JP2014509086A5 - - Google Patents

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Publication number
JP2014509086A5
JP2014509086A5 JP2013558543A JP2013558543A JP2014509086A5 JP 2014509086 A5 JP2014509086 A5 JP 2014509086A5 JP 2013558543 A JP2013558543 A JP 2013558543A JP 2013558543 A JP2013558543 A JP 2013558543A JP 2014509086 A5 JP2014509086 A5 JP 2014509086A5
Authority
JP
Japan
Prior art keywords
substrate
surface portion
light emitting
reflective coating
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013558543A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014509086A (ja
Filing date
Publication date
Priority claimed from EP11158839A external-priority patent/EP2500623A1/en
Application filed filed Critical
Publication of JP2014509086A publication Critical patent/JP2014509086A/ja
Publication of JP2014509086A5 publication Critical patent/JP2014509086A5/ja
Pending legal-status Critical Current

Links

JP2013558543A 2011-03-18 2012-03-09 発光装置のための基板に反射性被覆を供給する方法 Pending JP2014509086A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11158839A EP2500623A1 (en) 2011-03-18 2011-03-18 Method for providing a reflective coating to a substrate for a light-emitting device
EP11158839.8 2011-03-18
PCT/IB2012/051112 WO2012127349A1 (en) 2011-03-18 2012-03-09 Method for providing a reflective coating to a substrate for a light-emitting device

Publications (2)

Publication Number Publication Date
JP2014509086A JP2014509086A (ja) 2014-04-10
JP2014509086A5 true JP2014509086A5 (enExample) 2015-04-23

Family

ID=44317608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013558543A Pending JP2014509086A (ja) 2011-03-18 2012-03-09 発光装置のための基板に反射性被覆を供給する方法

Country Status (9)

Country Link
US (2) US9660147B2 (enExample)
EP (2) EP2500623A1 (enExample)
JP (1) JP2014509086A (enExample)
KR (1) KR101934891B1 (enExample)
CN (1) CN103429949B (enExample)
BR (1) BR112013023558B1 (enExample)
RU (1) RU2597253C2 (enExample)
TW (1) TWI560907B (enExample)
WO (1) WO2012127349A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9293667B2 (en) 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
KR101304715B1 (ko) * 2012-04-25 2013-09-06 주식회사 엘지씨엔에스 도광판에서의 빛 누출 방지 방법 및 그 장치와 반사재가 토출된 도광판을 가지는 디스플레이 장치
JPWO2014103326A1 (ja) * 2012-12-27 2017-01-12 コニカミノルタ株式会社 塗布液、及びその硬化物からなる反射層を備えるｌｅｄ装置
WO2015092579A1 (en) 2013-12-18 2015-06-25 Koninklijke Philips N.V. Reflective solder mask layer for led phosphor package
US20160020370A1 (en) * 2014-07-21 2016-01-21 GE Lighting Solutions, LLC Thin film with multilayer dielectric coatings for light emitting diode (led) lead frame and chip-on-board (cob) substrate reflector
TWI647191B (zh) 2015-06-11 2019-01-11 美商蘋果公司 用於電子裝置之組件之透明保護塗層
US20180255642A1 (en) * 2015-09-15 2018-09-06 Philips Lighting Holding B.V. Barrier layer delaying oxygen depletion in sealed gas-filled led lamps
CN108702844B (zh) * 2016-02-18 2021-11-26 3M创新有限公司 用于安装发光装置的多层构造
US11098218B2 (en) 2018-09-26 2021-08-24 Apple Inc. Coatings for electronic devices
DE102018129575A1 (de) * 2018-11-23 2020-05-28 Osram Opto Semiconductors Gmbh Lichtemittereinheit mit wenigstens einem VCSEL-Chip
US11837684B2 (en) * 2019-11-21 2023-12-05 Creeled, Inc. Submount structures for light emitting diode packages
EP4208671A1 (en) * 2020-09-03 2023-07-12 Signify Holding B.V. A lighting board and luminaire using the lighting board

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US4662927A (en) 1985-12-17 1987-05-05 Emhart Industries, Inc. Glass temperature preconditioning system in a distribution channel
US6885147B2 (en) * 1998-05-18 2005-04-26 Emagin Corporation Organic light emitting diode devices with improved anode stability
US6845184B1 (en) * 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
US20030236318A1 (en) 2002-04-18 2003-12-25 Kuraray Co., Ltd. Curable resin composition, method for manufacture of laminate using the composition, transfer material, method for manufacture thereof and transferred product
JP4179866B2 (ja) * 2002-12-24 2008-11-12 株式会社沖データ 半導体複合装置及びｌｅｄヘッド
US7201497B2 (en) * 2004-07-15 2007-04-10 Lumination, Llc Led lighting system with reflective board
US7285802B2 (en) 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
JP2007042668A (ja) 2005-07-29 2007-02-15 Toyoda Gosei Co Ltd Ｌｅｄ発光装置
JP2007281260A (ja) * 2006-04-07 2007-10-25 Sumitomo Metal Electronics Devices Inc リフレクターとそれを用いた発光素子収納用パッケージ及びリフレクターに用いるレンズ
US20090032829A1 (en) 2007-07-30 2009-02-05 Tong Fatt Chew LED Light Source with Increased Thermal Conductivity
TWI360238B (en) 2007-10-29 2012-03-11 Epistar Corp Photoelectric device
RU2489774C2 (ru) * 2007-11-29 2013-08-10 Нития Корпорейшн Светоизлучающее устройство и способ его изготовления
KR100979174B1 (ko) 2008-06-05 2010-08-31 (주) 아모엘이디 멀티칩 패키지 및 그의 제조방법
WO2009075530A2 (en) 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
JP5355219B2 (ja) 2008-05-21 2013-11-27 京セラ株式会社 発光素子搭載用基板および発光装置
US20100279437A1 (en) 2009-05-01 2010-11-04 Koninklijke Philips Electronics N.V. Controlling edge emission in package-free led die
WO2010035206A1 (en) 2008-09-25 2010-04-01 Koninklijke Philips Electronics N.V. Coated light emitting device and method for coating thereof
EP2228841A1 (en) * 2009-03-09 2010-09-15 Ledon Lighting Jennersdorf GmbH LED module with improved light output
JP5665285B2 (ja) 2009-06-15 2015-02-04 日立化成株式会社 光半導体素子搭載用部材及び光半導体装置
CN102473824B (zh) 2009-06-26 2015-08-05 株式会社朝日橡胶 白色反射材料及其制造方法
US8431423B2 (en) 2009-07-16 2013-04-30 Koninklijke Philips Electronics N.V. Reflective substrate for LEDS
US20110049545A1 (en) * 2009-09-02 2011-03-03 Koninklijke Philips Electronics N.V. Led package with phosphor plate and reflective substrate
US8486761B2 (en) * 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
CN203260631U (zh) 2010-07-01 2013-10-30 西铁城控股株式会社 Led光源装置
JP2012151191A (ja) * 2011-01-17 2012-08-09 Ibiden Co Ltd Ｌｅｄ用配線基板、発光モジュール、ｌｅｄ用配線基板の製造方法、及び発光モジュールの製造方法

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