JP2014508410A5 - - Google Patents
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- Publication number
- JP2014508410A5 JP2014508410A5 JP2013552909A JP2013552909A JP2014508410A5 JP 2014508410 A5 JP2014508410 A5 JP 2014508410A5 JP 2013552909 A JP2013552909 A JP 2013552909A JP 2013552909 A JP2013552909 A JP 2013552909A JP 2014508410 A5 JP2014508410 A5 JP 2014508410A5
- Authority
- JP
- Japan
- Prior art keywords
- outer contact
- central
- conductively connected
- region
- active region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000003989 dielectric material Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011010611.1 | 2011-02-08 | ||
| DE102011010611A DE102011010611A1 (de) | 2011-02-08 | 2011-02-08 | Elektrisches Keramikbauelement mit elektrischer Abschirmung |
| PCT/EP2012/051786 WO2012107349A1 (de) | 2011-02-08 | 2012-02-02 | Elektrisches keramikbauelement mit elektrischer abschirmung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014508410A JP2014508410A (ja) | 2014-04-03 |
| JP2014508410A5 true JP2014508410A5 (cg-RX-API-DMAC7.html) | 2015-04-16 |
| JP5913377B2 JP5913377B2 (ja) | 2016-04-27 |
Family
ID=45558740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013552909A Active JP5913377B2 (ja) | 2011-02-08 | 2012-02-02 | 静電遮蔽体を有する電子セラミック部品 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9338913B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2673787B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5913377B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101543140B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN103348419B (cg-RX-API-DMAC7.html) |
| DE (1) | DE102011010611A1 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2012107349A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3327474B2 (ja) | 1992-03-26 | 2002-09-24 | 株式会社サトー | 自動ラベル貼付け装置 |
| US10269493B2 (en) * | 2009-04-05 | 2019-04-23 | David Frank | Modular dense energy ultra cell and process for fabrication |
| JP2014027255A (ja) * | 2012-06-22 | 2014-02-06 | Murata Mfg Co Ltd | セラミック電子部品及びセラミック電子装置 |
| DE102013102686A1 (de) | 2013-03-15 | 2014-09-18 | Epcos Ag | Elektronisches Bauelement |
| DE102013012733A1 (de) * | 2013-07-31 | 2015-02-05 | Forschungszentrum Jülich GmbH | Widerstand mit verminderter parasitärer Kapazität |
| JP6694235B2 (ja) * | 2015-01-29 | 2020-05-13 | Tdk株式会社 | 電子部品 |
| WO2019053954A1 (ja) * | 2017-09-12 | 2019-03-21 | 株式会社村田製作所 | 積層コンデンサおよび回路モジュール |
| DE102019100316A1 (de) * | 2019-01-08 | 2020-07-09 | Tdk Electronics Ag | Thermistor und Verfahren zur Herstellung des Thermistors |
| JP7319379B2 (ja) * | 2019-01-28 | 2023-08-01 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | 超広帯域性能を有する積層セラミックコンデンサ |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3463161B2 (ja) * | 1998-10-26 | 2003-11-05 | Ｔｄｋ株式会社 | 積層セラミックチップコンデンサ |
| JP3861809B2 (ja) | 2002-12-27 | 2006-12-27 | 株式会社村田製作所 | 圧電振動板およびこの圧電振動板を用いた圧電型電気音響変換器 |
| JP3832504B2 (ja) | 2004-12-24 | 2006-10-11 | 株式会社村田製作所 | 積層コンデンサおよびその実装構造 |
| DE112005001022B4 (de) | 2005-01-06 | 2014-08-21 | Murata Manufacturing Co., Ltd. | Verfahren zur Herstellung eines piezoelektrischen Aktuators und piezoelektrischer Aktuator |
| DE102005033085A1 (de) * | 2005-07-15 | 2007-01-25 | Robert Bosch Gmbh | Piezoaktor |
| JP2007042743A (ja) | 2005-08-01 | 2007-02-15 | Tdk Corp | 積層電子部品 |
| US7336475B2 (en) * | 2006-02-22 | 2008-02-26 | Vishay Vitramon, Inc. | High voltage capacitors |
| DE102007020783A1 (de) | 2007-05-03 | 2008-11-06 | Epcos Ag | Elektrisches Vielschichtbauelement |
| KR100925623B1 (ko) | 2007-08-31 | 2009-11-06 | 삼성전기주식회사 | 적층형 칩 커패시터 및 이를 구비한 회로기판 장치 및회로기판 |
| KR100916476B1 (ko) * | 2007-11-30 | 2009-09-08 | 삼성전기주식회사 | 적층형 칩 커패시터 및 이를 구비한 회로기판 장치 |
| US8125762B2 (en) | 2008-08-11 | 2012-02-28 | Vishay Sprague, Inc. | High voltage capacitors |
| JP4905498B2 (ja) | 2009-04-22 | 2012-03-28 | 株式会社村田製作所 | 積層型セラミック電子部品 |
| JP5533387B2 (ja) * | 2010-07-21 | 2014-06-25 | 株式会社村田製作所 | セラミック電子部品 |
| JP2012156193A (ja) * | 2011-01-24 | 2012-08-16 | Tdk Corp | 積層コンデンサ |
| JP2012156315A (ja) | 2011-01-26 | 2012-08-16 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
| KR101580349B1 (ko) * | 2012-01-31 | 2015-12-24 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 제조 방법 |
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2011
- 2011-02-08 DE DE102011010611A patent/DE102011010611A1/de not_active Withdrawn
-
2012
- 2012-02-02 EP EP12701912.3A patent/EP2673787B1/de active Active
- 2012-02-02 WO PCT/EP2012/051786 patent/WO2012107349A1/de not_active Ceased
- 2012-02-02 US US13/984,274 patent/US9338913B2/en active Active
- 2012-02-02 JP JP2013552909A patent/JP5913377B2/ja active Active
- 2012-02-02 CN CN201280008115.4A patent/CN103348419B/zh active Active
- 2012-02-02 KR KR1020137023857A patent/KR101543140B1/ko active Active