JP2014534470A - 垂直集積のためのスタックビア - Google Patents
垂直集積のためのスタックビア Download PDFInfo
- Publication number
- JP2014534470A JP2014534470A JP2014537185A JP2014537185A JP2014534470A JP 2014534470 A JP2014534470 A JP 2014534470A JP 2014537185 A JP2014537185 A JP 2014537185A JP 2014537185 A JP2014537185 A JP 2014537185A JP 2014534470 A JP2014534470 A JP 2014534470A
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- via structure
- layer
- substrate
- central portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
- B81B7/0006—Interconnects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/278,080 | 2011-10-20 | ||
| US13/278,080 US10131534B2 (en) | 2011-10-20 | 2011-10-20 | Stacked vias for vertical integration |
| PCT/US2012/060648 WO2013059345A1 (en) | 2011-10-20 | 2012-10-17 | Stacked vias for vertical integration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2014534470A true JP2014534470A (ja) | 2014-12-18 |
Family
ID=47138180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014537185A Pending JP2014534470A (ja) | 2011-10-20 | 2012-10-17 | 垂直集積のためのスタックビア |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10131534B2 (https=) |
| EP (1) | EP2768767A1 (https=) |
| JP (1) | JP2014534470A (https=) |
| KR (1) | KR20140083042A (https=) |
| CN (2) | CN103974896A (https=) |
| IN (1) | IN2014CN02998A (https=) |
| WO (1) | WO2013059345A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180123245A1 (en) * | 2016-10-28 | 2018-05-03 | Broadcom Corporation | Broadband antenna array for wireless communications |
| CN108231747A (zh) * | 2016-12-21 | 2018-06-29 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其制作方法、电子装置 |
| US20190169020A1 (en) * | 2017-12-05 | 2019-06-06 | Intel Corporation | Package substrate integrated devices |
| EP3598235A1 (en) * | 2018-07-18 | 2020-01-22 | ASML Netherlands B.V. | Metrology apparatus and method for determining a characteristic relating to one or more structures on a substrate |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335506A (ja) * | 2003-04-30 | 2004-11-25 | Victor Co Of Japan Ltd | 多層プリント配線板 |
| JP2006090740A (ja) * | 2004-09-21 | 2006-04-06 | Ngk Spark Plug Co Ltd | 配線基板の検査方法、配線基板の製造方法及び配線基板の検査装置 |
| JP2006263902A (ja) * | 2005-02-25 | 2006-10-05 | Hitachi Ltd | 集積化マイクロエレクトロメカニカルシステムおよびその製造方法 |
| JP2009124318A (ja) * | 2007-11-13 | 2009-06-04 | Rohm Co Ltd | 半導体装置 |
| JP2009170669A (ja) * | 2008-01-16 | 2009-07-30 | Fujitsu Microelectronics Ltd | 配線基板及び半導体装置 |
| JP2009188402A (ja) * | 2008-02-04 | 2009-08-20 | Agilent Technol Inc | 気密パッケージデバイス、および少なくとも1つのデバイスをウェハレベルで気密パッケージングするための方法 |
| JP2010067647A (ja) * | 2008-09-08 | 2010-03-25 | Oki Semiconductor Co Ltd | 半導体装置の製造方法 |
| JP2010156704A (ja) * | 2010-02-18 | 2010-07-15 | Hokuriku Electric Ind Co Ltd | 圧電型三軸加速度センサ |
| JP2010535641A (ja) * | 2007-08-07 | 2010-11-25 | クォルコム・メムズ・テクノロジーズ・インコーポレーテッド | Mems装置及びその配線 |
| JP2010283189A (ja) * | 2009-06-05 | 2010-12-16 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5798283A (en) | 1995-09-06 | 1998-08-25 | Sandia Corporation | Method for integrating microelectromechanical devices with electronic circuitry |
| US5917645A (en) * | 1997-03-28 | 1999-06-29 | Daewoo Electronics Co., Ltd. | Thin film actuated mirror array in an optical projection system and method for manufacturing the same |
| US6320244B1 (en) * | 1999-01-12 | 2001-11-20 | Agere Systems Guardian Corp. | Integrated circuit device having dual damascene capacitor |
| US6562656B1 (en) | 2001-06-25 | 2003-05-13 | Thin Film Module, Inc. | Cavity down flip chip BGA |
| US20030234415A1 (en) * | 2002-06-24 | 2003-12-25 | Hwey-Ching Chien | Scalable three-dimensional fringe capacitor with stacked via |
| US20050041405A1 (en) | 2003-08-22 | 2005-02-24 | Intel Corporation | Stacked via structure that includes a skip via |
| US7081647B2 (en) * | 2003-09-29 | 2006-07-25 | Matsushita Electric Industrial Co., Ltd. | Microelectromechanical system and method for fabricating the same |
| JP4608294B2 (ja) | 2004-11-30 | 2011-01-12 | 日亜化学工業株式会社 | 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法 |
| KR100881303B1 (ko) * | 2005-11-02 | 2009-02-03 | 이비덴 가부시키가이샤 | 반도체 장치용 다층 프린트 배선판 및 그 제조 방법 |
| TWI298608B (en) | 2006-05-19 | 2008-07-01 | Foxconn Advanced Tech Inc | Method for manufacturing stack via of hdi printed circuit board |
| US7777715B2 (en) | 2006-06-29 | 2010-08-17 | Qualcomm Mems Technologies, Inc. | Passive circuits for de-multiplexing display inputs |
| US20080029898A1 (en) | 2006-08-01 | 2008-02-07 | Farooq Mukta G | Via stack structures |
| US7733552B2 (en) | 2007-03-21 | 2010-06-08 | Qualcomm Mems Technologies, Inc | MEMS cavity-coating layers and methods |
| US8022896B2 (en) * | 2007-08-08 | 2011-09-20 | Qualcomm Mems Technologies, Inc. | ESD protection for MEMS display panels |
| US8242593B2 (en) | 2008-01-27 | 2012-08-14 | International Business Machines Corporation | Clustered stacked vias for reliable electronic substrates |
| CN101728355A (zh) | 2008-11-03 | 2010-06-09 | 巨擘科技股份有限公司 | 多层基板的导孔结构及其制造方法 |
| JP5714564B2 (ja) * | 2009-03-30 | 2015-05-07 | クゥアルコム・インコーポレイテッドQualcomm Incorporated | 上部ポストパッシベーション技術および底部構造技術を使用する集積回路チップ |
| TW201102340A (en) * | 2009-07-10 | 2011-01-16 | Nat Univ Tsing Hua | A method for fabricating a multilayer microstructure with balancing residual stress capability |
| CN102001613B (zh) | 2009-09-02 | 2014-10-22 | 原相科技股份有限公司 | 微电子装置及制造方法、微机电封装结构及封装方法 |
-
2011
- 2011-10-20 US US13/278,080 patent/US10131534B2/en active Active
-
2012
- 2012-10-17 KR KR1020147013565A patent/KR20140083042A/ko not_active Withdrawn
- 2012-10-17 EP EP12781228.7A patent/EP2768767A1/en not_active Withdrawn
- 2012-10-17 CN CN201280059040.2A patent/CN103974896A/zh active Pending
- 2012-10-17 WO PCT/US2012/060648 patent/WO2013059345A1/en not_active Ceased
- 2012-10-17 JP JP2014537185A patent/JP2014534470A/ja active Pending
- 2012-10-17 IN IN2998CHN2014 patent/IN2014CN02998A/en unknown
- 2012-10-17 CN CN201910414865.5A patent/CN110228785A/zh active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335506A (ja) * | 2003-04-30 | 2004-11-25 | Victor Co Of Japan Ltd | 多層プリント配線板 |
| JP2006090740A (ja) * | 2004-09-21 | 2006-04-06 | Ngk Spark Plug Co Ltd | 配線基板の検査方法、配線基板の製造方法及び配線基板の検査装置 |
| JP2006263902A (ja) * | 2005-02-25 | 2006-10-05 | Hitachi Ltd | 集積化マイクロエレクトロメカニカルシステムおよびその製造方法 |
| JP2010535641A (ja) * | 2007-08-07 | 2010-11-25 | クォルコム・メムズ・テクノロジーズ・インコーポレーテッド | Mems装置及びその配線 |
| JP2009124318A (ja) * | 2007-11-13 | 2009-06-04 | Rohm Co Ltd | 半導体装置 |
| JP2009170669A (ja) * | 2008-01-16 | 2009-07-30 | Fujitsu Microelectronics Ltd | 配線基板及び半導体装置 |
| JP2009188402A (ja) * | 2008-02-04 | 2009-08-20 | Agilent Technol Inc | 気密パッケージデバイス、および少なくとも1つのデバイスをウェハレベルで気密パッケージングするための方法 |
| JP2010067647A (ja) * | 2008-09-08 | 2010-03-25 | Oki Semiconductor Co Ltd | 半導体装置の製造方法 |
| JP2010283189A (ja) * | 2009-06-05 | 2010-12-16 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
| JP2010156704A (ja) * | 2010-02-18 | 2010-07-15 | Hokuriku Electric Ind Co Ltd | 圧電型三軸加速度センサ |
Also Published As
| Publication number | Publication date |
|---|---|
| IN2014CN02998A (https=) | 2015-07-03 |
| WO2013059345A1 (en) | 2013-04-25 |
| CN110228785A (zh) | 2019-09-13 |
| CN103974896A (zh) | 2014-08-06 |
| US10131534B2 (en) | 2018-11-20 |
| US20130100143A1 (en) | 2013-04-25 |
| KR20140083042A (ko) | 2014-07-03 |
| EP2768767A1 (en) | 2014-08-27 |
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Legal Events
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150706 |
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| A521 | Request for written amendment filed |
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