JP2014509086A - 発光装置のための基板に反射性被覆を供給する方法 - Google Patents

発光装置のための基板に反射性被覆を供給する方法 Download PDF

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Publication number
JP2014509086A
JP2014509086A JP2013558543A JP2013558543A JP2014509086A JP 2014509086 A JP2014509086 A JP 2014509086A JP 2013558543 A JP2013558543 A JP 2013558543A JP 2013558543 A JP2013558543 A JP 2013558543A JP 2014509086 A JP2014509086 A JP 2014509086A
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JP
Japan
Prior art keywords
substrate
reflective coating
surface portion
reflective
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013558543A
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English (en)
Japanese (ja)
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JP2014509086A5 (enExample
Inventor
ヘンドリク ヨハンネス ボウデフェイン ヤフト
クリスティアン クレエイネン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Koninklijke Philips Electronics NV
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Filing date
Publication date
Application filed by Koninklijke Philips NV, Koninklijke Philips Electronics NV filed Critical Koninklijke Philips NV
Publication of JP2014509086A publication Critical patent/JP2014509086A/ja
Publication of JP2014509086A5 publication Critical patent/JP2014509086A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
JP2013558543A 2011-03-18 2012-03-09 発光装置のための基板に反射性被覆を供給する方法 Pending JP2014509086A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11158839A EP2500623A1 (en) 2011-03-18 2011-03-18 Method for providing a reflective coating to a substrate for a light-emitting device
EP11158839.8 2011-03-18
PCT/IB2012/051112 WO2012127349A1 (en) 2011-03-18 2012-03-09 Method for providing a reflective coating to a substrate for a light-emitting device

Publications (2)

Publication Number Publication Date
JP2014509086A true JP2014509086A (ja) 2014-04-10
JP2014509086A5 JP2014509086A5 (enExample) 2015-04-23

Family

ID=44317608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013558543A Pending JP2014509086A (ja) 2011-03-18 2012-03-09 発光装置のための基板に反射性被覆を供給する方法

Country Status (9)

Country Link
US (2) US9660147B2 (enExample)
EP (2) EP2500623A1 (enExample)
JP (1) JP2014509086A (enExample)
KR (1) KR101934891B1 (enExample)
CN (1) CN103429949B (enExample)
BR (1) BR112013023558B1 (enExample)
RU (1) RU2597253C2 (enExample)
TW (1) TWI560907B (enExample)
WO (1) WO2012127349A1 (enExample)

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US9293667B2 (en) 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
KR101304715B1 (ko) * 2012-04-25 2013-09-06 주식회사 엘지씨엔에스 도광판에서의 빛 누출 방지 방법 및 그 장치와 반사재가 토출된 도광판을 가지는 디스플레이 장치
JPWO2014103326A1 (ja) * 2012-12-27 2017-01-12 コニカミノルタ株式会社 塗布液、及びその硬化物からなる反射層を備えるｌｅｄ装置
WO2015092579A1 (en) 2013-12-18 2015-06-25 Koninklijke Philips N.V. Reflective solder mask layer for led phosphor package
US20160020370A1 (en) * 2014-07-21 2016-01-21 GE Lighting Solutions, LLC Thin film with multilayer dielectric coatings for light emitting diode (led) lead frame and chip-on-board (cob) substrate reflector
TWI647191B (zh) 2015-06-11 2019-01-11 美商蘋果公司 用於電子裝置之組件之透明保護塗層
US20180255642A1 (en) * 2015-09-15 2018-09-06 Philips Lighting Holding B.V. Barrier layer delaying oxygen depletion in sealed gas-filled led lamps
CN108702844B (zh) * 2016-02-18 2021-11-26 3M创新有限公司 用于安装发光装置的多层构造
US11098218B2 (en) 2018-09-26 2021-08-24 Apple Inc. Coatings for electronic devices
DE102018129575A1 (de) * 2018-11-23 2020-05-28 Osram Opto Semiconductors Gmbh Lichtemittereinheit mit wenigstens einem VCSEL-Chip
US11837684B2 (en) * 2019-11-21 2023-12-05 Creeled, Inc. Submount structures for light emitting diode packages
EP4208671A1 (en) * 2020-09-03 2023-07-12 Signify Holding B.V. A lighting board and luminaire using the lighting board

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JP2007281260A (ja) * 2006-04-07 2007-10-25 Sumitomo Metal Electronics Devices Inc リフレクターとそれを用いた発光素子収納用パッケージ及びリフレクターに用いるレンズ
WO2009075530A2 (en) * 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
JP2009141318A (ja) * 2007-07-30 2009-06-25 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 高められた熱伝導度を有するｌｅｄ光源
WO2010150880A1 (ja) * 2009-06-26 2010-12-29 株式会社朝日ラバー 白色反射材及びその製造方法
WO2012002580A1 (ja) * 2010-07-01 2012-01-05 シチズンホールディングス株式会社 Ｌｅｄ光源装置及びその製造方法
JP2012151191A (ja) * 2011-01-17 2012-08-09 Ibiden Co Ltd Ｌｅｄ用配線基板、発光モジュール、ｌｅｄ用配線基板の製造方法、及び発光モジュールの製造方法

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JP2007281260A (ja) * 2006-04-07 2007-10-25 Sumitomo Metal Electronics Devices Inc リフレクターとそれを用いた発光素子収納用パッケージ及びリフレクターに用いるレンズ
JP2009141318A (ja) * 2007-07-30 2009-06-25 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 高められた熱伝導度を有するｌｅｄ光源
WO2009075530A2 (en) * 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
WO2010150880A1 (ja) * 2009-06-26 2010-12-29 株式会社朝日ラバー 白色反射材及びその製造方法
WO2012002580A1 (ja) * 2010-07-01 2012-01-05 シチズンホールディングス株式会社 Ｌｅｄ光源装置及びその製造方法
JP2012151191A (ja) * 2011-01-17 2012-08-09 Ibiden Co Ltd Ｌｅｄ用配線基板、発光モジュール、ｌｅｄ用配線基板の製造方法、及び発光モジュールの製造方法

Also Published As

Publication number Publication date
EP2686604B1 (en) 2018-02-21
EP2686604B8 (en) 2018-08-29
US20140001497A1 (en) 2014-01-02
WO2012127349A1 (en) 2012-09-27
US9660147B2 (en) 2017-05-23
CN103429949B (zh) 2017-07-07
BR112013023558B1 (pt) 2021-05-25
KR20140013033A (ko) 2014-02-04
CN103429949A (zh) 2013-12-04
RU2597253C2 (ru) 2016-09-10
US10043959B2 (en) 2018-08-07
BR112013023558A2 (pt) 2016-12-06
KR101934891B1 (ko) 2019-01-04
EP2686604A1 (en) 2014-01-22
EP2500623A1 (en) 2012-09-19
TWI560907B (en) 2016-12-01
US20170236987A1 (en) 2017-08-17
TW201244175A (en) 2012-11-01
RU2013146546A (ru) 2015-04-27

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