JP2014521992A5 - - Google Patents

Download PDF

Info

Publication number
JP2014521992A5
JP2014521992A5 JP2014520486A JP2014520486A JP2014521992A5 JP 2014521992 A5 JP2014521992 A5 JP 2014521992A5 JP 2014520486 A JP2014520486 A JP 2014520486A JP 2014520486 A JP2014520486 A JP 2014520486A JP 2014521992 A5 JP2014521992 A5 JP 2014521992A5
Authority
JP
Japan
Prior art keywords
filled
filling
transparent
deposited
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014520486A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014521992A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/CH2012/000160 external-priority patent/WO2013010285A1/en
Publication of JP2014521992A publication Critical patent/JP2014521992A/ja
Publication of JP2014521992A5 publication Critical patent/JP2014521992A5/ja
Pending legal-status Critical Current

Links

JP2014520486A 2011-07-19 2012-07-10 受動光学構成要素の製造方法および受動光学構成要素を備えるデバイス Pending JP2014521992A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161509357P 2011-07-19 2011-07-19
US61/509,357 2011-07-19
PCT/CH2012/000160 WO2013010285A1 (en) 2011-07-19 2012-07-10 Method for manufacturing passive optical components, and devices comprising the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017042941A Division JP6763807B2 (ja) 2011-07-19 2017-03-07 受動光学構成要素の製造方法および受動光学構成要素を備えるデバイス

Publications (2)

Publication Number Publication Date
JP2014521992A JP2014521992A (ja) 2014-08-28
JP2014521992A5 true JP2014521992A5 (enExample) 2015-08-13

Family

ID=46639253

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014520486A Pending JP2014521992A (ja) 2011-07-19 2012-07-10 受動光学構成要素の製造方法および受動光学構成要素を備えるデバイス
JP2017042941A Active JP6763807B2 (ja) 2011-07-19 2017-03-07 受動光学構成要素の製造方法および受動光学構成要素を備えるデバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017042941A Active JP6763807B2 (ja) 2011-07-19 2017-03-07 受動光学構成要素の製造方法および受動光学構成要素を備えるデバイス

Country Status (8)

Country Link
US (4) US8767303B2 (enExample)
EP (1) EP2735029B1 (enExample)
JP (2) JP2014521992A (enExample)
KR (1) KR101966478B1 (enExample)
CN (1) CN103975436B (enExample)
SG (1) SG10201605834YA (enExample)
TW (3) TWI647825B (enExample)
WO (1) WO2013010285A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103512595B (zh) * 2011-07-19 2016-08-10 赫普塔冈微光有限公司 光电模块及其制造方法与包含光电模块的电器及装置
CN103858230B (zh) * 2011-08-10 2018-03-27 新加坡恒立私人有限公司 光电子模块和用于制造该光电子模块的方法
EP3396716B1 (en) 2012-08-20 2020-10-14 Heptagon Micro Optics Pte. Ltd. Fabrication of optics wafer
EP2827368B1 (en) * 2013-07-19 2019-06-05 ams AG Package for an optical sensor, optical sensor arrangement and method of producing a package for an optical sensor
WO2015016772A1 (en) 2013-07-31 2015-02-05 Heptagon Micro Optics Pte. Ltd. Micro-optical orientation sensor and related methods
NL2011843C2 (en) 2013-11-26 2015-05-27 Anteryon Wafer Optics B V A method for manufacturing an optical assembly.
US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US9829614B2 (en) 2015-02-02 2017-11-28 Synaptics Incorporated Optical sensor using collimator
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
US10475837B2 (en) * 2015-06-23 2019-11-12 Sony Corporation Image sensor and electronic device
JP2017022200A (ja) 2015-07-08 2017-01-26 ソニーセミコンダクタソリューションズ株式会社 イメージセンサ、および電子機器
JP2018537845A (ja) * 2015-10-07 2018-12-20 シナプティクス インコーポレイテッド 指紋感知用イメージセンサ構造
KR101738883B1 (ko) * 2016-01-06 2017-05-23 한국과학기술원 초박형 디지털 카메라 및 그 제조 방법
JP6740628B2 (ja) * 2016-02-12 2020-08-19 凸版印刷株式会社 固体撮像素子及びその製造方法
WO2017155460A1 (en) * 2016-03-08 2017-09-14 Tnc Optics & Technologies Pte. Ltd. A fabrication method of optical sensor cover having a lens
CN113474154A (zh) * 2019-02-25 2021-10-01 ams传感器新加坡私人有限公司 光学漫射器元件的制造和光学漫射器元件
US10734184B1 (en) 2019-06-21 2020-08-04 Elbit Systems Of America, Llc Wafer scale image intensifier

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3532038A (en) * 1967-06-05 1970-10-06 Ibm Multi-lens devices for the fabrication of semiconductor devices
JPS5590909A (en) * 1978-12-28 1980-07-10 Canon Inc Production of compound eye lens device
US4952026A (en) * 1988-10-14 1990-08-28 Corning Incorporated Integral optical element and method
AU706101B2 (en) * 1994-12-23 1999-06-10 Digirad Semiconductor gamma-ray camera and medical imaging system
EP1251365B1 (en) * 2001-04-20 2004-02-25 Matsushita Electric Industrial Co., Ltd. Microlens array and method of its manufacturing
JP2003004909A (ja) * 2001-04-20 2003-01-08 Matsushita Electric Ind Co Ltd マイクロレンズアレイの製造方法及びマイクロレンズアレイ
TW200506418A (en) * 2003-07-01 2005-02-16 Nippon Sheet Glass Co Ltd Lens plate, its manufacturing method, and image transmitting apparatus
JP2005072662A (ja) * 2003-08-25 2005-03-17 Sharp Corp 透光板および透光板の製造方法、並びに透光板を用いた画像入力装置
EP1569276A1 (en) 2004-02-27 2005-08-31 Heptagon OY Micro-optics on optoelectronics
US7399421B2 (en) * 2005-08-02 2008-07-15 International Business Machines Corporation Injection molded microoptics
JP2007148297A (ja) 2005-11-30 2007-06-14 Hitachi Maxell Ltd バックライト用光学シート、バックライト及び表示装置
KR100802199B1 (ko) * 2006-05-25 2008-03-17 정경희 광모듈 및 그 제조방법
EP1870936A1 (fr) * 2006-06-19 2007-12-26 STMicroelectronics (Rousset) SAS Procédé de fabrication de lentilles, notamment pour imageur intégré
US8013289B2 (en) * 2006-11-15 2011-09-06 Ether Precision, Inc. Lens array block for image capturing unit and methods of fabrication
US20080290435A1 (en) * 2007-05-21 2008-11-27 Micron Technology, Inc. Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods
KR101575915B1 (ko) * 2007-11-27 2015-12-08 헵타곤 마이크로 옵틱스 피티이. 리미티드 봉지된 렌즈 스택
TWI478808B (zh) * 2007-12-19 2015-04-01 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
TWI505703B (zh) 2007-12-19 2015-10-21 新加坡恒立私人有限公司 光學模組，晶圓等級的封裝及其製造方法
US7920328B2 (en) * 2008-02-28 2011-04-05 Visera Technologies Company Limited Lens module and a method for fabricating the same
JP5030828B2 (ja) * 2008-03-18 2012-09-19 株式会社沖データ レンズアレイ並びにそれを有するｌｅｄヘッド、露光装置、画像形成装置及び読取装置
CN102016653B (zh) * 2008-04-28 2013-07-10 柯尼卡美能达精密光学株式会社 晶圆透镜聚合体的制造方法及晶圆透镜的制造方法
JP4906798B2 (ja) * 2008-07-01 2012-03-28 株式会社沖データ レンズアレイ、ｌｅｄヘッド、露光装置、画像形成装置及び読取装置
JP4966931B2 (ja) * 2008-08-26 2012-07-04 シャープ株式会社 電子素子ウエハモジュールおよびその製造方法、電子素子モジュールおよびその製造方法、電子情報機器
WO2010055801A1 (ja) 2008-11-17 2010-05-20 コニカミノルタオプト株式会社 光学素子の製造方法及び光学素子
JP2010204632A (ja) 2009-02-06 2010-09-16 Fujifilm Corp ウェハレベルレンズアレイの製造方法、ウェハレンズアレイ、レンズモジュール及び撮像ユニット
JP2010204635A (ja) * 2009-02-06 2010-09-16 Fujifilm Corp レンズアレイ
EP2437928B1 (en) * 2009-06-02 2017-08-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for manufacturing wafer lens and the manufatured wafer lens
CN102023330A (zh) * 2009-09-15 2011-04-20 鸿富锦精密工业（深圳）有限公司 遮光元件阵列、遮光元件阵列制造方法及镜头模组阵列
JP2011097294A (ja) 2009-10-28 2011-05-12 Olympus Corp 撮像装置および撮像装置の製造方法
JPWO2011055654A1 (ja) 2009-11-05 2013-03-28 コニカミノルタアドバンストレイヤー株式会社 撮像装置及びこの撮像装置の製造方法
JP2011104811A (ja) 2009-11-13 2011-06-02 Fujifilm Corp マスタ型、マスタの作成方法及びマスタ
EP2510399A4 (en) * 2009-12-11 2014-01-22 Fujifilm Corp BLACK CURABLE COMPOSITION, COLORED FILTER, AND LIGHT PROTECTIVE FILM AND METHOD OF MANUFACTURE, LENGTH LENS AND SEMICONDUCTOR IMAGING DEVICE
CN102130138B (zh) * 2010-01-12 2013-01-02 中芯国际集成电路制造(上海)有限公司 图像传感器及其形成方法
US7974023B1 (en) * 2010-03-11 2011-07-05 Himax Semiconductor, Inc. Wafer level optical lens substrate, wafer level optical lens module and fabrication method thereof
TWM399313U (en) 2010-07-30 2011-03-01 Sigurd Microelectronics Corp Proximity sensor package structure
SG11201400917VA (en) * 2011-10-06 2014-07-30 Heptagon Micro Optics Pte Ltd Method for wafer-level manufacturing of objects and corresponding semi-finished products
JP2014190988A (ja) * 2013-03-26 2014-10-06 Fuji Xerox Co Ltd レンズアレイ及びレンズアレイ製造方法

Similar Documents

Publication Publication Date Title
EP2009135A4 (en) BASIC SUBSTITUTE FOR EPITACTIC DIAMOND FILM, METHOD FOR PRODUCING THE BASIC SUBSTRATE FOR EPITACTIC DIAMOND FILM, EPITACTIC DIAMOND FILM MANUFACTURED BY THE BASIC SUBSTITUTE FOR EPITACTIC DIAMOND FILM, AND METHOD FOR PRODUCING THE EPITACTIC DIAMOND FILM
JP2014036110A5 (enExample)
EP2870493A4 (en) FINE STRUCTURE, OPTICAL ELEMENT, ANTIREFLEX FOIL, WATER REPELLENT FOIL, SUBSTRATE FOR MASS SPECTROMETRY, PHASE PLATE, METHOD FOR PRODUCING A FINE STRUCTURE AND METHOD FOR PRODUCING AN ANTIREFLEX FOIL
EP2360701A4 (en) SUBSTRATE FOR FORMING A SUPERLAYABLE FILM, MATERIAL FOR A SUPER-SEAMED WIRE AND PRODUCTION METHOD THEREFOR
JP2013160994A5 (enExample)
EP3890000A4 (en) PROCESS FOR MAKING A DIAMOND SUBSTRATE
DK3812807T3 (da) Optisk komponent baseret på fotoniske krystalfibre med hul kerne til generering af bredbåndsstråling
JP2015536895A5 (enExample)
CN108454220B (zh) 狭缝喷嘴和使用狭缝喷嘴制造显示装置的方法
JP2012063764A5 (enExample)
JP2009238741A5 (ja) 発光装置の作製方法
JP2014235279A5 (enExample)
EP3339948A4 (en) ARRAYSUBSTRAT, MANUFACTURING METHOD AND DISPLAY DEVICE THEREFOR
EP2843687A4 (en) COMPOSITION METHOD FOR COMPOSITE SUBSTRATE, METHOD FOR PRODUCING A SEMICONDUCTOR ELEMENT, COMPOSITE SUBSTRATE AND SEMICONDUCTOR COMPONENT
EP3798718A4 (en) COMPOSITE SUBSTRATE FOR ELECTRO-OPTICAL ELEMENT AND METHOD FOR MANUFACTURING IT
CO2020011016A2 (es) Métodos para dispensar y adherir polímeros arrastrados fusionados en caliente a sustratos
EP3330403A4 (en) SUBSTRATE / APATIT COMPOSITE OXIDE FILM COMPLEX AND METHOD FOR THE PRODUCTION THEREOF
DK3857278T3 (da) Integrerede varmestrukturer i et fotonisk integreret kredsløb til loddefastgørelsesanvendelser
EP3879336A4 (en) COMPOSITE SUBSTRATE FOR ELECTRO-OPTICAL ELEMENT AND MANUFACTURING METHOD THEREOF
EP3315573A4 (en) LAMINATING COMPOSITION FOR HEAT DISPOSABLE MATERIAL, WASTE MANAGEMENT MATERIAL WITH LUBRICANT, INSERT SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF
JP2014509907A5 (enExample)
JP2013076901A5 (enExample)
RU2010151604A (ru) Способ изготовления выдачного устройства или его детали и выдачное устройство или деталь, изготовленные указанным способом
EP3614430A4 (en) ARRAY SUBSTRATE, MANUFACTURING METHOD FOR A DISPLAY SUBSTRATE AND DISPLAY BOARD
JP2015191010A5 (ja) 光学フィルムの製造方法及び光学フィルム