CN115023804A - 电子器件和电子器件的制造方法 - Google Patents

电子器件和电子器件的制造方法 Download PDF

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Publication number
CN115023804A
CN115023804A CN202180010467.2A CN202180010467A CN115023804A CN 115023804 A CN115023804 A CN 115023804A CN 202180010467 A CN202180010467 A CN 202180010467A CN 115023804 A CN115023804 A CN 115023804A
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China
Prior art keywords
electronic component
electronic device
covering
mounting
element side
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CN202180010467.2A
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二村羊水
中村正彦
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Rohm Co Ltd
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Rohm Co Ltd
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Publication of CN115023804A publication Critical patent/CN115023804A/zh
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Abstract

提供一种能够抑制接合件的剥离、损坏的电子器件。该电子器件包括电子部件、装载部和接合件。所述电子部件具有在z方向上隔开间隔的元件主面和元件背面。所述装载部具有与所述元件背面相对的装载面，装载所述电子部件。所述接合件将所述电子部件接合于所述装载部。所述接合件包括基部和凸缘部。所述基部在z方向上被所述电子部件和所述装载部夹着。所述凸缘部与所述基部相连，并且在z方向上观察时形成于所述电子部件的外侧。所述电子部件包含2个元件侧面和棱。所述棱是所述2个元件侧面的交叉部分，在z方向延伸。所述凸缘部包括覆盖所述棱的至少一部分的棱覆盖部。

Description

电子器件和电子器件的制造方法
技术领域
本发明涉及电子器件和电子器件的制造方法。
背景技术
在专利文献1中公开了现有的电子器件的一个例子。专利文献1所记载的电子器件包括电子部件、引线框和接合件。在该电子器件中，电子部件是半导体元件。引线框包括装载电子部件的装载部。装载部是被称为焊岛或裸片焊盘的部位。接合件将电子部件接合于装载部。接合件例如采用银膏。
现有技术文献
专利文献
专利文献1：日本特开2000-277679号公报。
发明内容
发明要解决的问题
在上述电子器件中，通过向电子部件通电，会使电子部件发热。由于该发热，由电子部件与装载部(引线框)的线膨胀系数之差引起的热应力会施加于接合件。其结果是，有时接合件从装载部剥离，或者接合件损坏(例如龟裂的产生等)。该剥离、损坏会导致电子器件中的导通性的降低和散热性的降低。
本发明是鉴于上述情况而完成的，其目的在于提供一种能够抑制接合件的剥离、损坏的电子器件。另外，提供一种能够抑制接合件的剥离、损坏的电子器件的制造方法。
用于解决问题的技术手段
由本发明的第1方面提供的电子器件包括：电子部件，其具有在厚度方向上隔开间隔的元件主面和元件背面；装载部，其具有与所述元件背面相对的装载面，装载所述电子部件；和接合件，其将所述电子部件接合于所述装载部，所述接合件包括：基部，其在所述厚度方向上被所述电子部件和所述装载部夹着；和凸缘部，其与所述基部相连，并且在所述厚度方向上观察时形成于所述电子部件的外侧，所述电子部件包括：分别与所述元件主面和所述元件背面相连的第1元件侧面和第2元件侧面；以及棱，其为所述第1元件侧面与所述第2元件侧面的交叉部分，且在所述厚度方向上延伸，所述凸缘部包括覆盖所述棱的至少一部分的棱覆盖部。
由本发明的第2方面提供的电子器件的制造方法，其中，所述电子器件包括：电子部件，其具有在厚度方向上隔开间隔的元件主面和元件背面；装载部，其具有与所述元件背面相对的装载面，装载所述电子部件；和接合件，其将所述电子部件接合于所述装载部，所述电子器件的制造方法包括：在所述装载面上涂敷膏状接合材的涂敷工序；在所述膏状接合材上载置所述电子部件的载置工序；和使所述膏状接合材固化而形成所述接合件的固化工序，所述装载部包括与所述电子部件接合的接合区域，所述接合区域包括在所述厚度方向上观察时与所述电子部件的角重叠的角部，所述膏状接合材在所述厚度方向上观察时从所述电子部件的中央部向所述角部至少涂敷至所述角部。
发明效果
根据本发明的电子器件，例如，能够抑制接合件的剥离、损坏。另外，根据本发明的电子器件的制造方法，例如能够制造抑制了接合件的剥离、损坏的电子器件。
附图说明
图1是表示一个实施方式的电子器件的俯视图。
图2是在图1中用假想线表示树脂部件2的图。
图3是表示一个实施方式的电子器件的仰视图。
图4是表示一个实施方式的电子器件的主视图。
图5是表示一个实施方式的电子器件的侧视图(左侧视图)。
图6是沿着图2的VI-VI线的截面图。
图7是沿着图2的VII-VII线的截面图。
图8是沿着图2的VIII-VIII线的截面图。
图9是表示由接合件形成的接合结构的立体图。
图10是表示由接合件形成的接合结构的俯视图。
图11是表示由接合件形成的接合结构的侧视图。
图12是表示电子器件的制造方法的一个工序(涂敷工序)的俯视图。
图13是表示电子器件的制造方法的一个工序(涂敷工序)的侧视图。
图14是表示电子器件的制造方法的一个工序(载置工序)的俯视图。
图15是表示电子器件的制造方法的一个工序(载置工序)的侧视图。
图16是表示变形例的涂敷工序的俯视图。
图17是表示变形例的侧方覆盖部(凸缘部)的立体图。
图18是表示图17的侧方覆盖部(凸缘部)的侧视图。
图19是表示变形例的侧方覆盖部(凸缘部)的立体图。
图20是表示图19的侧方覆盖部(凸缘部)的侧视图。
图21是表示变形例的侧方覆盖部(凸缘部)的俯视图。
具体实施方式
在下文中，参照附图描述本发明的实施方式的电子器件和电子器件的制造方法的优选实施例。
图1～图11表示了一个实施方式的电子器件A1。电子器件A1例如是被称为QFN(Quad Flat Non-leaded package：四方扁平无引脚封装)的封装结构。电子器件A1安装于电子设备等的电路板。电子器件A1例如俯视为矩形形状。电子器件A1包括电子部件1、树脂部件2、引线框3、接合件4和多个连接部件5。
图1是表示电子器件A1的俯视图。图2是在图1中用假想线表示树脂部件2的图。图3是表示电子器件A1的仰视图。图4是表示电子器件A1的主视图。图5是表示电子器件A1的侧视图(左侧视图)。图6是沿着图2的VI-VI线的截面图。图7是沿着图2的VII-VII线的截面图。图8是沿着图2的VIII-VIII线的截面图。图9是表示由接合件4形成的接合结构的主要部分放大立体图。图10是表示由接合件4形成的接合结构的主要部分放大俯视图。图11是表示由接合件4形成的接合结构的主要部分放大侧视图。为了便于理解，在图9～图11中，图示了电子部件1、引线框3的一部分(后述的第1引线31)和接合件4。
为了便于说明，将相互正交的3个方向定义为x方向、y方向、z方向。z方向是电子器件A1的厚度方向。x方向是电子器件A1的俯视图(参照图1)中的左右方向。y方向是电子器件A1的俯视图(参照图1)中的上下方向。将x方向的一方设为x1方向，将x方向的另一方设为x2方向。同样地，将y方向的一方设为y1方向，将y方向的另一方设为y2方向，将z方向的一方设为z1方向，将z方向的另一方设为z2方向。在以下的说明中，“俯视”是指在z方向上观察。z方向也称为“厚度方向”。另外，x方向是“第1方向”的一例，y方向是“第2方向”的一例。
电子部件1是发挥电子器件A1的电气功能的要素。电子部件1例如是集成电路元件、主动功能元件或者被动功能元件等。电子部件1例如是由半导体材料形成的半导体元件。作为半导体材料，有Si(硅)、SiC(碳化硅)、Ge(锗)、GaAs(砷化镓)和GaN(氮化镓)等。在本实施方式中，电子部件1由硅形成。电子部件1在俯视时例如为矩形形状。
如图2和图6～图11所示，电子部件1具有元件主面11、元件背面12和多个元件侧面131～134。元件主面11和元件背面12在z方向上隔开间隔。元件主面11朝向z2方向，元件背面12朝向z1方向。元件背面12与引线框3相对。在元件主面11形成有多个主面电极111。多个主面电极111分别在元件主面11露出。在元件背面12形成有背面电极121。背面电极121在元件背面12露出。背面电极121遍及元件背面12的大致整个面而形成。主面电极111和背面电极121各自的数量、配置、形状和俯视尺寸不限于图2和图6～图8所示的例子，可以根据所使用的电子部件1适当变更。多个元件侧面131～134分别在z方向上被元件主面11和元件背面12夹着，并且与元件主面11和元件背面12两者相连。各元件侧面131～134从元件背面12立起，在本实施方式中直立。如图6、图7和图9等所示，元件侧面131、133在x方向上隔开间隔。元件侧面131朝向x1方向，元件侧面133朝向x2方向。元件侧面132、134在y方向上隔开间隔。元件侧面132朝向y1方向，元件侧面134朝向y2方向。多个元件侧面131～134分别是“第1元件侧面”、“第2元件侧面”、“第3元件侧面”和“第4元件侧面”的一例。
如图2和图8～图11所示，电子部件1具有多个棱141～144。棱141是元件侧面131与元件侧面132的交叉部分。棱142是元件侧面132与元件侧面133的交叉部分。棱143是元件侧面133与元件侧面134的交叉部分。棱144是元件侧面134与元件侧面131的交叉部分。各棱141～144在z方向延伸。多个棱141～144与俯视时的电子部件1的四角对应。棱141是“棱”的一例，各棱142～144是“追加的棱”的一例。
树脂部件2是保护电子部件1的密封材料。树脂部件2由绝缘性的树脂材料构成。作为该树脂材料，例如采用黑色的环氧树脂。树脂部件2覆盖电子部件1、引线框3的一部分和多个连接部件5。树脂部件2在俯视时为矩形形状。
树脂部件2具有树脂主面21、树脂背面22和多个树脂侧面231～234。如图4～图8所示，树脂主面21和树脂背面22在z方向上隔开间隔。树脂主面21朝向z2方向，树脂背面22朝向z1方向。多个树脂侧面231～234分别在z方向上被树脂主面21和树脂背面22夹着，且与树脂主面21和树脂背面22两者相连。各树脂侧面231～234从树脂背面22立起，在本实施方式中直立。如图1～图4所示，树脂侧面231、233在x方向上隔开间隔。树脂侧面231朝向x1方向，树脂侧面233朝向x2方向。如图1～图3和图5所示，树脂侧面232、234在y方向上隔开间隔。树脂侧面232朝向y1方向，树脂侧面234朝向y2方向。
引线框3支承电子部件1，并且与电子部件1导通。引线框3的一部分从树脂部件2露出，该露出的部分是电子器件A1中的外部端子。引线框3例如由金属构成。作为该金属，例如采用Cu(铜)、Cu合金、镍、镍合金或者42合金等。在本实施方式中，引线框3由Cu构成。引线框3例如通过对金属板实施蚀刻加工而形成。引线框3也可以不通过蚀刻加工而通过对金属板实施冲孔加工、弯折加工等机械加工来形成。引线框3包括第1引线31和多个第2引线32。
如图1～图3所示，第1引线31在俯视观察时被配置在电子器件A1的中央处，并扩展至电子器件A1的x方向和y方向的两端部。如图1～图3和图6～图8所示，第1引线31包括装载部311、多个端子部312和连结部313。
如图2、图6～图8和图9所示，装载部311装载电子部件1。如图2和图10所示，装载部311在俯视时例如为矩形形状。俯视时的装载部311的各边与x方向或y方向大致平行。
如图6～图8等所示，装载部311具有装载面311a和背面311b。装载面311a和背面311b在z方向上隔开间隔。装载面311a朝向z2方向，背面311b朝向z1方向。装载面311a与电子部件1(元件背面12)相对。电子部件1装载于装载面311a上。也可以对装载面311a实施镀敷。该镀敷的材料可根据接合件4的材料而适当选定。例如，在引线框3为Cu，接合件4为焊料的情况下，通过对装载面311a实施镀Ag或镀Ni，能够提高焊料(接合件4)的润湿性。如图2和图6～图8所示，背面311b从树脂背面22露出，成为电子器件A1中的外部端子。如图6～图8所示，背面311b与树脂背面22齐平。
如图1和图2所示，多个端子部312在俯视时在电子器件A1的4个角分别各配置有1个。各端子部312在俯视时例如为矩形形状。
如图3～图5和图8所示，各端子部312具有主面312a、背面312b和2个端面312c。在各端子部312中，主面312a和背面312b在z方向上隔开间隔。主面312a朝向z2方向，背面312b朝向z1方向。如图8所示，主面312a与装载面311a齐平。如图3和图8所示，背面312b从树脂背面22露出。2个端面312c分别与主面312a和背面312b相连，与主面312a和背面312b正交。2个端面312c分别从多个树脂侧面231～234中的任一个露出。2个端面312c的一方朝向x方向外侧，2个端面312c的另一方朝向y方向外侧。背面312b和2个端面312c是电子器件A1中的外部端子。
如图1、图2和图8所示，多个连结部313分别与装载部311和各端子部312相连。如图1和图2所示，各连结部313在俯视时从装载部311的4个角分别呈放射状延伸，并与各端子部312相连。连结部313的厚度(z方向的尺寸)例如为装载部311的厚度的一半左右。连结部313例如通过半蚀刻处理而形成。
如图8所示，各连结部313具有主面313a和背面313b。在各连结部313中，主面313a和背面313b在z方向上隔开间隔。主面313a朝向z2方向，背面313b朝向z1方向。如图8所示，主面313a与装载面311a和主面312a齐平。主面313a和背面313b被树脂部件2覆盖。
在第1引线31中，在从树脂部件2露出的部分形成有未图示的镀层。在电子器件A1中，该镀层形成于背面311b、背面312b和各端面312c。该镀层由焊料润湿性比第1引线31的母材高的材料构成，例如由Au构成。该镀层例如通过置换型的无电解镀敷形成。其中，该镀层也可以不形成。
如图2所示，多个第2引线32分别经由各连接部件5与电子部件1的主面电极111导通。如图1～图3所示，多个第2引线32在俯视时分别配置于电子器件A1的x方向的两端部和y方向的两端部，并相互隔开间隔。多个第2引线32与第1引线31隔开间隔。电子器件A1在俯视观察时包括沿着树脂侧面231配置的多个第2引线32、沿着树脂侧面232配置的多个第2引线32、沿着树脂侧面233配置的多个第2引线32和沿着树脂侧面234配置的多个第2引线32。沿着树脂侧面231配置的多个第2引线32和沿着树脂侧面233配置的多个第2引线32分别配置于在y方向上相邻的2个端子部312之间。沿着树脂侧面232配置的多个第2引线32和沿着树脂侧面234配置的多个第2引线32分别配置于在x方向上相邻的2个端子部312之间。各第2引线32包括端子部321和连接部322。
如图2所示，多个端子部321分别在俯视时例如为矩形形状。各端子部321的一部分从树脂部件2露出。
如图2～图6所示，各端子部321具有主面321a、背面321b和端面321c。在各端子部321中，主面321a和背面321b在z方向上隔开间隔。主面321a朝向z2方向，背面321b朝向z1方向。背面321b从树脂背面22露出。端面321c与主面321a和背面321b相连。端面321c从多个树脂侧面231～234中的任一个露出。背面321b和端面321c是电子器件A1中的外部端子。
如图2所示，多个连接部322分别从端子部321朝向装载部311延伸。在各连接部322分别接合有各连接部件5。与装载部311的y方向的两侧的端缘平行地排列的多个第2引线32越是配置在x方向的两端侧，连接部322越相对于y方向倾斜。另外，与装载部311的x方向的两侧的端缘平行地排列的多个第2引线32越是配置于y方向的两端侧，连接部322越相对于x方向倾斜。这是为了使电子部件1的各主面电极111与各第2引线32的端子部321容易通过连接部件5连接。在x方向和y方向的各个方向上，配置于最靠两端侧的(与连结部313相邻的)第2引线32的连接部322与相邻的连结部313的延伸方向大致平行地延伸。另外，各连接部322也可以不相对于x方向或y方向倾斜。
在各第2引线32中，如图6所示，连接部322的厚度(z方向的尺寸)例如为端子部321的厚度的一半左右。连接部322例如通过半蚀刻处理而形成。各连接部322具有主面322a和背面322b。主面322a和背面322b在z方向上隔开间隔。主面322a朝向z2方向，背面322b朝向z1方向。主面322a是与连接部件5接合的面。主表面321a和主表面322a彼此齐平。背面322b被树脂部件2覆盖。此外，连接部322的厚度也可以与端子部321的厚度相同。在该情况下，背面321b与背面322b相互成为同一平面，背面322b从树脂部件2(树脂背面22)露出。
在各第2引线32中，在从树脂部件2露出的部分形成有未图示的镀层。在电子器件A1中，该镀层形成于背面321b和端面321c。该镀层与第1引线31的镀层相同，例如由Au构成，通过置换型的无电解镀敷而形成。其中，该镀层也可以不形成。
接合件4将电子部件1接合于引线框3。接合件4例如是烧结银。接合件4不限于烧结银，也可以是烧结铜等其他烧结金属，还可以是焊料或银膏等其他导电性接合件。另外，接合件4不限于导电性接合件，也可以是绝缘性接合件。但是，在接合件4为绝缘性接合件的情况下，仅限于在电子部件1未设置背面电极121的情况、或者不需要电子部件1的背面电极121与装载部311的经由接合件4的导通的情况。接合件4介于电子部件1与装载部311(第1引线31)之间。接合件4与元件背面12和装载面311a接触。背面电极121与装载部311经由接合件4导通。接合件4包括基部41和凸缘部42。
如图9所示，基部41在z方向上被电子部件1和装载部311夹着。基部41在俯视时与电子部件1完全重叠。基部41与元件背面12的整个面接触。基部41在俯视时例如为矩形形状。基部41为大致均等的厚度(z方向的尺寸)。
如图9和图11所示，凸缘部42与基部41相连，并且在俯视时形成于电子部件1的外侧。如图10所示，凸缘部42在俯视时遍及电子部件1的整周而形成。如图9和图11所示，凸缘部42从基部41沿着各元件侧面131～134向z方向上方突出。凸缘部42包括多个侧方覆盖部431～434和多个棱覆盖部441～444。在本实施方式中，棱覆盖部441是“棱覆盖部”的一例，各棱覆盖部442～444是“追加的棱覆盖部”的一例。另外，侧方覆盖部431是“第1覆盖部”的一例，侧方覆盖部432是“第2覆盖部”的一例。
如图8～图11所示，棱覆盖部441覆盖棱141的至少一部分。在本实施方式中，棱覆盖部441覆盖棱141的z方向下方侧的端部，不覆盖棱141的z方向上方侧的端部。如图10所示，棱覆盖部441连接侧方覆盖部431和侧方覆盖部432。
如图9和图10所示，棱覆盖部442覆盖棱142的至少一部分。在本实施方式中，棱覆盖部442覆盖棱142的z方向下方侧的端部，不覆盖棱142的z方向上方侧的端部。如图10所示，棱覆盖部442连接侧方覆盖部432和侧方覆盖部433。
如图10所示，棱覆盖部443覆盖棱143的至少一部分。在本实施方式中，棱覆盖部443覆盖棱143的z方向下方侧的端部，不覆盖棱143的z方向上方侧的端部。如图10所示，棱覆盖部443连接侧方覆盖部433和侧方覆盖部434。
如图9和图10所示，棱覆盖部444覆盖棱144的至少一部分。在本实施方式中，棱覆盖部444覆盖棱144的z方向下方侧的端部，不覆盖棱144的z方向上方侧的端部。如图10所示，棱覆盖部444连接侧方覆盖部434和侧方覆盖部431。
如图9～图11所示，侧方覆盖部431覆盖元件侧面131的至少一部分。在元件侧面131中，从x方向观察，z2方向侧的端缘即元件主面11侧的端缘从侧方覆盖部431露出，从x方向观察，z1方向侧的端缘即元件背面12侧的端缘被侧方覆盖部431覆盖。如图10所示，侧方覆盖部431被棱覆盖部444和棱覆盖部441夹着，并与它们相连。如图10所示，侧方覆盖部431与棱覆盖部444及棱覆盖部441在y方向上排列。
如图9和图10所示，侧方覆盖部432覆盖元件侧面132的至少一部分。在元件侧面132中，从y方向观察，z2方向侧的端缘即元件主面11侧的端缘从侧方覆盖部432露出，从y方向观察，z1方向侧的端缘即元件背面12侧的端缘被侧方覆盖部432覆盖。如图10所示，侧方覆盖部432被棱覆盖部441和棱覆盖部442夹着，并与它们相连。如图10所示，侧方覆盖部432与棱覆盖部441及棱覆盖部442在x方向上排列。
如图10所示，侧方覆盖部433覆盖元件侧面133的至少一部分。在元件侧面133中，从x方向观察，z2方向侧的端缘即元件主面11侧的端缘从侧方覆盖部433露出，从x方向观察，z1方向侧的端缘即元件背面12侧的端缘被侧方覆盖部433覆盖。如图10所示，侧方覆盖部433被棱覆盖部442和棱覆盖部443夹着，并与它们相连。如图10所示，侧方覆盖部433与棱覆盖部442及棱覆盖部443在y方向上排列。
如图10所示，侧方覆盖部434覆盖元件侧面134的至少一部分。在元件侧面134中，从y方向观察，z2方向侧的端缘即元件主面11侧的端缘从侧方覆盖部434露出，从y方向观察，z1方向侧的端缘即元件背面12侧的端缘被侧方覆盖部434覆盖。如图10所示，侧方覆盖部434被棱覆盖部443和棱覆盖部444夹着，并与它们相连。如图10所示，侧方覆盖部434与棱覆盖部443及棱覆盖部444在x方向上排列。
如图9和图11所示，各侧方覆盖部431～434的各长度方向上的中央部比各长度方向上的两端缘部更向z1方向凹陷。因此，在各侧方覆盖部431～434中，各长度方向上的中央部的z方向的尺寸d11比各长度方向上的各端缘部的z方向的尺寸d12小。在图11中表示侧方覆盖部431的各尺寸d11、d12。另外，各侧方覆盖部431～434在各长度方向上的中央部与各长度方向上的各端缘部之间分别形成有隆起部439。隆起部439向z2方向即元件主面11侧隆起。隆起部439在各侧方覆盖部431～434中，各侧方覆盖部431～434中z方向的尺寸最大。在图11中表示侧方覆盖部431中的隆起部439。各侧方覆盖部431、433的长度方向为y方向，各侧方覆盖部432、434的长度方向为x方向。另外，各侧方覆盖部431～434的各尺寸d11、d12在多个侧方覆盖部431～434中可以分别相同，也可以存在差异。
如图10所示，各侧方覆盖部431～434在俯视时，各长度方向上的中央部比各长度方向上的两端缘部更向各元件侧面131～134侧凹陷。
如图6和图7所示，在各侧方覆盖部431～434中，倾斜度α11(参照图7)比倾斜度α12(参照图6)大。如图7所示，倾斜度α11是装载面311a与各侧方覆盖部431～434的各长度方向上的各端缘部所成的角度，是该端缘部的表面相对于装载面311a的倾斜程度。如图6所示，倾斜度α12是装载面311a与各侧方覆盖部431～434的各长度方向上的中央部所成的角度，是该中央部的表面相对于装载面311a的倾斜程度。各侧方覆盖部431～434在各长度方向上随着从中央部朝向各端缘部而从倾斜度α12逐渐变化为倾斜度α11。此外，倾斜度α11可以与倾斜度α12相同，也可以比倾斜度α12小。
各侧方覆盖部431、433在图6和图7所示的例子中，从y方向观察，其表面弯曲成凸状，但并不限定于此，既可以是平坦的面，也可以弯曲成凹状。或者，弯曲成凸状的部分、弯曲成凹状的部分和平坦的部分的2个以上也可以混合存在。同样地，各侧方覆盖部432、434在x方向上观察，其表面弯曲成凸状，但并不限定于此，既可以是平坦的面，也可以弯曲成凹状。或者，弯曲成凸状的部分、弯曲成凹状的部分和平坦的部分的2个以上也可以混合存在。
多个连接部件5使相互隔开间隔的2个部位间导通。各连接部件5例如是焊丝。各连接部件5也可以不是焊丝(bonding wire)，而是焊接带(bonding ribbon)、板状的引线部件等。多个连接部件5的各构成材料例如可以是包含Au的金属、包含Al的金属或包含Cu的金属等中的任一种。各连接部件5例如由公知的引线接合件(wire bonder)形成。如图2所示，各连接部件5分别与电子部件1的主面电极111和各第2引线32的连接部322(主面322a)接合，使主面电极111和第2引线32导通。
接着，参照图12～图15对电子器件A1的制造方法进行说明。图12和图14是表示电子器件A1的制造方法的一个工序的主要部分放大俯视图。图13和图15为表示电子器件A1的制造方法的一个工序的主要部分放大侧视图。
首先，准备引线框3。具体而言，对含有Cu的金属板实施蚀刻加工，形成多个引线框3。各引线框3包括第1引线31和多个第2引线32。第1引线31包括装载部311、多个端子部312和多个连结部313。装载部311具有朝向z2方向的装载面311a。各第2引线32包括端子部321和连接部322。在准备引线框3的工序(准备工序)中，所形成的多个引线框3相互连续。
接着，如图12和图13所示，在装载部311的装载面311a上涂敷膏状接合材49。膏状接合材49例如是烧结型的金属膏(银膏或者铜膏等)。在涂敷膏状接合材49的工序(涂敷工序)中，例如使用分配器。如图12和图13所示，装载面311a包括接合电子部件1的接合区域391。接合区域391是装载面311a中的、在接合有电子部件1的状态下在俯视时与电子部件1的全部重叠的区域。因此，在俯视时，接合区域391与电子部件1为大致相同形状(在本实施方式中为矩形形状)，且与电子部件1为相同大小。接合区域391包括4个角部392。4个角部392是在接合有电子部件1的状态下俯视时与电子部件1的四角重叠的部分。在涂敷工序中，例如沿着图12所示的轨道L1、L2呈直线状地涂敷膏状接合材49。轨道L1、L2分别是使用分配器涂敷的膏状接合材49的涂敷轨道。轨道L1、L2分别是从位于接合区域391的对角线上的一对角部392的一个至另一个且通过中心393的直线状。在图12所示的例子中，各轨道L1、L2的起点和终点与各角部392重叠，但也可以设定在比各角部392靠接合区域391的俯视外侧的位置。膏状接合材49的涂敷轨道并不限定于此。例如，在俯视时，也可以从接合区域391的中心393到4个角部392的每一个呈辐射状地涂敷膏状接合材49。
如图12和图13所示，所涂敷的膏状接合材49完全覆盖4个角部392的全部，并且在俯视时形成为X字状。在本实施方式中，涂敷膏状接合材49的轨道L1、L2以角部392为起点和终点，因此所涂敷的膏状接合材49形成到比该角部392靠接合区域391的外侧的位置。另外，如图13所示，从侧方(x方向或y方向)观察，在膏状接合材49上形成有突出部491。突出部491是膏状接合材49中的在z2方向上隆起的部分，形成在接合区域391的中心393上。突出部491是由于在沿着轨道L1、L2涂敷膏状接合材49时，2个轨道L1、L2交叉而形成的。所涂敷的膏状接合材49的线宽W1(参照图12)例如为200μm以上且300μm以下，厚度(z方向的尺寸)例如为100μm以上且150μm以下(突出部491除外)。此外，从各轨道L1、L2的行进方向观察，膏状接合材49弯曲成半圆状，上述厚度是最大部分(除了突出部491)的大小。
接着，如图14和图15所示，在膏状接合材49上载置电子部件1。在载置电子部件1的工序(载置工序)中，例如使用公知的裸片贴装机(die bonder)。当通过载置工序将电子部件1载置于膏状接合材49上时，由于电子部件1的重量，膏状接合材49被推开。另外，膏状接合材49不仅可以通过电子部件1的重量，还可以通过利用裸片贴装机按压电子部件1时的按压力而扩张。如图14和图15所示，扩张后的膏状接合材49成为覆盖接合区域391的整个区域且遍及接合区域391的整周向外方突出的形状。此时，膏状接合材49成为与上述接合件4大致相同的形状。
接着，使膏状接合材49固化，形成接合件4。在本实施方式中，由于使用烧结型的金属膏作为膏状接合材49，所以在使膏状接合材49固化的工序(固化工序)中，通过烧结使膏状接合材49固化。通过该烧结，膏状接合材49中的溶剂挥发、消失，并且膏状接合材49中的金属颗粒(银颗粒或铜颗粒等)彼此结合，从而膏状接合材49固化，形成接合件4。固化工序根据膏状接合材49的原材料而适当变更。例如，在膏状接合材49为热固化型的金属膏的情况下，在固化工序中，对膏状接合材49进行加热。通过该加热，金属膏中的树脂材料固化，从而膏状接合材49固化，形成接合件4。本发明中，“金属膏”是指例如由金属的微粒、环氧树脂等微粒(粘合剂)和溶剂形成的导电材料。
接着，形成多个连接部件5。多个连接部件5分别例如通过公知的引线接合器形成。各连接部件5的一端与电子部件1的主面电极111接合，另一端与各第2引线32的连接部322(主面322a)接合。
接着，形成树脂部件2。在形成树脂部件2的工序(树脂形成工序)中，例如使用公知的转移成形机或压缩成形机。作为树脂部件2，例如使用绝缘性的环氧树脂。引线框3从所形成的树脂部件2部分地露出。
之后，对每个电子部件1切断树脂部件2和引线框3，进行单片化。通过以上的工序，形成电子器件A1。此外，上述的制造方法是一个例子，并不限定于此。
电子器件A1和电子器件A1的制造方法的作用和效果如下。
在电子器件A1中，将电子部件1接合于引线框3的接合件4包括凸缘部42。凸缘部42包括覆盖棱141的至少一部分的棱覆盖部441。棱141是元件侧面131与元件侧面132的交叉部分，相当于俯视时的电子部件1的四角之一。根据该结构，电子部件1的棱141(电子部件1的下方角部)被接合件4(凸缘部42的棱覆盖部441)保护。由于向电子部件1通电时产生的热，由电子部件1与引线框3的线膨胀系数之差引起的热应力施加于接合件4。该施加于接合件4的热应力在电子部件1的下方侧四角附近最大，所以接合件4的剥离、损坏等容易从电子部件1的棱141附近进行。特别是在现有的电子器件中，棱141从接合件4露出，在电子部件1的下方侧四角附近的接合件4的剥离、损坏等显著。因此，在电子器件A1中，通过利用棱覆盖部441保护棱141，能够提高对于棱141附近的接合件4的剥离、损坏等的耐性。因此，根据电子器件A1，能够抑制接合件4的剥离、损坏等。因此，能够提高电子器件A1的可靠性。
在电子器件A1中，接合件4的凸缘部42包括多个棱覆盖部441～444。多个棱覆盖部441～444分别覆盖电子部件1的多个棱141～144的下方侧的各端缘部分。即，电子部件1的下方侧四角被凸缘部42覆盖。根据该结构，能够提高对于电子部件1的下方侧四角附近的接合件4的剥离、损坏等的耐性。因此，根据电子器件A1，能够抑制接合件4的剥离、损坏等。
在电子器件A1中，接合件4包括基部41。基部41被电子部件1和装载部311夹着，与电子部件1完全重叠。基部41与元件背面12的整个面接触。在现有的电子器件中，在电子部件1与装载部311之间存在未填充接合件4的部分。即，在电子部件1的元件背面12存在不与接合件4接触的区域。在该区域中，在对电子部件1造成微小的损伤(例如，存在于元件背面12的端缘的碎屑等)的情况下，有时以该损伤为起点，电子部件1的破坏(龟裂等)在电子部件1的内部发展。另一方面，在电子器件A1中，由于元件背面12的整个面与接合件4(基部41)接触，所以元件背面12被接合件4(基部41)保护。因此，根据电子器件A1，即使在电子部件1的元件背面12产生微小的损伤，也能够抑制以该损伤为起点的电子部件1的破坏的进行。
在电子器件A1中，接合件4例如由烧结银构成。烧结银与焊料相比延展性低。因此，在接合件4由烧结银构成的情况下，与接合件4由焊料构成的情况相比，施加于接合件4的热应力变大。这是因为，焊料由于其延展性，与烧结银相比能够缓和热应力。即，在接合件4由烧结银构成的情况下，与接合件4由焊料构成的情况相比，容易产生由热应力引起的接合件4的剥离、破坏。因此，在接合件4由烧结银构成的情况下，如上述那样利用凸缘部42(棱覆盖部441)保护棱141，与接合件4由焊料构成的情况相比，在抑制接合件4的剥离、破坏方面是有效的。
在电子器件A1中，电子部件1例如是由硅形成的半导体元件，引线框3例如由Cu形成。在该情况下，由于硅与Cu的线膨胀系数之差较大，所以施加于接合件4的热应力变大。即，容易产生由热应力引起的接合件4的剥离、损坏。因此，在使用接合件4将由硅构成的电子部件1与由Cu构成的装载部311(引线框3)接合的情况下，如上述那样利用凸缘部42(棱覆盖部441)保护棱141在抑制接合件4的剥离、破坏方面是有效的。
在电子器件A1的制造方法中，在涂敷工序中，通过将膏状接合材49涂敷至接合区域391的各角部392，从而利用膏状接合材49覆盖接合区域391的四角。由此，在通过载置工序将电子部件1载置于膏状接合材49时，膏状接合材49以分别覆盖电子部件1的各棱141～144的至少一部分的方式扩展。即，在接合件4上形成有包括棱覆盖部441的凸缘部42。因此，根据本发明的制造方法，能够制造抑制了接合件4的剥离、破坏的电子器件A1。
在电子器件A1的制造方法中，在涂敷工序中，膏状接合材49在俯视观察时被涂敷为X字状。在与本实施方式不同的涂敷工序中，考虑通过在接合区域391的整个面或比整个面大的范围涂敷膏状接合材49，形成包括各棱覆盖部441～444的凸缘部42。然而，在该情况下，如果通过载置工序载置电子部件1，则膏状接合材49在俯视时可能向电子部件1的外侧较大地扩展。在该情况下，膏状接合材49会流出到意料之外的场所，例如有可能发生意料之外的短路。意料外的短路包括电子部件1的主面电极111彼此的短路。另外，由于浪费地扩展的部分的材料费，有可能导致成本增大。因此，在本发明的制造方法中，通过将膏状接合材49涂敷成X字状，能够形成包括各棱覆盖部441～444的凸缘部42，并且能够抑制上述的意料外的短路的发生和成本增大。
在上述实施方式的涂敷工序中，表示了将膏状接合材49沿着轨道L1、L2涂敷成直线状的情况，但并不限定于此。例如，如图16所示，也可以将点状的多个膏状接合材49涂敷成X字状。为了便于理解，在图16中，用假想线表示上述实施方式中的膏状接合材49(参照图12)。各膏状接合材49例如为半球体状。在该情况下，也形成与图9～图11同样的接合件4。作为膏状接合材49的其他涂敷方式，第一，有在具有大型的矩形的平面形状(典型的是大型的正方形)的电子部件1中使用的“*(星号)”字状、“※(米号)”状的方式。“※”状是指由配置成“X”字状的4条线段和在该4条线段中在x方向或y方向上分别相邻的2条线段之间分别配置的4个“·(点)”形成的形状。第二，具有在横长的矩形的电子部件1中使用的、沿着长边方向以“＞”、“－”、“＜”的顺序相接或者接近地排列的形状的方式。
在电子器件A1中，各侧方覆盖部431～434的形状并不限定于上述形状。例如，如图17和图18所示，也可以不在各侧方覆盖部431～434形成隆起部439(参照图11)。另外，例如如图19和图20所示，各侧方覆盖部431～434也可以是，各长度方向上的中央部比各长度方向上的两端缘部向z1方向凹陷，尺寸d11与尺寸d12大致相同。并且，例如如图21所示，各侧方覆盖部431～434在俯视时，各长度方向上的中央部也可以不比各长度方向上的两端缘部向各元件侧面131～134侧凹陷。或者，也可以是，在俯视时，各长边方向上的中央部比各长边方向上的两端缘部向与各元件侧面131～134相反的一侧突出。这些变形例的各侧方覆盖部431～434通过适当调整涂敷工序中的膏状接合材49的涂敷量、涂敷轨道和线宽W1、载置工序中的膏状接合材49的扩展方式、膏状接合材49相对于装载部311(引线框3)的润湿性等而形成。
在上述实施方式中，表示了电子器件A1为QFN型的封装结构的情况，但并不限定于此。例如，也可以是TO(Transistor Outline：晶体管外形)封装型、SOP(Small OutlinePackage：小引出线封装)型、QFP(Quad Flat Package：四边扁平封装)型、BGA(Ball GridArray：球栅阵列)型等其他封装结构。此时，根据这些封装结构，适当变更引线框3的形状。
在上述实施方式中，表示了电子器件A1为引线框型的情况，但并不限定于此。例如，也可以是内插器型。即，电子部件1也可以是代替引线框3而与例如硅基板、陶瓷基板或者玻璃基板等接合的结构。此外，在经由接合件4将电子部件1接合于某个支承部件(装载部)的结构中，能够应用本发明的结构。
本发明的实施方式的电子器件和电子器件的制造方法不限于上述实施方式。本发明的电子器件的各部分的具体结构和本发明的电子器件的制造方法的各工序的具体处理能够自由地进行各种设计变更。例如，本发明的实施方式的电子器件和电子器件的制造方法包括以下附记的实施方式。
[附记1]
一种电子器件，其包括：
电子部件，其具有在厚度方向上隔开间隔的元件主面和元件背面；
装载部，其具有与所述元件背面相对的装载面，装载所述电子部件；和
接合件，其将所述电子部件接合于所述装载部，
所述接合件包括：基部，其在所述厚度方向上被所述电子部件和所述装载部夹着；和凸缘部，其与所述基部相连，并且在所述厚度方向上观察时形成于所述电子部件的外侧，
所述电子部件包括：分别与所述元件主面和所述元件背面相连的第1元件侧面和第2元件侧面；以及棱，其为所述第1元件侧面与所述第2元件侧面的交叉部分，且在所述厚度方向上延伸，
所述凸缘部包括覆盖所述棱的至少一部分的棱覆盖部。
[附记2]
如附记1所述的电子器件，其中，所述凸缘部还包括覆盖所述第1元件侧面的至少一部分的第1覆盖部和覆盖所述第2元件侧面的至少一部分的第2覆盖部，
所述第1覆盖部和所述第2覆盖部分别与所述棱覆盖部相连。
[附记3]
如附记2所述的电子器件，其中，在所述第1元件侧面中，在与所述第1元件侧面正交的第1方向上观察时，与所述元件主面相连的端缘从所述第1覆盖部露出，
在所述第2元件侧面中，在与所述第2元件侧面正交的第2方向上观察时，与所述元件主面相连的端缘从所述第2覆盖部露出。
[附记4]
如附记3所述的电子器件，其中，所述电子部件在所述厚度方向上观察时为矩形形状，
所述厚度方向、所述第1方向和所述第2方向相互正交。
[附记5]
如附记4所述的电子器件，其中，所述电子部件还包括第3元件侧面、第4元件侧面和多个追加的棱，
所述第3元件侧面与所述元件主面和所述元件背面相连，并且在所述第1方向上与所述第1元件侧面隔开间隔，
所述第4元件侧面与所述元件主面和所述元件背面相连，并且在所述第2方向上与所述第2元件侧面隔开间隔，
所述多个追加的棱分别形成于所述第1元件侧面与所述第4元件侧面相交的部位、所述第2元件侧面与所述第3元件侧面相交的部位、和所述第3元件侧面与所述第4元件侧面相交的部位，且分别在所述厚度方向上延伸，
所述凸缘部还包括覆盖所述多个追加的棱的多个追加的棱覆盖部。
[附记6]
如附记4或附记5所述的电子器件，其中，在所述第1覆盖部中，所述第2方向上的中央部的所述厚度方向的尺寸，比与所述棱覆盖部相连的端缘部的所述厚度方向的尺寸小。
[附记7]
如附记4～附记6中任一项所述的电子器件，其中，所述第1覆盖部在所述第2方向上的中央部和与所述棱覆盖部相连的端缘部之间具有向所述元件主面侧隆起的隆起部。
[附记8]
如附记4～附记7中任一项所述的电子器件，其中，在所述第1覆盖部中，在所述厚度方向上观察时，所述第2方向上的中央部向所述第1元件侧面侧凹陷。
[附记9]
如附记4～附记8中任一项所述的电子器件，其中，在所述第1覆盖部中，与所述棱覆盖部相连的端缘部相对于所述装载面的倾斜度，比所述第2方向上的中央部相对于所述装载面的倾斜度大。
[附记10]
如附记4～附记9中任一项所述的电子器件，其中，在所述第2覆盖部中，所述第1方向上的中央部的所述厚度方向的尺寸，比与所述棱覆盖部相连的端缘部的所述厚度方向的尺寸小。
[附记11]
如附记4～附记10中任一项所述的电子器件，其中，所述第2覆盖部在所述第1方向上的中央部和与所述棱覆盖部相连的端缘部之间具有向所述元件主面侧隆起的隆起部。
[附记12]
如附记4～附记11中任一项所述的电子器件，其中，在所述第2覆盖部中，在所述厚度方向上观察时，所述第1方向上的中央部向所述第2元件侧面侧凹陷。
[附记13]
如附记4～附记12中任一项所述的电子器件，其中，所述第2覆盖部的与所述棱覆盖部相连的端缘部相对于所述装载面的倾斜度，比所述第1方向上的中央部相对于所述装载面的倾斜度大。
[附记14]
如附记1～附记13中任一项所述的电子器件，其中，在所述厚度方向上观察时，所述凸缘部遍及所述电子部件的整周而形成。
[附记15]
如附记1～附记14中任一项所述的电子器件，其中，所述电子部件由半导体材料形成。
[附记16]
如附记1～附记15中任一项所述的电子器件，其中，所述电子部件在所述元件主面形成有主面电极，
所述装载部是引线框的一部分，
所述引线框还包括与所述主面电极导通并且与所述装载部隔开间隔的端子部。
[附记17]
如附记16所述的电子器件，其中，所述引线框架的构成材料是包含Cu的金属。
[附记18]
如附记1～附记17中任一项所述的电子器件，其中，所述电子部件在所述元件背面形成有背面电极，
所述背面电极经由所述接合件与所述装载部导通。
[附记19]
如附记1～附记18中任一项所述的电子器件，其中，所述接合件由烧结银形成。
[附记20]
一种电子器件的制造方法，其中，
所述电子器件包括：
电子部件，其具有在厚度方向上隔开间隔的元件主面和元件背面；
装载部，其具有与所述元件背面相对的装载面，装载所述电子部件；和
接合件，其将所述电子部件接合于所述装载部，
所述电子器件的制造方法包括：
在所述装载面上涂敷膏状接合材的涂敷工序；
在所述膏状接合材上载置所述电子部件的载置工序；和
使所述膏状接合材固化而形成所述接合件的固化工序，
所述装载部包括与所述电子部件接合的接合区域，
所述接合区域包括在所述厚度方向上观察时与所述电子部件的角重叠的角部，
所述膏状接合材在所述厚度方向上观察时从所述电子部件的中央部向所述角部至少涂敷至所述角部。
附图标记的说明
A1：电子器件
1：电子部件
11：元件主面
111：主面电极
12：元件背面
121：背面电极
131～134：元件侧面
141～144：棱
2：树脂部件
21：树脂主面
22：树脂背面
231～234：树脂侧面
3：引线框
31：第1引线
311：装载部
311a：装载面
391：接合区域
392：角部
393：中心
311b：背面
312：端子部
312a：主面
312b：背面
312c：端面
313：连结部
313a：主面
313b：背面
32：第2引线
321：端子部
321a：主面
321b：背面
321c：端面
322：连接部
322a：主面
322b：背面
4：接合件
41：基部
42：凸缘部
431～434：侧方覆盖部
439：隆起部
441～444：棱覆盖部
49：膏状接合材
491：突出部
5：连接部件。

Claims (20)

1.一种电子器件，其特征在于，包括：
电子部件，其具有在厚度方向上隔开间隔的元件主面和元件背面；
装载部，其具有与所述元件背面相对的装载面，装载所述电子部件；和
接合件，其将所述电子部件接合于所述装载部，
所述接合件包括：基部，其在所述厚度方向上被所述电子部件和所述装载部夹着；和凸缘部，其与所述基部相连，并且在所述厚度方向上观察时形成于所述电子部件的外侧，
所述电子部件包括：
分别与所述元件主面和所述元件背面相连的第1元件侧面和第2元件侧面；以及
棱，其为所述第1元件侧面与所述第2元件侧面的交叉部分，且在所述厚度方向上延伸，
所述凸缘部包括覆盖所述棱的至少一部分的棱覆盖部。
2.如权利要求1所述的电子器件，其特征在于：
所述凸缘部还包括覆盖所述第1元件侧面的至少一部分的第1覆盖部和覆盖所述第2元件侧面的至少一部分的第2覆盖部，
所述第1覆盖部和所述第2覆盖部分别与所述棱覆盖部相连。
3.如权利要求2所述的电子器件，其特征在于：
在所述第1元件侧面中，在与所述第1元件侧面正交的第1方向上观察时，与所述元件主面相连的端缘从所述第1覆盖部露出，
在所述第2元件侧面中，在与所述第2元件侧面正交的第2方向上观察时，与所述元件主面相连的端缘从所述第2覆盖部露出。
4.如权利要求3所述的电子器件，其特征在于：
所述电子部件在所述厚度方向上观察时为矩形形状，
所述厚度方向、所述第1方向和所述第2方向相互正交。
5.如权利要求4所述的电子器件，其特征在于：
所述电子部件还包括第3元件侧面、第4元件侧面和多个追加的棱，
所述第3元件侧面与所述元件主面和所述元件背面相连，并且在所述第1方向上与所述第1元件侧面隔开间隔，
所述第4元件侧面与所述元件主面和所述元件背面相连，并且在所述第2方向上与所述第2元件侧面隔开间隔，
所述多个追加的棱分别形成于所述第1元件侧面与所述第4元件侧面相交的部位、所述第2元件侧面与所述第3元件侧面相交的部位、和所述第3元件侧面与所述第4元件侧面相交的部位，且分别在所述厚度方向上延伸，
所述凸缘部还包括覆盖所述多个追加的棱的多个追加的棱覆盖部。
6.如权利要求4或5所述的电子器件，其特征在于：
在所述第1覆盖部中，所述第2方向上的中央部的所述厚度方向的尺寸，比与所述棱覆盖部相连的端缘部的所述厚度方向的尺寸小。
7.如权利要求4～6中任一项所述的电子器件，其特征在于：
所述第1覆盖部在所述第2方向上的中央部和与所述棱覆盖部相连的端缘部之间具有向所述元件主面侧隆起的隆起部。
8.如权利要求4～7中任一项所述的电子器件，其特征在于：
在所述第1覆盖部中，在所述厚度方向上观察时，所述第2方向上的中央部向所述第1元件侧面侧凹陷。
9.如权利要求4～8中任一项所述的电子器件，其特征在于：
在所述第1覆盖部中，与所述棱覆盖部相连的端缘部相对于所述装载面的倾斜度，比所述第2方向上的中央部相对于所述装载面的倾斜度大。
10.如权利要求4～9中任一项所述的电子器件，其特征在于：
在所述第2覆盖部中，所述第1方向上的中央部的所述厚度方向的尺寸，比与所述棱覆盖部相连的端缘部的所述厚度方向的尺寸小。
11.如权利要求4～10中任一项所述的电子器件，其特征在于：
所述第2覆盖部在所述第1方向上的中央部和与所述棱覆盖部相连的端缘部之间具有向所述元件主面侧隆起的隆起部。
12.如权利要求4～11中任一项所述的电子器件，其特征在于：
在所述第2覆盖部中，在所述厚度方向上观察时，所述第1方向上的中央部向所述第2元件侧面侧凹陷。
13.如权利要求4～12中任一项所述的电子器件，其特征在于：
所述第2覆盖部的与所述棱覆盖部相连的端缘部相对于所述装载面的倾斜度，比所述第1方向上的中央部相对于所述装载面的倾斜度大。
14.如权利要求1～13中任一项所述的电子器件，其特征在于：
在所述厚度方向上观察时，所述凸缘部遍及所述电子部件的整周而形成。
15.如权利要求1～14中任一项所述的电子器件，其特征在于：
所述电子部件由半导体材料形成。
16.如权利要求1～15中任一项所述的电子器件，其特征在于：
所述电子部件在所述元件主面形成有主面电极，
所述装载部是引线框的一部分，
所述引线框还包括与所述主面电极导通并且与所述装载部隔开间隔的端子部。
17.如权利要求16所述的电子器件，其特征在于：
所述引线框架的构成材料是包含Cu的金属。
18.如权利要求1～17中任一项所述的电子器件，其特征在于：
所述电子部件在所述元件背面形成有背面电极，
所述背面电极经由所述接合件与所述装载部导通。
19.如权利要求1～18中任1项所述的电子器件，其特征在于：
所述接合件由烧结银形成。
20.一种电子器件的制造方法，其特征在于：
所述电子器件包括：
电子部件，其具有在厚度方向上隔开间隔的元件主面和元件背面；
装载部，其具有与所述元件背面相对的装载面，装载所述电子部件；和
接合件，其将所述电子部件接合于所述装载部，
所述电子器件的制造方法包括：
在所述装载面上涂敷膏状接合材的涂敷工序；
在所述膏状接合材上载置所述电子部件的载置工序；和
使所述膏状接合材固化而形成所述接合件的固化工序，
所述装载部包括与所述电子部件接合的接合区域，
所述接合区域包括在所述厚度方向上观察时与所述电子部件的角重叠的角部，
所述膏状接合材在所述厚度方向上观察时从所述电子部件的中央部向所述角部至少涂敷至所述角部。
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