KR101966478B1 - 수동 광학 부품을 제조하기 위한 방법 및 그것을 포함하는 장치 - Google Patents

수동 광학 부품을 제조하기 위한 방법 및 그것을 포함하는 장치 Download PDF

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KR101966478B1
KR101966478B1 KR1020147004151A KR20147004151A KR101966478B1 KR 101966478 B1 KR101966478 B1 KR 101966478B1 KR 1020147004151 A KR1020147004151 A KR 1020147004151A KR 20147004151 A KR20147004151 A KR 20147004151A KR 101966478 B1 KR101966478 B1 KR 101966478B1
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optical
transparent
wafer
blocking portion
transparent element
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KR20140054081A (ko
Inventor
하르트무트 루드만
수잔 베슈텐회퍼
보얀 테자노픽
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헵타곤 마이크로 옵틱스 피티이. 리미티드
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0012Arrays characterised by the manufacturing method
    • G02B3/0031Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00009Production of simple or compound lenses
    • B29D11/00278Lenticular sheets
    • B29D11/00307Producing lens wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00009Production of simple or compound lenses
    • B29D11/00365Production of microlenses
    • B29D11/00375Production of microlenses by moulding lenses in holes through a substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/0074Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00932Combined cutting and grinding thereof
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00Optical objectives specially designed for the purposes specified below
    • G02B13/001Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00Optical elements, e.g. lenses, prisms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/804Containers or encapsulations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Light Receiving Elements (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Led Device Packages (AREA)
  • Optical Integrated Circuits (AREA)
KR1020147004151A 2011-07-19 2012-07-10 수동 광학 부품을 제조하기 위한 방법 및 그것을 포함하는 장치 Active KR101966478B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161509357P 2011-07-19 2011-07-19
US61/509,357 2011-07-19
PCT/CH2012/000160 WO2013010285A1 (en) 2011-07-19 2012-07-10 Method for manufacturing passive optical components, and devices comprising the same

Publications (2)

Publication Number Publication Date
KR20140054081A KR20140054081A (ko) 2014-05-08
KR101966478B1 true KR101966478B1 (ko) 2019-04-05

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KR1020147004151A Active KR101966478B1 (ko) 2011-07-19 2012-07-10 수동 광학 부품을 제조하기 위한 방법 및 그것을 포함하는 장치

Country Status (8)

Country Link
US (4) US8767303B2 (enExample)
EP (1) EP2735029B1 (enExample)
JP (2) JP2014521992A (enExample)
KR (1) KR101966478B1 (enExample)
CN (1) CN103975436B (enExample)
SG (1) SG10201605834YA (enExample)
TW (3) TWI647825B (enExample)
WO (1) WO2013010285A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103512595B (zh) * 2011-07-19 2016-08-10 赫普塔冈微光有限公司 光电模块及其制造方法与包含光电模块的电器及装置
JP6247633B2 (ja) * 2011-08-10 2017-12-13 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドHeptagon Micro Optics Pte. Ltd. 光電子モジュールおよびその製造方法
SG11201500902SA (en) 2012-08-20 2015-03-30 Heptagon Micro Optics Pte Ltd Fabrication of optics wafer
EP2827368B1 (en) * 2013-07-19 2019-06-05 ams AG Package for an optical sensor, optical sensor arrangement and method of producing a package for an optical sensor
WO2015016772A1 (en) 2013-07-31 2015-02-05 Heptagon Micro Optics Pte. Ltd. Micro-optical orientation sensor and related methods
NL2011843C2 (en) 2013-11-26 2015-05-27 Anteryon Wafer Optics B V A method for manufacturing an optical assembly.
US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US9829614B2 (en) 2015-02-02 2017-11-28 Synaptics Incorporated Optical sensor using collimator
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
WO2016208403A1 (ja) * 2015-06-23 2016-12-29 ソニー株式会社 イメージセンサ、および電子機器
JP2017022200A (ja) * 2015-07-08 2017-01-26 ソニーセミコンダクタソリューションズ株式会社 イメージセンサ、および電子機器
KR102439203B1 (ko) * 2015-10-07 2022-09-02 베이징 지오브이 테크놀로지 컴퍼니 리미티드 지문 감지를 위한 이미지 센서 구조체들
KR101738883B1 (ko) * 2016-01-06 2017-05-23 한국과학기술원 초박형 디지털 카메라 및 그 제조 방법
JP6740628B2 (ja) * 2016-02-12 2020-08-19 凸版印刷株式会社 固体撮像素子及びその製造方法
SG11201602031TA (en) * 2016-03-08 2017-10-30 Tnc Optics & Tech Pte Ltd A fabrication method of optical sensor cover having a lens
DE112020000917T5 (de) * 2019-02-25 2021-11-04 Ams Sensors Singapore Pte. Ltd. Herstellung von optischen diffusoren und optische diffusoren
US10734184B1 (en) 2019-06-21 2020-08-04 Elbit Systems Of America, Llc Wafer scale image intensifier

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080290435A1 (en) * 2007-05-21 2008-11-27 Micron Technology, Inc. Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods
JP2010204635A (ja) * 2009-02-06 2010-09-16 Fujifilm Corp レンズアレイ
JP2011508253A (ja) 2007-12-19 2011-03-10 ヘプタゴン・オサケ・ユキチュア 光学要素の製造

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3532038A (en) * 1967-06-05 1970-10-06 Ibm Multi-lens devices for the fabrication of semiconductor devices
JPS5590909A (en) * 1978-12-28 1980-07-10 Canon Inc Production of compound eye lens device
US4952026A (en) * 1988-10-14 1990-08-28 Corning Incorporated Integral optical element and method
MX9704632A (es) * 1994-12-23 1998-02-28 Digirad Camara semiconductora de rayos gama y sistema medico de formacion de imagenes.
US6814901B2 (en) * 2001-04-20 2004-11-09 Matsushita Electric Industrial Co., Ltd. Method of manufacturing microlens array and microlens array
JP2003004909A (ja) * 2001-04-20 2003-01-08 Matsushita Electric Ind Co Ltd マイクロレンズアレイの製造方法及びマイクロレンズアレイ
TW200506418A (en) * 2003-07-01 2005-02-16 Nippon Sheet Glass Co Ltd Lens plate, its manufacturing method, and image transmitting apparatus
JP2005072662A (ja) * 2003-08-25 2005-03-17 Sharp Corp 透光板および透光板の製造方法、並びに透光板を用いた画像入力装置
EP1569276A1 (en) 2004-02-27 2005-08-31 Heptagon OY Micro-optics on optoelectronics
US7399421B2 (en) * 2005-08-02 2008-07-15 International Business Machines Corporation Injection molded microoptics
JP2007148297A (ja) 2005-11-30 2007-06-14 Hitachi Maxell Ltd バックライト用光学シート、バックライト及び表示装置
KR100802199B1 (ko) * 2006-05-25 2008-03-17 정경희 광모듈 및 그 제조방법
EP1870936A1 (fr) * 2006-06-19 2007-12-26 STMicroelectronics (Rousset) SAS Procédé de fabrication de lentilles, notamment pour imageur intégré
US8013289B2 (en) * 2006-11-15 2011-09-06 Ether Precision, Inc. Lens array block for image capturing unit and methods of fabrication
CN101990711B (zh) * 2007-11-27 2017-05-17 新加坡恒立私人有限公司 密封的透镜叠组
TWI505703B (zh) * 2007-12-19 2015-10-21 新加坡恒立私人有限公司 光學模組,晶圓等級的封裝及其製造方法
US7920328B2 (en) * 2008-02-28 2011-04-05 Visera Technologies Company Limited Lens module and a method for fabricating the same
JP5030828B2 (ja) * 2008-03-18 2012-09-19 株式会社沖データ レンズアレイ並びにそれを有するledヘッド、露光装置、画像形成装置及び読取装置
US8194323B2 (en) * 2008-04-28 2012-06-05 Konica Minolta Opto, Inc. Method for producing wafer lens assembly and method for producing wafer lens
JP4906798B2 (ja) * 2008-07-01 2012-03-28 株式会社沖データ レンズアレイ、ledヘッド、露光装置、画像形成装置及び読取装置
JP4966931B2 (ja) * 2008-08-26 2012-07-04 シャープ株式会社 電子素子ウエハモジュールおよびその製造方法、電子素子モジュールおよびその製造方法、電子情報機器
WO2010055801A1 (ja) 2008-11-17 2010-05-20 コニカミノルタオプト株式会社 光学素子の製造方法及び光学素子
JP2010204632A (ja) 2009-02-06 2010-09-16 Fujifilm Corp ウェハレベルレンズアレイの製造方法、ウェハレンズアレイ、レンズモジュール及び撮像ユニット
WO2010139342A1 (en) * 2009-06-02 2010-12-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Lens and method for manufacturing same
CN102023330A (zh) * 2009-09-15 2011-04-20 鸿富锦精密工业(深圳)有限公司 遮光元件阵列、遮光元件阵列制造方法及镜头模组阵列
JP2011097294A (ja) 2009-10-28 2011-05-12 Olympus Corp 撮像装置および撮像装置の製造方法
US8792044B2 (en) 2009-11-05 2014-07-29 Konica Minolta Advanced Layers Inc. Image pickup device and method for manufacturing the image pickup device
JP2011104811A (ja) 2009-11-13 2011-06-02 Fujifilm Corp マスタ型、マスタの作成方法及びマスタ
KR101791493B1 (ko) * 2009-12-11 2017-10-30 후지필름 가부시키가이샤 흑색 경화성 조성물, 차광성 컬러필터, 차광막 및 그 제조 방법, 웨이퍼 레벨 렌즈, 및 고체 촬상 소자
CN102130138B (zh) * 2010-01-12 2013-01-02 中芯国际集成电路制造(上海)有限公司 图像传感器及其形成方法
US7974023B1 (en) * 2010-03-11 2011-07-05 Himax Semiconductor, Inc. Wafer level optical lens substrate, wafer level optical lens module and fabrication method thereof
TWM399313U (en) * 2010-07-30 2011-03-01 Sigurd Microelectronics Corp Proximity sensor package structure
CN103959465B (zh) * 2011-10-06 2019-06-07 新加坡恒立私人有限公司 用于物体的晶片级制造的方法以及相应的中间产品
JP2014190988A (ja) * 2013-03-26 2014-10-06 Fuji Xerox Co Ltd レンズアレイ及びレンズアレイ製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080290435A1 (en) * 2007-05-21 2008-11-27 Micron Technology, Inc. Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods
JP2011508253A (ja) 2007-12-19 2011-03-10 ヘプタゴン・オサケ・ユキチュア 光学要素の製造
JP2010204635A (ja) * 2009-02-06 2010-09-16 Fujifilm Corp レンズアレイ

Also Published As

Publication number Publication date
CN103975436B (zh) 2019-05-10
TW201310626A (zh) 2013-03-01
TW201742238A (zh) 2017-12-01
US20140347747A1 (en) 2014-11-27
CN103975436A (zh) 2014-08-06
US9610743B2 (en) 2017-04-04
US20130033767A1 (en) 2013-02-07
KR20140054081A (ko) 2014-05-08
JP2017167533A (ja) 2017-09-21
TWI647825B (zh) 2019-01-11
US8767303B2 (en) 2014-07-01
US20170235026A1 (en) 2017-08-17
JP2014521992A (ja) 2014-08-28
EP2735029B1 (en) 2022-12-21
EP2735029A1 (en) 2014-05-28
US10527762B2 (en) 2020-01-07
TWI647824B (zh) 2019-01-11
US20160031169A1 (en) 2016-02-04
WO2013010285A1 (en) 2013-01-24
TW201820597A (zh) 2018-06-01
SG10201605834YA (en) 2016-09-29
TWI635601B (zh) 2018-09-11
JP6763807B2 (ja) 2020-09-30
US9193120B2 (en) 2015-11-24

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