JP2014507565A5 - - Google Patents

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Publication number
JP2014507565A5
JP2014507565A5 JP2013553970A JP2013553970A JP2014507565A5 JP 2014507565 A5 JP2014507565 A5 JP 2014507565A5 JP 2013553970 A JP2013553970 A JP 2013553970A JP 2013553970 A JP2013553970 A JP 2013553970A JP 2014507565 A5 JP2014507565 A5 JP 2014507565A5
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JP
Japan
Prior art keywords
chamber
layer
processing
transport
track
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JP2013553970A
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English (en)
Japanese (ja)
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JP2014507565A (ja
JP5945553B2 (ja
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Priority claimed from EP11155238.6A external-priority patent/EP2489759B1/en
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Publication of JP2014507565A publication Critical patent/JP2014507565A/ja
Publication of JP2014507565A5 publication Critical patent/JP2014507565A5/ja
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Publication of JP5945553B2 publication Critical patent/JP5945553B2/ja
Expired - Fee Related legal-status Critical Current
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JP2013553970A 2011-02-21 2012-02-21 被覆装置および被覆方法 Expired - Fee Related JP5945553B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11155238.6A EP2489759B1 (en) 2011-02-21 2011-02-21 System for utilization improvement of process chambers and method of operating thereof
EP11155238.6 2011-02-21
PCT/EP2012/052935 WO2012113792A1 (en) 2011-02-21 2012-02-21 Coating apparatus and method.

Publications (3)

Publication Number Publication Date
JP2014507565A JP2014507565A (ja) 2014-03-27
JP2014507565A5 true JP2014507565A5 (enExample) 2015-04-09
JP5945553B2 JP5945553B2 (ja) 2016-07-05

Family

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Family Applications (1)

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JP2013553970A Expired - Fee Related JP5945553B2 (ja) 2011-02-21 2012-02-21 被覆装置および被覆方法

Country Status (7)

Country Link
US (2) US20120213938A1 (enExample)
EP (2) EP2489759B1 (enExample)
JP (1) JP5945553B2 (enExample)
KR (2) KR102095717B1 (enExample)
CN (1) CN102803551B (enExample)
TW (1) TWI579952B (enExample)
WO (1) WO2012113792A1 (enExample)

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TWI582256B (zh) 2013-02-04 2017-05-11 愛發科股份有限公司 薄型基板處理裝置
JP2017513221A (ja) * 2014-04-02 2017-05-25 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板処理のためのシステム、基板処理のためのシステム用の真空回転モジュール、及び基板処理システムを操作する方法
TWI557837B (zh) * 2014-04-10 2016-11-11 Uvat Technology Co Ltd Vacuum equipment multi-vehicle simultaneous multi-processing process
TWI732285B (zh) * 2015-01-23 2021-07-01 美商應用材料股份有限公司 半導體處理設備
WO2016188550A1 (en) * 2015-05-22 2016-12-01 Applied Materials, Inc. Lock chamber, inline substrate processing system and method of operating an inline substrate processing system
US9972740B2 (en) * 2015-06-07 2018-05-15 Tesla, Inc. Chemical vapor deposition tool and process for fabrication of photovoltaic structures
DE102015013799A1 (de) * 2015-10-26 2017-04-27 Grenzebach Maschinenbau Gmbh Vorrichtung und Verfahren zum Beschichten überlanger flächenhafter Substrate, insbesondere Glasscheiben, in einer Vakuum-Beschichtungsanlage
CN105239051B (zh) * 2015-11-17 2018-11-30 广东腾胜真空技术工程有限公司 双向进出交替镀膜装置及方法
US9748434B1 (en) 2016-05-24 2017-08-29 Tesla, Inc. Systems, method and apparatus for curing conductive paste
US9954136B2 (en) 2016-08-03 2018-04-24 Tesla, Inc. Cassette optimized for an inline annealing system
JP6830772B2 (ja) * 2016-08-04 2021-02-17 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法
US10115856B2 (en) 2016-10-31 2018-10-30 Tesla, Inc. System and method for curing conductive paste using induction heating
KR20180086715A (ko) * 2017-01-23 2018-08-01 어플라이드 머티어리얼스, 인코포레이티드 반송챔버, 이를 포함하는 기판처리시스템 및 이를 이용한 기판처리시스템의 기판처리방법
US10043693B1 (en) * 2017-06-06 2018-08-07 Applied Materials, Inc. Method and apparatus for handling substrates in a processing system having a buffer chamber
CN114127331A (zh) * 2019-07-25 2022-03-01 应用材料公司 用于处理多个基板的基板处理系统和在直列基板处理系统中处理基板的方法
US11856833B2 (en) 2020-01-22 2023-12-26 Applied Materials, Inc. In-line monitoring of OLED layer thickness and dopant concentration
WO2021150525A1 (en) * 2020-01-22 2021-07-29 Applied Materials, Inc. In-line monitoring of oled layer thickness and dopant concentration
KR102866529B1 (ko) 2020-10-28 2025-09-30 삼성전자주식회사 반도체 소자의 제조 장치
CN118742669A (zh) * 2022-03-14 2024-10-01 应用材料公司 真空沉积系统和在真空沉积系统中涂覆基板的方法
TWI843196B (zh) * 2022-09-08 2024-05-21 凌嘉科技股份有限公司 旋轉移載式立式鍍膜設備及雙面多層膜的鍍膜方法

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