TWI647825B - 製造被動光學元件的方法及包含該元件的裝置 - Google Patents

製造被動光學元件的方法及包含該元件的裝置 Download PDF

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Publication number
TWI647825B
TWI647825B TW106126425A TW106126425A TWI647825B TW I647825 B TWI647825 B TW I647825B TW 106126425 A TW106126425 A TW 106126425A TW 106126425 A TW106126425 A TW 106126425A TW I647825 B TWI647825 B TW I647825B
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TW
Taiwan
Prior art keywords
light
wafer
optical
item
patent application
Prior art date
Application number
TW106126425A
Other languages
English (en)
Chinese (zh)
Other versions
TW201820597A (zh
Inventor
Hartmut Rudmann
哈馬特 盧德曼
Susanne Westenhoefer
蘇珊 威斯頓霍夫
Bojan TESANOVIC
博亞恩 泰莎諾維克
Original Assignee
Heptagon Micro Optics Pte. Ltd.
新加坡商新加坡恒立私人有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Heptagon Micro Optics Pte. Ltd., 新加坡商新加坡恒立私人有限公司 filed Critical Heptagon Micro Optics Pte. Ltd.
Publication of TW201820597A publication Critical patent/TW201820597A/zh
Application granted granted Critical
Publication of TWI647825B publication Critical patent/TWI647825B/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00365—Production of microlenses
    • B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00932—Combined cutting and grinding thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Light Receiving Elements (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Led Device Packages (AREA)
  • Optical Integrated Circuits (AREA)
TW106126425A 2011-07-19 2012-07-17 製造被動光學元件的方法及包含該元件的裝置 TWI647825B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161509357P 2011-07-19 2011-07-19
US61/509,357 2011-07-19

Publications (2)

Publication Number Publication Date
TW201820597A TW201820597A (zh) 2018-06-01
TWI647825B true TWI647825B (zh) 2019-01-11

Family

ID=46639253

Family Applications (3)

Application Number Title Priority Date Filing Date
TW106126425A TWI647825B (zh) 2011-07-19 2012-07-17 製造被動光學元件的方法及包含該元件的裝置
TW101125645A TWI635601B (zh) 2011-07-19 2012-07-17 製造被動光學元件的方法及包含該元件的裝置
TW106113502A TWI647824B (zh) 2011-07-19 2012-07-17 製造被動光學元件的方法及包含該元件的裝置

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW101125645A TWI635601B (zh) 2011-07-19 2012-07-17 製造被動光學元件的方法及包含該元件的裝置
TW106113502A TWI647824B (zh) 2011-07-19 2012-07-17 製造被動光學元件的方法及包含該元件的裝置

Country Status (8)

Country Link
US (4) US8767303B2 (enExample)
EP (1) EP2735029B1 (enExample)
JP (2) JP2014521992A (enExample)
KR (1) KR101966478B1 (enExample)
CN (1) CN103975436B (enExample)
SG (1) SG10201605834YA (enExample)
TW (3) TWI647825B (enExample)
WO (1) WO2013010285A1 (enExample)

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WO2015016772A1 (en) 2013-07-31 2015-02-05 Heptagon Micro Optics Pte. Ltd. Micro-optical orientation sensor and related methods
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US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US9829614B2 (en) 2015-02-02 2017-11-28 Synaptics Incorporated Optical sensor using collimator
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
WO2016208403A1 (ja) * 2015-06-23 2016-12-29 ソニー株式会社 イメージセンサ、および電子機器
JP2017022200A (ja) * 2015-07-08 2017-01-26 ソニーセミコンダクタソリューションズ株式会社 イメージセンサ、および電子機器
KR102439203B1 (ko) * 2015-10-07 2022-09-02 베이징 지오브이 테크놀로지 컴퍼니 리미티드 지문 감지를 위한 이미지 센서 구조체들
KR101738883B1 (ko) * 2016-01-06 2017-05-23 한국과학기술원 초박형 디지털 카메라 및 그 제조 방법
JP6740628B2 (ja) * 2016-02-12 2020-08-19 凸版印刷株式会社 固体撮像素子及びその製造方法
SG11201602031TA (en) * 2016-03-08 2017-10-30 Tnc Optics & Tech Pte Ltd A fabrication method of optical sensor cover having a lens
DE112020000917T5 (de) * 2019-02-25 2021-11-04 Ams Sensors Singapore Pte. Ltd. Herstellung von optischen diffusoren und optische diffusoren
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Also Published As

Publication number Publication date
CN103975436B (zh) 2019-05-10
TW201310626A (zh) 2013-03-01
TW201742238A (zh) 2017-12-01
US20140347747A1 (en) 2014-11-27
CN103975436A (zh) 2014-08-06
US9610743B2 (en) 2017-04-04
US20130033767A1 (en) 2013-02-07
KR101966478B1 (ko) 2019-04-05
KR20140054081A (ko) 2014-05-08
JP2017167533A (ja) 2017-09-21
US8767303B2 (en) 2014-07-01
US20170235026A1 (en) 2017-08-17
JP2014521992A (ja) 2014-08-28
EP2735029B1 (en) 2022-12-21
EP2735029A1 (en) 2014-05-28
US10527762B2 (en) 2020-01-07
TWI647824B (zh) 2019-01-11
US20160031169A1 (en) 2016-02-04
WO2013010285A1 (en) 2013-01-24
TW201820597A (zh) 2018-06-01
SG10201605834YA (en) 2016-09-29
TWI635601B (zh) 2018-09-11
JP6763807B2 (ja) 2020-09-30
US9193120B2 (en) 2015-11-24

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