JP2014509086A5 - - Google Patents
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- Publication number
- JP2014509086A5 JP2014509086A5 JP2013558543A JP2013558543A JP2014509086A5 JP 2014509086 A5 JP2014509086 A5 JP 2014509086A5 JP 2013558543 A JP2013558543 A JP 2013558543A JP 2013558543 A JP2013558543 A JP 2013558543A JP 2014509086 A5 JP2014509086 A5 JP 2014509086A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- surface portion
- light emitting
- reflective coating
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP11158839.8 | 2011-03-18 | ||
| EP11158839A EP2500623A1 (en) | 2011-03-18 | 2011-03-18 | Method for providing a reflective coating to a substrate for a light-emitting device |
| PCT/IB2012/051112 WO2012127349A1 (en) | 2011-03-18 | 2012-03-09 | Method for providing a reflective coating to a substrate for a light-emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014509086A JP2014509086A (ja) | 2014-04-10 |
| JP2014509086A5 true JP2014509086A5 (enExample) | 2015-04-23 |
Family
ID=44317608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013558543A Pending JP2014509086A (ja) | 2011-03-18 | 2012-03-09 | 発光装置のための基板に反射性被覆を供給する方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US9660147B2 (enExample) |
| EP (2) | EP2500623A1 (enExample) |
| JP (1) | JP2014509086A (enExample) |
| KR (1) | KR101934891B1 (enExample) |
| CN (1) | CN103429949B (enExample) |
| BR (1) | BR112013023558B1 (enExample) |
| RU (1) | RU2597253C2 (enExample) |
| TW (1) | TWI560907B (enExample) |
| WO (1) | WO2012127349A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9293667B2 (en) | 2010-08-19 | 2016-03-22 | Soraa, Inc. | System and method for selected pump LEDs with multiple phosphors |
| US12666769B2 (en) | 2011-06-28 | 2026-06-23 | Korrus, Inc. | System and method for selected pump LEDs with multiple phosphors |
| KR101304715B1 (ko) * | 2012-04-25 | 2013-09-06 | 주식회사 엘지씨엔에스 | 도광판에서의 빛 누출 방지 방법 및 그 장치와 반사재가 토출된 도광판을 가지는 디스플레이 장치 |
| JPWO2014103326A1 (ja) * | 2012-12-27 | 2017-01-12 | コニカミノルタ株式会社 | 塗布液、及びその硬化物からなる反射層を備えるｌｅｄ装置 |
| US10204887B2 (en) | 2013-12-18 | 2019-02-12 | Lumileds Llc | Reflective solder mask layer for LED phosphor package |
| US20160020370A1 (en) * | 2014-07-21 | 2016-01-21 | GE Lighting Solutions, LLC | Thin film with multilayer dielectric coatings for light emitting diode (led) lead frame and chip-on-board (cob) substrate reflector |
| TWI647191B (zh) | 2015-06-11 | 2019-01-11 | 美商蘋果公司 | 用於電子裝置之組件之透明保護塗層 |
| CN108029194A (zh) * | 2015-09-15 | 2018-05-11 | 飞利浦照明控股有限公司 | 在密封的充气led灯中延迟氧耗尽的阻挡层 |
| WO2017142888A1 (en) * | 2016-02-18 | 2017-08-24 | 3M Innovative Properties Company | Multilayer construction for mounting light emitting devices |
| US11098218B2 (en) | 2018-09-26 | 2021-08-24 | Apple Inc. | Coatings for electronic devices |
| DE102018129575A1 (de) * | 2018-11-23 | 2020-05-28 | Osram Opto Semiconductors Gmbh | Lichtemittereinheit mit wenigstens einem VCSEL-Chip |
| US11837684B2 (en) * | 2019-11-21 | 2023-12-05 | Creeled, Inc. | Submount structures for light emitting diode packages |
| US11873954B2 (en) * | 2020-09-03 | 2024-01-16 | Signify Holding B.V. | Lighting board and luminaire using the lighting board |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4662927A (en) | 1985-12-17 | 1987-05-05 | Emhart Industries, Inc. | Glass temperature preconditioning system in a distribution channel |
| US6885147B2 (en) * | 1998-05-18 | 2005-04-26 | Emagin Corporation | Organic light emitting diode devices with improved anode stability |
| US6845184B1 (en) * | 1998-10-09 | 2005-01-18 | Fujitsu Limited | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making |
| US20030236318A1 (en) | 2002-04-18 | 2003-12-25 | Kuraray Co., Ltd. | Curable resin composition, method for manufacture of laminate using the composition, transfer material, method for manufacture thereof and transferred product |
| JP4179866B2 (ja) | 2002-12-24 | 2008-11-12 | 株式会社沖データ | 半導体複合装置及びｌｅｄヘッド |
| US7201497B2 (en) * | 2004-07-15 | 2007-04-10 | Lumination, Llc | Led lighting system with reflective board |
| US7285802B2 (en) | 2004-12-21 | 2007-10-23 | 3M Innovative Properties Company | Illumination assembly and method of making same |
| JP2007042668A (ja) | 2005-07-29 | 2007-02-15 | Toyoda Gosei Co Ltd | Ｌｅｄ発光装置 |
| JP2007281260A (ja) * | 2006-04-07 | 2007-10-25 | Sumitomo Metal Electronics Devices Inc | リフレクターとそれを用いた発光素子収納用パッケージ及びリフレクターに用いるレンズ |
| US20090032829A1 (en) | 2007-07-30 | 2009-02-05 | Tong Fatt Chew | LED Light Source with Increased Thermal Conductivity |
| TWI360238B (en) | 2007-10-29 | 2012-03-11 | Epistar Corp | Photoelectric device |
| US9024340B2 (en) * | 2007-11-29 | 2015-05-05 | Nichia Corporation | Light emitting apparatus and method for producing the same |
| WO2009075530A2 (en) | 2007-12-13 | 2009-06-18 | Amoleds Co., Ltd. | Semiconductor and manufacturing method thereof |
| KR100979174B1 (ko) | 2008-06-05 | 2010-08-31 | (주) 아모엘이디 | 멀티칩 패키지 및 그의 제조방법 |
| JP5355219B2 (ja) | 2008-05-21 | 2013-11-27 | 京セラ株式会社 | 発光素子搭載用基板および発光装置 |
| US20100279437A1 (en) | 2009-05-01 | 2010-11-04 | Koninklijke Philips Electronics N.V. | Controlling edge emission in package-free led die |
| EP2335295B1 (en) | 2008-09-25 | 2021-01-20 | Lumileds LLC | Coated light emitting device and method of coating thereof |
| DE202009018419U1 (de) * | 2009-03-09 | 2011-08-17 | Tridonic Jennersdorf Gmbh | LED-Modul mit verbesserter Lichtleistung |
| JP5665285B2 (ja) | 2009-06-15 | 2015-02-04 | 日立化成株式会社 | 光半導体素子搭載用部材及び光半導体装置 |
| TWI477555B (zh) | 2009-06-26 | 2015-03-21 | 朝日橡膠股份有限公司 | White reflective material and its manufacturing method |
| US8431423B2 (en) | 2009-07-16 | 2013-04-30 | Koninklijke Philips Electronics N.V. | Reflective substrate for LEDS |
| US20110049545A1 (en) * | 2009-09-02 | 2011-03-03 | Koninklijke Philips Electronics N.V. | Led package with phosphor plate and reflective substrate |
| US8486761B2 (en) * | 2010-03-25 | 2013-07-16 | Koninklijke Philips Electronics N.V. | Hybrid combination of substrate and carrier mounted light emitting devices |
| JPWO2012002580A1 (ja) * | 2010-07-01 | 2013-09-02 | シチズンホールディングス株式会社 | Ｌｅｄ光源装置及びその製造方法 |
| JP2012151191A (ja) * | 2011-01-17 | 2012-08-09 | Ibiden Co Ltd | Ｌｅｄ用配線基板、発光モジュール、ｌｅｄ用配線基板の製造方法、及び発光モジュールの製造方法 |
-
2011
- 2011-03-18 EP EP11158839A patent/EP2500623A1/en not_active Withdrawn
-
2012
- 2012-03-09 US US14/002,202 patent/US9660147B2/en active Active
- 2012-03-09 RU RU2013146546/07A patent/RU2597253C2/ru active
- 2012-03-09 KR KR1020137027446A patent/KR101934891B1/ko active Active
- 2012-03-09 EP EP12710357.0A patent/EP2686604B8/en active Active
- 2012-03-09 BR BR112013023558-6A patent/BR112013023558B1/pt active IP Right Grant
- 2012-03-09 JP JP2013558543A patent/JP2014509086A/ja active Pending
- 2012-03-09 CN CN201280014057.6A patent/CN103429949B/zh active Active
- 2012-03-09 WO PCT/IB2012/051112 patent/WO2012127349A1/en not_active Ceased
- 2012-03-15 TW TW101108935A patent/TWI560907B/zh active
-
2017
- 2017-05-03 US US15/586,120 patent/US10043959B2/en active Active
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