JP2014529642A - 光学的に透明な導電性接着剤及びそれから製造される物品 - Google Patents

光学的に透明な導電性接着剤及びそれから製造される物品 Download PDF

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Publication number
JP2014529642A
JP2014529642A JP2014525041A JP2014525041A JP2014529642A JP 2014529642 A JP2014529642 A JP 2014529642A JP 2014525041 A JP2014525041 A JP 2014525041A JP 2014525041 A JP2014525041 A JP 2014525041A JP 2014529642 A JP2014529642 A JP 2014529642A
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Japan
Prior art keywords
electrically conductive
adhesive
layer
optically transparent
oca
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Pending
Application number
JP2014525041A
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English (en)
Japanese (ja)
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JP2014529642A5 (enExample
Inventor
ネルソン ティー． ロット，
ネルソン ティー． ロット，
ジョン ディー． レ，
ジョン ディー． レ，
ロバート シー． フィッツァー，
ロバート シー． フィッツァー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2014529642A publication Critical patent/JP2014529642A/ja
Publication of JP2014529642A5 publication Critical patent/JP2014529642A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/902—Specified use of nanostructure
    • Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2014525041A 2011-08-12 2012-07-30 光学的に透明な導電性接着剤及びそれから製造される物品 Pending JP2014529642A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161522969P 2011-08-12 2011-08-12
US61/522,969 2011-08-12

Publications (2)

Publication Number Publication Date
JP2014529642A true JP2014529642A (ja) 2014-11-13
JP2014529642A5 JP2014529642A5 (enExample) 2015-09-17

Family

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Family Applications (1)

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JP2014525041A Pending JP2014529642A (ja) 2011-08-12 2012-07-30 光学的に透明な導電性接着剤及びそれから製造される物品

Country Status (6)

Country Link
US (1) US20140251662A1 (enExample)
JP (1) JP2014529642A (enExample)
KR (1) KR20140064842A (enExample)
CN (1) CN103732709A (enExample)
TW (1) TW201313874A (enExample)
WO (1) WO2013025330A2 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016093120A1 (ja) * 2014-12-08 2016-06-16 日東電工株式会社 粘着剤層付き透明導電性フィルム
JP2017019207A (ja) * 2015-07-10 2017-01-26 株式会社カネカ 金属細線フィルムおよびその製造方法
KR20180004130A (ko) * 2015-04-03 2018-01-10 시쓰리나노 인크 귀금속이 코팅된 실버 나노와이어, 이 코팅의 제조방법 및 안정화된 투명 전도성 필름
JP2018510518A (ja) * 2014-12-09 2018-04-12 スリーエム イノベイティブ プロパティズ カンパニー ポリマー光学多層フィルムを含む反射構造によって秘匿される電気通信要素を有するシステム
JP2018524626A (ja) * 2015-05-22 2018-08-30 サムスン エレクトロニクス カンパニー リミテッド 表示モジュール及びその製造方法
KR20200061536A (ko) * 2018-11-26 2020-06-03 주식회사 엘엠에스 접착시트 및 이를 포함하는 투명 전극
WO2020162231A1 (ja) * 2019-02-06 2020-08-13 日東電工株式会社 粘着シートおよびその利用

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US9302452B2 (en) * 2012-03-02 2016-04-05 Ppg Industries Ohio, Inc. Transparent laminates comprising inkjet printed conductive lines and methods of forming the same
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
JP6079166B2 (ja) * 2012-11-26 2017-02-15 ソニー株式会社 積層構造体の製造方法
US9782955B2 (en) 2013-09-24 2017-10-10 3M Innovative Properties Company Transferable transparent conductive patterns and display stack materials
US20150218425A1 (en) * 2014-02-05 2015-08-06 Apple Inc. Stretch release conductive adhesive
US11343911B1 (en) * 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
US9465472B1 (en) * 2014-08-29 2016-10-11 Amazon Technologies, Inc. Metal mesh touch sensor with low birefringence substrate and ultraviolet cut
KR20160124665A (ko) * 2015-04-20 2016-10-28 호시덴 가부시기가이샤 터치 패널 및 그 제조방법
KR101762288B1 (ko) 2015-04-29 2017-07-28 안상일 필름복합체, 이를 포함하는 표시장치 및 그 제조방법
US10654251B2 (en) 2015-06-29 2020-05-19 3M Innovative Properties Company Ultrathin barrier laminates and devices
CN208488734U (zh) 2015-08-21 2019-02-12 3M创新有限公司 包括金属迹线的透明导体
DE102015115004A1 (de) * 2015-09-07 2017-03-09 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Verfahren zur Herstellung von strukturierten Oberflächen
WO2017112438A1 (en) * 2015-12-22 2017-06-29 3M Innovative Properties Company Bonding layer having discrete adhesive patches
DE102015122788A1 (de) 2015-12-23 2017-06-29 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Verfahren zur Herstellung von leitfähigen Strukturen
CN106125993B (zh) * 2016-08-25 2019-05-10 京东方科技集团股份有限公司 触控屏的制作方法以及导电可剥胶
CN108091255A (zh) 2016-11-21 2018-05-29 群创光电股份有限公司 显示装置及其制造方法
US10295749B1 (en) * 2018-02-15 2019-05-21 International Business Machines Corporation Optical interconnect attach to photonic device with partitioning adhesive function
US11745702B2 (en) 2018-12-11 2023-09-05 Ppg Industries Ohio, Inc. Coating including electrically conductive lines directly on electrically conductive layer
KR102662052B1 (ko) * 2019-07-26 2024-05-02 삼성전자 주식회사 Emi 차폐 부재 및 이를 포함하는 전자 장치
CN115136144B (zh) * 2020-02-13 2025-08-26 旭化成株式会社 透明天线和rf标签
CN114716927A (zh) * 2021-01-05 2022-07-08 乐金显示有限公司 散热粘合膜以及包括该散热粘合膜的显示装置
CN113736259B (zh) * 2021-09-06 2024-03-29 上海海事大学 一种低介电损耗负介材料及其制备方法
US12394536B2 (en) 2022-10-07 2025-08-19 Ekc Technology, Inc. Silver nanowire and noble-metal coated silver nanowire conductive polymer composites with low loading percolation conduction

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JP2009505358A (ja) * 2005-08-12 2009-02-05 カンブリオス テクノロジーズ コーポレイション ナノワイヤに基づく透明導電体
JP2010226489A (ja) * 2009-03-24 2010-10-07 Toshiba Corp 携帯電話機
JP2012079257A (ja) * 2010-10-06 2012-04-19 Dic Corp 両面粘着シートを用いた透明導電膜積層体およびタッチパネル装置

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US6160714A (en) * 1997-12-31 2000-12-12 Elpac (Usa), Inc. Molded electronic package and method of preparation
JP2002107544A (ja) * 2000-07-27 2002-04-10 Denso Corp 映像表示装置
KR200371726Y1 (ko) * 2004-08-24 2005-01-07 조인셋 주식회사 양면 접착이 가능한 다목적 점착테이프
JP2006286418A (ja) * 2005-03-31 2006-10-19 Tdk Corp 透明導電体
KR101375904B1 (ko) * 2008-04-28 2014-03-27 주식회사 엘지화학 점착제 조성물, 점착 시트, 광학 필터 및 디스플레이 장치
WO2011063082A2 (en) * 2009-11-20 2011-05-26 3M Innovative Properties Company Surface-modified adhesives
KR20110091261A (ko) * 2010-02-05 2011-08-11 주식회사 솔루에타 전자파 차폐용 전도성 섬유 양면 테이프 및 그 제조방법

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2009505358A (ja) * 2005-08-12 2009-02-05 カンブリオス テクノロジーズ コーポレイション ナノワイヤに基づく透明導電体
JP2010226489A (ja) * 2009-03-24 2010-10-07 Toshiba Corp 携帯電話機
JP2012079257A (ja) * 2010-10-06 2012-04-19 Dic Corp 両面粘着シートを用いた透明導電膜積層体およびタッチパネル装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016093120A1 (ja) * 2014-12-08 2016-06-16 日東電工株式会社 粘着剤層付き透明導電性フィルム
JP2018510518A (ja) * 2014-12-09 2018-04-12 スリーエム イノベイティブ プロパティズ カンパニー ポリマー光学多層フィルムを含む反射構造によって秘匿される電気通信要素を有するシステム
JP2021059125A (ja) * 2014-12-09 2021-04-15 スリーエム イノベイティブ プロパティズ カンパニー ポリマー光学多層フィルムを含む反射構造によって秘匿される電気通信要素を有するシステム
JP7067834B2 (ja) 2014-12-09 2022-05-16 スリーエム イノベイティブ プロパティズ カンパニー ポリマー光学多層フィルムを含む反射構造によって秘匿される電気通信要素を有するシステム
KR20180004130A (ko) * 2015-04-03 2018-01-10 시쓰리나노 인크 귀금속이 코팅된 실버 나노와이어, 이 코팅의 제조방법 및 안정화된 투명 전도성 필름
KR102591977B1 (ko) * 2015-04-03 2023-10-19 시쓰리나노 인크 귀금속이 코팅된 실버 나노와이어, 이 코팅의 제조방법 및 안정화된 투명 전도성 필름
JP2018524626A (ja) * 2015-05-22 2018-08-30 サムスン エレクトロニクス カンパニー リミテッド 表示モジュール及びその製造方法
JP2017019207A (ja) * 2015-07-10 2017-01-26 株式会社カネカ 金属細線フィルムおよびその製造方法
KR20200061536A (ko) * 2018-11-26 2020-06-03 주식회사 엘엠에스 접착시트 및 이를 포함하는 투명 전극
KR102148860B1 (ko) 2018-11-26 2020-08-28 주식회사 엘엠에스 접착시트 및 이를 포함하는 투명 전극
WO2020162231A1 (ja) * 2019-02-06 2020-08-13 日東電工株式会社 粘着シートおよびその利用

Also Published As

Publication number Publication date
TW201313874A (zh) 2013-04-01
CN103732709A (zh) 2014-04-16
WO2013025330A2 (en) 2013-02-21
KR20140064842A (ko) 2014-05-28
WO2013025330A3 (en) 2013-07-11
US20140251662A1 (en) 2014-09-11

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