KR101934891B1 - 발광 디바이스용 기판에 반사성 코팅을 제공하는 방법 - Google Patents

발광 디바이스용 기판에 반사성 코팅을 제공하는 방법 Download PDF

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KR101934891B1
KR101934891B1 KR1020137027446A KR20137027446A KR101934891B1 KR 101934891 B1 KR101934891 B1 KR 101934891B1 KR 1020137027446 A KR1020137027446 A KR 1020137027446A KR 20137027446 A KR20137027446 A KR 20137027446A KR 101934891 B1 KR101934891 B1 KR 101934891B1
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substrate
surface portion
reflective coating
reflective
emitting device
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KR20140013033A (ko
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헨드릭 요하네스 보데비즌 자그트
크리스천 클레이즈넨
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루미리즈 홀딩 비.브이.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
KR1020137027446A 2011-03-18 2012-03-09 발광 디바이스용 기판에 반사성 코팅을 제공하는 방법 Active KR101934891B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11158839.8 2011-03-18
EP11158839A EP2500623A1 (en) 2011-03-18 2011-03-18 Method for providing a reflective coating to a substrate for a light-emitting device
PCT/IB2012/051112 WO2012127349A1 (en) 2011-03-18 2012-03-09 Method for providing a reflective coating to a substrate for a light-emitting device

Publications (2)

Publication Number Publication Date
KR20140013033A KR20140013033A (ko) 2014-02-04
KR101934891B1 true KR101934891B1 (ko) 2019-01-04

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KR1020137027446A Active KR101934891B1 (ko) 2011-03-18 2012-03-09 발광 디바이스용 기판에 반사성 코팅을 제공하는 방법

Country Status (9)

Country Link
US (2) US9660147B2 (enExample)
EP (2) EP2500623A1 (enExample)
JP (1) JP2014509086A (enExample)
KR (1) KR101934891B1 (enExample)
CN (1) CN103429949B (enExample)
BR (1) BR112013023558B1 (enExample)
RU (1) RU2597253C2 (enExample)
TW (1) TWI560907B (enExample)
WO (1) WO2012127349A1 (enExample)

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US9293667B2 (en) 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
KR101304715B1 (ko) * 2012-04-25 2013-09-06 주식회사 엘지씨엔에스 도광판에서의 빛 누출 방지 방법 및 그 장치와 반사재가 토출된 도광판을 가지는 디스플레이 장치
JPWO2014103326A1 (ja) * 2012-12-27 2017-01-12 コニカミノルタ株式会社 塗布液、及びその硬化物からなる反射層を備えるｌｅｄ装置
KR102305948B1 (ko) * 2013-12-18 2021-09-28 루미리즈 홀딩 비.브이. Led 형광체 패키지를 위한 반사성 땜납 마스크 층
US20160020370A1 (en) * 2014-07-21 2016-01-21 GE Lighting Solutions, LLC Thin film with multilayer dielectric coatings for light emitting diode (led) lead frame and chip-on-board (cob) substrate reflector
TWI647191B (zh) 2015-06-11 2019-01-11 美商蘋果公司 用於電子裝置之組件之透明保護塗層
EP3351062A1 (en) * 2015-09-15 2018-07-25 Philips Lighting Holding B.V. Barrier layer delaying oxygen depletion in sealed gas-filled led lamps
US20210195743A1 (en) * 2016-02-18 2021-06-24 3M Innovative Properties Company Multilayer construction for mounting light emitting devices
US11098218B2 (en) 2018-09-26 2021-08-24 Apple Inc. Coatings for electronic devices
DE102018129575A1 (de) * 2018-11-23 2020-05-28 Osram Opto Semiconductors Gmbh Lichtemittereinheit mit wenigstens einem VCSEL-Chip
US11837684B2 (en) * 2019-11-21 2023-12-05 Creeled, Inc. Submount structures for light emitting diode packages
US11873954B2 (en) * 2020-09-03 2024-01-16 Signify Holding B.V. Lighting board and luminaire using the lighting board

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US20110012149A1 (en) 2009-07-16 2011-01-20 Koninklijke Philips Electronics N.V. Reflective substratefor leds
JP5665285B2 (ja) 2009-06-15 2015-02-04 日立化成株式会社 光半導体素子搭載用部材及び光半導体装置

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Also Published As

Publication number Publication date
US9660147B2 (en) 2017-05-23
US20170236987A1 (en) 2017-08-17
CN103429949A (zh) 2013-12-04
TW201244175A (en) 2012-11-01
CN103429949B (zh) 2017-07-07
RU2013146546A (ru) 2015-04-27
RU2597253C2 (ru) 2016-09-10
US20140001497A1 (en) 2014-01-02
EP2686604A1 (en) 2014-01-22
TWI560907B (en) 2016-12-01
JP2014509086A (ja) 2014-04-10
EP2686604B8 (en) 2018-08-29
BR112013023558A2 (pt) 2016-12-06
WO2012127349A1 (en) 2012-09-27
EP2686604B1 (en) 2018-02-21
KR20140013033A (ko) 2014-02-04
EP2500623A1 (en) 2012-09-19
BR112013023558B1 (pt) 2021-05-25
US10043959B2 (en) 2018-08-07

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