JP2014505369A5 - - Google Patents

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Publication number
JP2014505369A5
JP2014505369A5 JP2013550780A JP2013550780A JP2014505369A5 JP 2014505369 A5 JP2014505369 A5 JP 2014505369A5 JP 2013550780 A JP2013550780 A JP 2013550780A JP 2013550780 A JP2013550780 A JP 2013550780A JP 2014505369 A5 JP2014505369 A5 JP 2014505369A5
Authority
JP
Japan
Prior art keywords
substrate table
layer
multilayer coating
table according
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013550780A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014505369A (ja
JP5989673B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2011/070407 external-priority patent/WO2012103967A1/en
Publication of JP2014505369A publication Critical patent/JP2014505369A/ja
Publication of JP2014505369A5 publication Critical patent/JP2014505369A5/ja
Application granted granted Critical
Publication of JP5989673B2 publication Critical patent/JP5989673B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013550780A 2011-02-01 2011-11-17 基板テーブル、リソグラフィ装置、およびデバイス製造方法 Expired - Fee Related JP5989673B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161438480P 2011-02-01 2011-02-01
US61/438,480 2011-02-01
PCT/EP2011/070407 WO2012103967A1 (en) 2011-02-01 2011-11-17 Substrate table, lithographic apparatus and device manufacturing method

Publications (3)

Publication Number Publication Date
JP2014505369A JP2014505369A (ja) 2014-02-27
JP2014505369A5 true JP2014505369A5 (enExample) 2015-01-15
JP5989673B2 JP5989673B2 (ja) 2016-09-07

Family

ID=44983562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013550780A Expired - Fee Related JP5989673B2 (ja) 2011-02-01 2011-11-17 基板テーブル、リソグラフィ装置、およびデバイス製造方法

Country Status (4)

Country Link
US (1) US9329497B2 (enExample)
JP (1) JP5989673B2 (enExample)
TW (1) TWI536117B (enExample)
WO (1) WO2012103967A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2009189A (en) * 2011-08-17 2013-02-19 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
US9442395B2 (en) * 2012-02-03 2016-09-13 Asml Netherlands B.V. Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder
US10937684B2 (en) * 2012-11-28 2021-03-02 Kyocera Corporation Placement member and method of manufacturing the same
NL2010527A (en) 2013-03-27 2014-09-30 Asml Netherlands Bv Object holder, lithographic apparatus, device manufacturing method, and method of manufacturing an object holder.
US9284210B2 (en) * 2014-03-31 2016-03-15 Corning Incorporated Methods and apparatus for material processing using dual source cyclonic plasma reactor
CN110068991B (zh) 2014-10-23 2021-03-12 Asml荷兰有限公司 用于光刻设备的支撑台和光刻设备
JP6867149B2 (ja) * 2015-12-25 2021-04-28 日本特殊陶業株式会社 基板保持部材
US11520241B2 (en) * 2017-12-20 2022-12-06 Asml Holding N.V. Lithography supports with defined burltop topography
TWI827645B (zh) * 2018-08-23 2024-01-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基板處理設備及方法
JP7408683B2 (ja) 2019-04-30 2024-01-05 エーエスエムエル ネザーランズ ビー．ブイ． 構造体に耐摩耗材料を提供するための方法、及び複合体
CN119165742A (zh) * 2019-05-24 2024-12-20 Asml控股股份有限公司 光刻装置、衬底台以及方法
EP4208890A4 (en) * 2020-09-02 2024-10-09 Entegris, Inc. Electrostatic chuck with embossments that comprise diamond-like carbon and deposited silicon-based material, and related methods
EP4386478A1 (en) 2022-12-12 2024-06-19 ASML Netherlands B.V. Apparatus and method for electrostatically clamping a substrate
EP4425259A1 (en) * 2023-02-28 2024-09-04 ASML Netherlands B.V. Method of manufacturing an electrostatic object clamp, electrostatic object clamp and semiconductor processing apparatus
EP4488758A1 (en) * 2023-07-05 2025-01-08 ASML Netherlands B.V. Object holder with a support surface having a plurality of support elements or optical element for a lithographic apparatus, comprising a metal-si multilayer, a metal-ge multilayer and/or a chromium nitride layer configured to provide a selectively changeable height of individual support elements or shape of the optical element via thermal treatment and method of correcting flatness of a surface of the object holder or the optical element

Family Cites Families (24)

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US4551192A (en) * 1983-06-30 1985-11-05 International Business Machines Corporation Electrostatic or vacuum pinchuck formed with microcircuit lithography
JP2979922B2 (ja) * 1992-10-12 1999-11-22 住友電気工業株式会社 超薄膜積層部材
US5298103A (en) 1993-07-15 1994-03-29 Hughes Aircraft Company Electrode assembly useful in confined plasma assisted chemical etching
JPH07138771A (ja) 1993-11-17 1995-05-30 Kobe Steel Ltd 多層皮膜被覆金属材料
JPH07207459A (ja) 1994-01-24 1995-08-08 Kobe Steel Ltd 多層皮膜被覆金属材料
JP3705381B2 (ja) 1996-09-03 2005-10-12 日立ツール株式会社 多層被覆硬質工具
JP3705382B2 (ja) 1996-09-03 2005-10-12 日立ツール株式会社 多層被覆硬質工具
US5841624A (en) * 1997-06-09 1998-11-24 Applied Materials, Inc. Cover layer for a substrate support chuck and method of fabricating same
JP2000349140A (ja) 1999-06-01 2000-12-15 Toto Ltd 静電チャックを用いた被処理体の処理および搬送方法
TW594426B (en) * 1999-06-11 2004-06-21 Asml Netherlands Bv Lithographic projection apparatus, integrated circuit manufacturing method and integrated circuit made thereby
US7399357B2 (en) 2003-05-08 2008-07-15 Arthur Sherman Atomic layer deposition using multilayers
EP1498777A1 (en) * 2003-07-15 2005-01-19 ASML Netherlands B.V. Substrate holder and lithographic projection apparatus
EP1510868A1 (en) * 2003-08-29 2005-03-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006305713A (ja) * 2005-03-28 2006-11-09 Nikon Corp 吸着装置、研磨装置、半導体デバイス及び半導体デバイス製造方法
KR100755874B1 (ko) * 2005-11-30 2007-09-05 주식회사 아이피에스 진공처리장치의 정전척, 그를 가지는 진공처리장치 및정전척의 제조방법
JP4890421B2 (ja) * 2006-10-31 2012-03-07 太平洋セメント株式会社 静電チャック
JP4437301B2 (ja) 2007-02-28 2010-03-24 エルピーダメモリ株式会社 半導体装置の製造方法
JP5059450B2 (ja) 2007-03-06 2012-10-24 東京エレクトロン株式会社 基板載置台及び基板処理装置
US7698678B2 (en) * 2007-05-30 2010-04-13 International Business Machines Corporation Methodology for automated design of vertical parallel plate capacitors
EP2188413B1 (en) 2007-09-07 2018-07-11 Fujifilm Manufacturing Europe B.V. Method for atomic layer deposition using an atmospheric pressure glow discharge plasma
US7944677B2 (en) 2007-09-11 2011-05-17 Canon Anelva Corporation Electrostatic chuck
JP5246165B2 (ja) 2007-10-12 2013-07-24 日立ツール株式会社 硬質皮膜被覆部材の製造方法
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
JP5268476B2 (ja) 2008-07-29 2013-08-21 日本特殊陶業株式会社 静電チャック

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