TWI536117B - 基板台、微影裝置及元件製造方法 - Google Patents
基板台、微影裝置及元件製造方法 Download PDFInfo
- Publication number
- TWI536117B TWI536117B TW100144919A TW100144919A TWI536117B TW I536117 B TWI536117 B TW I536117B TW 100144919 A TW100144919 A TW 100144919A TW 100144919 A TW100144919 A TW 100144919A TW I536117 B TWI536117 B TW I536117B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- multilayer coating
- substrate
- substrate stage
- tin
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 204
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000000576 coating method Methods 0.000 claims description 134
- 239000011248 coating agent Substances 0.000 claims description 125
- 230000005855 radiation Effects 0.000 claims description 78
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 71
- 238000000231 atomic layer deposition Methods 0.000 claims description 57
- 238000000034 method Methods 0.000 claims description 37
- 238000001459 lithography Methods 0.000 claims description 28
- 238000001020 plasma etching Methods 0.000 claims description 15
- 238000003486 chemical etching Methods 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims description 8
- 206010028980 Neoplasm Diseases 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 151
- 229910052718 tin Inorganic materials 0.000 description 69
- 210000002381 plasma Anatomy 0.000 description 55
- 239000000463 material Substances 0.000 description 41
- 238000004549 pulsed laser deposition Methods 0.000 description 20
- 239000007789 gas Substances 0.000 description 19
- 239000011521 glass Substances 0.000 description 15
- 238000005530 etching Methods 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 11
- 230000004888 barrier function Effects 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 238000009304 pastoral farming Methods 0.000 description 9
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 8
- 239000002356 single layer Substances 0.000 description 8
- 239000000356 contaminant Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
- 239000002243 precursor Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000000446 fuel Substances 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 230000003595 spectral effect Effects 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 238000009616 inductively coupled plasma Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000000376 reactant Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- OFZCIYFFPZCNJE-UHFFFAOYSA-N carisoprodol Chemical compound NC(=O)OCC(C)(CCC)COC(=O)NC(C)C OFZCIYFFPZCNJE-UHFFFAOYSA-N 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 210000001747 pupil Anatomy 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 241001462977 Elina Species 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002052 molecular layer Substances 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910019912 CrN Inorganic materials 0.000 description 1
- 229910010037 TiAlN Inorganic materials 0.000 description 1
- 229910003074 TiCl4 Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical group FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002120 nanofilm Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- KFZUDNZQQCWGKF-UHFFFAOYSA-M sodium;4-methylbenzenesulfinate Chemical compound [Na+].CC1=CC=C(S([O-])=O)C=C1 KFZUDNZQQCWGKF-UHFFFAOYSA-M 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161438480P | 2011-02-01 | 2011-02-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201237561A TW201237561A (en) | 2012-09-16 |
| TWI536117B true TWI536117B (zh) | 2016-06-01 |
Family
ID=44983562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100144919A TWI536117B (zh) | 2011-02-01 | 2011-12-06 | 基板台、微影裝置及元件製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9329497B2 (enExample) |
| JP (1) | JP5989673B2 (enExample) |
| TW (1) | TWI536117B (enExample) |
| WO (1) | WO2012103967A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2009189A (en) * | 2011-08-17 | 2013-02-19 | Asml Netherlands Bv | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method. |
| US9442395B2 (en) * | 2012-02-03 | 2016-09-13 | Asml Netherlands B.V. | Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder |
| US10937684B2 (en) * | 2012-11-28 | 2021-03-02 | Kyocera Corporation | Placement member and method of manufacturing the same |
| NL2010527A (en) | 2013-03-27 | 2014-09-30 | Asml Netherlands Bv | Object holder, lithographic apparatus, device manufacturing method, and method of manufacturing an object holder. |
| US9284210B2 (en) * | 2014-03-31 | 2016-03-15 | Corning Incorporated | Methods and apparatus for material processing using dual source cyclonic plasma reactor |
| CN110068991B (zh) | 2014-10-23 | 2021-03-12 | Asml荷兰有限公司 | 用于光刻设备的支撑台和光刻设备 |
| JP6867149B2 (ja) * | 2015-12-25 | 2021-04-28 | 日本特殊陶業株式会社 | 基板保持部材 |
| US11520241B2 (en) * | 2017-12-20 | 2022-12-06 | Asml Holding N.V. | Lithography supports with defined burltop topography |
| TWI827645B (zh) * | 2018-08-23 | 2024-01-01 | 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 | 基板處理設備及方法 |
| JP7408683B2 (ja) | 2019-04-30 | 2024-01-05 | エーエスエムエル ネザーランズ ビー．ブイ． | 構造体に耐摩耗材料を提供するための方法、及び複合体 |
| CN119165742A (zh) * | 2019-05-24 | 2024-12-20 | Asml控股股份有限公司 | 光刻装置、衬底台以及方法 |
| EP4208890A4 (en) * | 2020-09-02 | 2024-10-09 | Entegris, Inc. | Electrostatic chuck with embossments that comprise diamond-like carbon and deposited silicon-based material, and related methods |
| EP4386478A1 (en) | 2022-12-12 | 2024-06-19 | ASML Netherlands B.V. | Apparatus and method for electrostatically clamping a substrate |
| EP4425259A1 (en) * | 2023-02-28 | 2024-09-04 | ASML Netherlands B.V. | Method of manufacturing an electrostatic object clamp, electrostatic object clamp and semiconductor processing apparatus |
| EP4488758A1 (en) * | 2023-07-05 | 2025-01-08 | ASML Netherlands B.V. | Object holder with a support surface having a plurality of support elements or optical element for a lithographic apparatus, comprising a metal-si multilayer, a metal-ge multilayer and/or a chromium nitride layer configured to provide a selectively changeable height of individual support elements or shape of the optical element via thermal treatment and method of correcting flatness of a surface of the object holder or the optical element |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4551192A (en) * | 1983-06-30 | 1985-11-05 | International Business Machines Corporation | Electrostatic or vacuum pinchuck formed with microcircuit lithography |
| JP2979922B2 (ja) * | 1992-10-12 | 1999-11-22 | 住友電気工業株式会社 | 超薄膜積層部材 |
| US5298103A (en) | 1993-07-15 | 1994-03-29 | Hughes Aircraft Company | Electrode assembly useful in confined plasma assisted chemical etching |
| JPH07138771A (ja) | 1993-11-17 | 1995-05-30 | Kobe Steel Ltd | 多層皮膜被覆金属材料 |
| JPH07207459A (ja) | 1994-01-24 | 1995-08-08 | Kobe Steel Ltd | 多層皮膜被覆金属材料 |
| JP3705381B2 (ja) | 1996-09-03 | 2005-10-12 | 日立ツール株式会社 | 多層被覆硬質工具 |
| JP3705382B2 (ja) | 1996-09-03 | 2005-10-12 | 日立ツール株式会社 | 多層被覆硬質工具 |
| US5841624A (en) * | 1997-06-09 | 1998-11-24 | Applied Materials, Inc. | Cover layer for a substrate support chuck and method of fabricating same |
| JP2000349140A (ja) | 1999-06-01 | 2000-12-15 | Toto Ltd | 静電チャックを用いた被処理体の処理および搬送方法 |
| TW594426B (en) * | 1999-06-11 | 2004-06-21 | Asml Netherlands Bv | Lithographic projection apparatus, integrated circuit manufacturing method and integrated circuit made thereby |
| US7399357B2 (en) | 2003-05-08 | 2008-07-15 | Arthur Sherman | Atomic layer deposition using multilayers |
| EP1498777A1 (en) * | 2003-07-15 | 2005-01-19 | ASML Netherlands B.V. | Substrate holder and lithographic projection apparatus |
| EP1510868A1 (en) * | 2003-08-29 | 2005-03-02 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2006305713A (ja) * | 2005-03-28 | 2006-11-09 | Nikon Corp | 吸着装置、研磨装置、半導体デバイス及び半導体デバイス製造方法 |
| KR100755874B1 (ko) * | 2005-11-30 | 2007-09-05 | 주식회사 아이피에스 | 진공처리장치의 정전척, 그를 가지는 진공처리장치 및정전척의 제조방법 |
| JP4890421B2 (ja) * | 2006-10-31 | 2012-03-07 | 太平洋セメント株式会社 | 静電チャック |
| JP4437301B2 (ja) | 2007-02-28 | 2010-03-24 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
| JP5059450B2 (ja) | 2007-03-06 | 2012-10-24 | 東京エレクトロン株式会社 | 基板載置台及び基板処理装置 |
| US7698678B2 (en) * | 2007-05-30 | 2010-04-13 | International Business Machines Corporation | Methodology for automated design of vertical parallel plate capacitors |
| EP2188413B1 (en) | 2007-09-07 | 2018-07-11 | Fujifilm Manufacturing Europe B.V. | Method for atomic layer deposition using an atmospheric pressure glow discharge plasma |
| US7944677B2 (en) | 2007-09-11 | 2011-05-17 | Canon Anelva Corporation | Electrostatic chuck |
| JP5246165B2 (ja) | 2007-10-12 | 2013-07-24 | 日立ツール株式会社 | 硬質皮膜被覆部材の製造方法 |
| TWI475594B (zh) | 2008-05-19 | 2015-03-01 | Entegris Inc | 靜電夾頭 |
| JP5268476B2 (ja) | 2008-07-29 | 2013-08-21 | 日本特殊陶業株式会社 | 静電チャック |
-
2011
- 2011-11-17 WO PCT/EP2011/070407 patent/WO2012103967A1/en not_active Ceased
- 2011-11-17 US US13/979,278 patent/US9329497B2/en not_active Expired - Fee Related
- 2011-11-17 JP JP2013550780A patent/JP5989673B2/ja not_active Expired - Fee Related
- 2011-12-06 TW TW100144919A patent/TWI536117B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014505369A (ja) | 2014-02-27 |
| JP5989673B2 (ja) | 2016-09-07 |
| TW201237561A (en) | 2012-09-16 |
| US20130301028A1 (en) | 2013-11-14 |
| US9329497B2 (en) | 2016-05-03 |
| WO2012103967A1 (en) | 2012-08-09 |
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