor architecture using frame-based and event-based hybrid scheme
US9762834B2 (en) 2014-09-30 2017-09-12 Qualcomm Incorporated Configurable hardware for computing computer vision features
US9748729B2 (en) 2014-10-03 2017-08-29 Kla-Tencor Corporation 183NM laser and inspection system
DE102014221829B4 (de) * 2014-10-27 2018-02-22 Siemens Healthcare Gmbh Verfahren zur Herstellung eines Sensorboards für ein Detektormodul und damit hergestelltes Detektormodul
US9723179B2 (en) * 2014-11-25 2017-08-01 Raytheon Company Time delay and integration (TDI) imaging sensor and method
US9581696B2 (en) 2014-12-22 2017-02-28 Google Inc. Image sensor and light source driver integrated in a same semiconductor package
US9704056B2 (en) 2015-04-02 2017-07-11 Qualcomm Incorporated Computing hierarchical computations for computer vision calculations
US9860466B2 (en) * 2015-05-14 2018-01-02 Kla-Tencor Corporation Sensor with electrically controllable aperture for inspection and metrology systems
US10748730B2 (en) 2015-05-21 2020-08-18 Kla-Tencor Corporation Photocathode including field emitter array on a silicon substrate with boron layer
US10462391B2 (en) 2015-08-14 2019-10-29 Kla-Tencor Corporation Dark-field inspection using a low-noise sensor
EP3144032A1 (en) * 2015-09-15 2017-03-22 Pixium Vision SA Photosensitive pixel structure with front side coating
US20170287757A1 (en) * 2016-03-30 2017-10-05 Robert F. Kwasnick Damage monitor
US10778925B2 (en) 2016-04-06 2020-09-15 Kla-Tencor Corporation Multiple column per channel CCD sensor architecture for inspection and metrology
US10313622B2 (en) 2016-04-06 2019-06-04 Kla-Tencor Corporation Dual-column-parallel CCD sensor and inspection systems using a sensor
US10429321B2 (en) * 2016-08-29 2019-10-01 Kla-Tencor Corporation Apparatus for high-speed imaging sensor data transfer
US10469782B2 (en) * 2016-09-27 2019-11-05 Kla-Tencor Corporation Power-conserving clocking for scanning sensors
US10984235B2 (en) 2016-12-16 2021-04-20 Qualcomm Incorporated Low power data generation for iris-related detection and authentication
US10614332B2 (en) 2016-12-16 2020-04-07 Qualcomm Incorportaed Light source modulation for iris size adjustment
TWI616794B (zh) * 2016-12-20 2018-03-01 友達光電股份有限公司 光感測電路與其缺陷修補方法
US10175555B2 (en) 2017-01-03 2019-01-08 KLA—Tencor Corporation 183 nm CW laser and inspection system
US20180278868A1 (en) * 2017-03-21 2018-09-27 The Charles Stark Draper Laboratory, Inc. Neuromorphic Digital Focal Plane Array
EP3428692B1 (de) * 2017-07-10 2021-03-10 Siemens Healthcare GmbH Röntgendetektor mit zwischeneinheit und auswerteebene
CN107396007B (zh) * 2017-09-01 2020-02-14 中国科学院长春光学精密机械与物理研究所 一种连续转移模式下tdi ccd时序驱动方法及系统
WO2019042587A2 (de) * 2017-09-02 2019-03-07 Cetteen Gmbh Ansteuervorrichtung für eine röntgenröhre und verfahren zum betrieb einer röntgenröhre
US20190198460A1 (en) * 2017-12-21 2019-06-27 AP Memory Technology Corp. Circuit system having compact decoupling structure
DE102018200845B4 (de) * 2018-01-19 2021-05-06 Siemens Healthcare Gmbh Montageverfahren für die Herstellung eines Röntgendetektors, Röntgendetektor und Röntgengerät
US11114489B2 (en) 2018-06-18 2021-09-07 Kla-Tencor Corporation Back-illuminated sensor and a method of manufacturing a sensor
US10943760B2 (en) 2018-10-12 2021-03-09 Kla Corporation Electron gun and electron microscope
US11114491B2 (en) 2018-12-12 2021-09-07 Kla Corporation Back-illuminated sensor and a method of manufacturing a sensor
EP3756033B1 (en) * 2019-05-13 2023-11-15 Varex Imaging Sweden AB Method of reading out data in a radiation detector, radiation detector and imaging apparatus
WO2021024319A1 (ja) * 2019-08-02 2021-02-11 株式会社日立ハイテク 欠陥検査装置および欠陥検査方法
KR102896086B1 (ko) 2019-11-01 2025-12-08 삼성전자주식회사 센서 소자
US12366538B2 (en) 2020-04-02 2025-07-22 Hitachi High-Tech Corporation Defect inspection apparatus and defect inspection method
US11848350B2 (en) 2020-04-08 2023-12-19 Kla Corporation Back-illuminated sensor and a method of manufacturing a sensor using a silicon on insulator wafer
KR20220051698A (ko) 2020-10-19 2022-04-26 삼성전자주식회사 반도체 패키지
WO2022162881A1 (ja) 2021-01-29 2022-08-04 株式会社日立ハイテク 欠陥検査装置
US12112681B2 (en) * 2021-09-02 2024-10-08 Apple Inc. Electronic devices with displays and interposer structures
US12259660B2 (en) 2021-10-26 2025-03-25 Industrial Technology Research Institute Inspection method and inspection platform for lithography
US20250022893A1 (en) * 2021-12-06 2025-01-16 Sony Semiconductor Solutions Corporation Image sensor device, equipment, and method of manufacturing image sensor device
US20230403480A1 (en) * 2022-06-09 2023-12-14 Vergence Automation, Inc. Methods and apparatus for robotics vision system-on-chip and applications thereof
WO2024033812A1 (en) * 2022-08-08 2024-02-15 Hengstler Gmbh Optoelectronic device comprising light processing device with a through-opening

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0620442B1 (en) * 1993-04-08 2001-07-25 Lecroy S.A. Charge sampling circuit
JPH06350068A (ja) * 1993-06-03 1994-12-22 Hamamatsu Photonics Kk 半導体エネルギー線検出器の製造方法
US5525914A (en) * 1995-01-23 1996-06-11 International Business Machines Corporation CMOS driver circuit
JP3924352B2 (ja) * 1997-06-05 2007-06-06 浜松ホトニクス株式会社 裏面照射型受光デバイス
US6236454B1 (en) * 1997-12-15 2001-05-22 Applied Materials, Inc. Multiple beam scanner for an inspection system
JP3545247B2 (ja) * 1998-04-27 2004-07-21 シャープ株式会社 二次元画像検出器
JP4184543B2 (ja) * 1999-06-10 2008-11-19 株式会社日立製作所 光学像検出方法および外観検査装置
JP2002151729A (ja) * 2000-11-13 2002-05-24 Sony Corp 半導体装置及びその製造方法
US6426991B1 (en) * 2000-11-16 2002-07-30 Koninklijke Philips Electronics N.V. Back-illuminated photodiodes for computed tomography detectors
US7045758B2 (en) * 2001-05-07 2006-05-16 Panavision Imaging Llc Scanning image employing multiple chips with staggered pixels
JP3722367B2 (ja) * 2002-03-19 2005-11-30 ソニー株式会社 固体撮像素子の製造方法
US7639419B2 (en) * 2003-02-21 2009-12-29 Kla-Tencor Technologies, Inc. Inspection system using small catadioptric objective
US7609309B2 (en) * 2004-11-18 2009-10-27 Kla-Tencor Technologies Corporation Continuous clocking of TDI sensors
GB0503827D0 (en) 2005-02-24 2005-04-06 E2V Tech Uk Ltd Enhanced spectral range imaging sensor
JP4940667B2 (ja) * 2005-06-02 2012-05-30 ソニー株式会社 固体撮像素子及びその製造方法
JP4802520B2 (ja) * 2005-03-07 2011-10-26 ソニー株式会社 固体撮像装置及びその製造方法
US8049293B2 (en) * 2005-03-07 2011-11-01 Sony Corporation Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device
EP2453238B1 (en) * 2005-05-23 2016-12-21 Harald F. Hess Optical microscopy with phototransformable optical labels
TWI429066B (zh) * 2005-06-02 2014-03-01 新力股份有限公司 Semiconductor image sensor module and manufacturing method thereof
JP2007013362A (ja) * 2005-06-29 2007-01-18 Konica Minolta Holdings Inc 撮像装置及び撮像方法
JP4723362B2 (ja) * 2005-11-29 2011-07-13 株式会社日立ハイテクノロジーズ 光学式検査装置及びその方法
JP4760564B2 (ja) * 2006-06-20 2011-08-31 日本電気株式会社 パターン形状の欠陥検出方法及び検出装置
JP2008035047A (ja) * 2006-07-27 2008-02-14 Matsushita Electric Ind Co Ltd カメラ部品およびカメラと、カメラ部品の製造方法
US7785915B2 (en) * 2006-10-30 2010-08-31 Aptina Imaging Corporation Wafer level method of locating focal plane of imager devices
JP4609428B2 (ja) * 2006-12-27 2011-01-12 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および撮像装置
JP2009005262A (ja) 2007-06-25 2009-01-08 Olympus Imaging Corp 半導体装置および撮像装置
JP2009049290A (ja) * 2007-08-22 2009-03-05 Fujifilm Corp 撮像装置及びその製造方法
US8126255B2 (en) * 2007-09-20 2012-02-28 Kla-Tencor Corp. Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions
US7884015B2 (en) * 2007-12-06 2011-02-08 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US20090256156A1 (en) 2008-04-09 2009-10-15 E-Phocus, Inc Hybrid imaging sensor with approximately equal potential photodiodes
JP5198150B2 (ja) * 2008-05-29 2013-05-15 株式会社東芝 固体撮像装置
US8624971B2 (en) * 2009-01-23 2014-01-07 Kla-Tencor Corporation TDI sensor modules with localized driving and signal processing circuitry for high speed inspection
JP2010268353A (ja) * 2009-05-18 2010-11-25 Toshiba Corp 固体撮像装置及びその製造方法。
US20100330728A1 (en) * 2009-06-26 2010-12-30 Mccarten John P Method of aligning elements in a back-illuminated image sensor
JP5442394B2 (ja) * 2009-10-29 2014-03-12 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP2011124439A (ja) 2009-12-11 2011-06-23 Mitsubishi Electric Corp 撮像センサー評価装置
US9035267B2 (en) * 2010-01-04 2015-05-19 Bt Imaging Pty Ltd In-line photoluminescence imaging of semiconductor devices
US8436423B2 (en) * 2010-01-21 2013-05-07 Roper Scientific, Inc. Solid state back-illuminated photon sensor
US8564065B2 (en) * 2011-06-03 2013-10-22 Analog Devices, Inc. Circuit architecture for metal oxide semiconductor (MOS) output driver electrical overstress self-protection

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