JP2013004738A5 - - Google Patents
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- Publication number
- JP2013004738A5 JP2013004738A5 JP2011134312A JP2011134312A JP2013004738A5 JP 2013004738 A5 JP2013004738 A5 JP 2013004738A5 JP 2011134312 A JP2011134312 A JP 2011134312A JP 2011134312 A JP2011134312 A JP 2011134312A JP 2013004738 A5 JP2013004738 A5 JP 2013004738A5
- Authority
- JP
- Japan
- Prior art keywords
- pad
- manufacturing
- wiring board
- solder
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 230000004907 flux Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 230000001548 androgenic effect Effects 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011134312A JP2013004738A (ja) | 2011-06-16 | 2011-06-16 | 配線基板の製造方法 |
| US13/494,744 US8580611B2 (en) | 2011-06-16 | 2012-06-12 | Method for manufacturing wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011134312A JP2013004738A (ja) | 2011-06-16 | 2011-06-16 | 配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013004738A JP2013004738A (ja) | 2013-01-07 |
| JP2013004738A5 true JP2013004738A5 (enExample) | 2014-06-26 |
Family
ID=47353978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011134312A Pending JP2013004738A (ja) | 2011-06-16 | 2011-06-16 | 配線基板の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8580611B2 (enExample) |
| JP (1) | JP2013004738A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI514530B (zh) * | 2013-08-28 | 2015-12-21 | 威盛電子股份有限公司 | 線路基板、半導體封裝結構及線路基板製程 |
| CN106571412B (zh) * | 2015-10-12 | 2018-05-01 | Lg电子株式会社 | 用于附接太阳能电池板的互连器的设备和方法 |
| CN115023804A (zh) * | 2020-01-23 | 2022-09-06 | 罗姆股份有限公司 | 电子器件和电子器件的制造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2592757B2 (ja) | 1992-10-30 | 1997-03-19 | 昭和電工株式会社 | はんだ回路基板及びその形成方法 |
| KR100642746B1 (ko) * | 2004-02-06 | 2006-11-10 | 삼성전자주식회사 | 멀티 스택 패키지의 제조방법 |
| JP4006409B2 (ja) * | 2004-03-17 | 2007-11-14 | 新光電気工業株式会社 | 配線基板の製造方法 |
| JP4839138B2 (ja) | 2006-06-20 | 2011-12-21 | 新光電気工業株式会社 | 配線基板の製造方法 |
| TWI414580B (zh) * | 2006-10-31 | 2013-11-11 | 住友電木股份有限公司 | 黏著帶及使用該黏著帶而成之半導體裝置 |
-
2011
- 2011-06-16 JP JP2011134312A patent/JP2013004738A/ja active Pending
-
2012
- 2012-06-12 US US13/494,744 patent/US8580611B2/en not_active Expired - Fee Related
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