TWI536117B - 基板台、微影裝置及元件製造方法 - Google Patents

基板台、微影裝置及元件製造方法 Download PDF

Info

Publication number
TWI536117B
TWI536117B TW100144919A TW100144919A TWI536117B TW I536117 B TWI536117 B TW I536117B TW 100144919 A TW100144919 A TW 100144919A TW 100144919 A TW100144919 A TW 100144919A TW I536117 B TWI536117 B TW I536117B
Authority
TW
Taiwan
Prior art keywords
layer
multilayer coating
substrate stage
substrate
tin
Prior art date
Application number
TW100144919A
Other languages
English (en)
Chinese (zh)
Other versions
TW201237561A (en
Inventor
班司利 艾柏特
林內 特奧多魯斯 佩特魯斯 卡滿潘
Original Assignee
Ａｓｍｌ荷蘭公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ａｓｍｌ荷蘭公司 filed Critical Ａｓｍｌ荷蘭公司
Publication of TW201237561A publication Critical patent/TW201237561A/zh
Application granted granted Critical
Publication of TWI536117B publication Critical patent/TWI536117B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • H10P72/7614—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
TW100144919A 2011-02-01 2011-12-06 基板台、微影裝置及元件製造方法 TWI536117B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161438480P 2011-02-01 2011-02-01

Publications (2)

Publication Number Publication Date
TW201237561A TW201237561A (en) 2012-09-16
TWI536117B true TWI536117B (zh) 2016-06-01

Family

ID=44983562

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100144919A TWI536117B (zh) 2011-02-01 2011-12-06 基板台、微影裝置及元件製造方法

Country Status (4)

Country Link
US (1) US9329497B2 (enExample)
JP (1) JP5989673B2 (enExample)
TW (1) TWI536117B (enExample)
WO (1) WO2012103967A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2009189A (en) 2011-08-17 2013-02-19 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
EP3683627A1 (en) * 2012-02-03 2020-07-22 ASML Netherlands B.V. Substrate holder and lithographic apparatus
WO2014084060A1 (ja) * 2012-11-28 2014-06-05 京セラ株式会社 載置用部材およびその製造方法
NL2010527A (en) * 2013-03-27 2014-09-30 Asml Netherlands Bv Object holder, lithographic apparatus, device manufacturing method, and method of manufacturing an object holder.
US9284210B2 (en) * 2014-03-31 2016-03-15 Corning Incorporated Methods and apparatus for material processing using dual source cyclonic plasma reactor
CN110068991B (zh) * 2014-10-23 2021-03-12 Asml荷兰有限公司 用于光刻设备的支撑台和光刻设备
JP6867149B2 (ja) * 2015-12-25 2021-04-28 日本特殊陶業株式会社 基板保持部材
NL2022092A (en) * 2017-12-20 2019-07-02 Asml Holding Nv Lithography supports with defined burltop topography
TWI827645B (zh) * 2018-08-23 2024-01-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基板處理設備及方法
US11874607B2 (en) 2019-04-30 2024-01-16 Asml Netherlands B.V. Method for providing a wear-resistant material on a body, and composite body
US11988971B2 (en) 2019-05-24 2024-05-21 Asml Holding N.V. Lithographic apparatus, substrate table, and method
JP7499406B2 (ja) * 2020-09-02 2024-06-13 インテグリス・インコーポレーテッド ダイヤモンド状炭素及び堆積ケイ素系材料を含むエンボスを有する静電チャック、及び関連する方法
DE102021115970A1 (de) * 2021-06-21 2022-12-22 Asml Netherlands B.V. Haltevorrichtung zur Bauteil-Halterung und Verfahren zur Herstellung der Haltevorrichtung
EP4386478A1 (en) 2022-12-12 2024-06-19 ASML Netherlands B.V. Apparatus and method for electrostatically clamping a substrate
EP4425259A1 (en) * 2023-02-28 2024-09-04 ASML Netherlands B.V. Method of manufacturing an electrostatic object clamp, electrostatic object clamp and semiconductor processing apparatus
EP4488758A1 (en) * 2023-07-05 2025-01-08 ASML Netherlands B.V. Object holder with a support surface having a plurality of support elements or optical element for a lithographic apparatus, comprising a metal-si multilayer, a metal-ge multilayer and/or a chromium nitride layer configured to provide a selectively changeable height of individual support elements or shape of the optical element via thermal treatment and method of correcting flatness of a surface of the object holder or the optical element

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551192A (en) * 1983-06-30 1985-11-05 International Business Machines Corporation Electrostatic or vacuum pinchuck formed with microcircuit lithography
JP2979922B2 (ja) * 1992-10-12 1999-11-22 住友電気工業株式会社 超薄膜積層部材
US5298103A (en) 1993-07-15 1994-03-29 Hughes Aircraft Company Electrode assembly useful in confined plasma assisted chemical etching
JPH07138771A (ja) 1993-11-17 1995-05-30 Kobe Steel Ltd 多層皮膜被覆金属材料
JPH07207459A (ja) 1994-01-24 1995-08-08 Kobe Steel Ltd 多層皮膜被覆金属材料
JP3705381B2 (ja) 1996-09-03 2005-10-12 日立ツール株式会社 多層被覆硬質工具
JP3705382B2 (ja) 1996-09-03 2005-10-12 日立ツール株式会社 多層被覆硬質工具
US5841624A (en) * 1997-06-09 1998-11-24 Applied Materials, Inc. Cover layer for a substrate support chuck and method of fabricating same
JP2000349140A (ja) 1999-06-01 2000-12-15 Toto Ltd 静電チャックを用いた被処理体の処理および搬送方法
TW594426B (en) * 1999-06-11 2004-06-21 Asml Netherlands Bv Lithographic projection apparatus, integrated circuit manufacturing method and integrated circuit made thereby
US7399357B2 (en) 2003-05-08 2008-07-15 Arthur Sherman Atomic layer deposition using multilayers
EP1498777A1 (en) * 2003-07-15 2005-01-19 ASML Netherlands B.V. Substrate holder and lithographic projection apparatus
EP1510868A1 (en) * 2003-08-29 2005-03-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006305713A (ja) * 2005-03-28 2006-11-09 Nikon Corp 吸着装置、研磨装置、半導体デバイス及び半導体デバイス製造方法
KR100755874B1 (ko) 2005-11-30 2007-09-05 주식회사 아이피에스 진공처리장치의 정전척, 그를 가지는 진공처리장치 및정전척의 제조방법
JP4890421B2 (ja) * 2006-10-31 2012-03-07 太平洋セメント株式会社 静電チャック
JP4437301B2 (ja) 2007-02-28 2010-03-24 エルピーダメモリ株式会社 半導体装置の製造方法
JP5059450B2 (ja) * 2007-03-06 2012-10-24 東京エレクトロン株式会社 基板載置台及び基板処理装置
US7698678B2 (en) * 2007-05-30 2010-04-13 International Business Machines Corporation Methodology for automated design of vertical parallel plate capacitors
JP5663305B2 (ja) 2007-09-07 2015-02-04 フジフィルム マニュファクチュアリング ヨーロッパ ビー．ヴィ． 大気圧グロー放電プラズマを用いる原子層堆積の方法及び装置
US7944677B2 (en) * 2007-09-11 2011-05-17 Canon Anelva Corporation Electrostatic chuck
EP2208560B2 (en) * 2007-10-12 2017-09-20 Hitachi Tool Engineering, Ltd. Process for the production of the member covered with hard coating
TWI475594B (zh) * 2008-05-19 2015-03-01 恩特格林斯公司 靜電夾頭
JP5268476B2 (ja) 2008-07-29 2013-08-21 日本特殊陶業株式会社 静電チャック

Also Published As

Publication number Publication date
JP2014505369A (ja) 2014-02-27
JP5989673B2 (ja) 2016-09-07
TW201237561A (en) 2012-09-16
WO2012103967A1 (en) 2012-08-09
US20130301028A1 (en) 2013-11-14
US9329497B2 (en) 2016-05-03

Similar Documents

Publication Publication Date Title
TWI536117B (zh) 基板台、微影裝置及元件製造方法
US11754929B2 (en) Substrate holder and method of manufacturing a substrate holder
JP4898765B2 (ja) 光学素子における蒸着物の除去方法、光学素子の保護方法、デバイス製造方法、光学素子を含む装置、およびリソグラフィ装置
KR101903518B1 (ko) 스침 입사 반사기, 리소그래피 장치, 스침 입사 반사기 제조 방법, 및 디바이스 제조 방법
US20100296073A1 (en) Lithographic Apparatus, Substrate Table, and Method for Enhancing Substrate Release Properties
NL2011920A (en) Electrostatic clamp.
KR20110046545A (ko) 높은 열전도율을 갖는 ｅｕｖ 레티클 기판들
TW200841133A (en) Device manufacturing method and lithographic apparatus
TWI539242B (zh) 微影裝置及元件製造方法
WO2013083332A1 (en) Method for a patterning device support
JP7167158B2 (ja) 定められたバールトップトポグラフィを有するリソグラフィサポート
US20100151394A1 (en) System for Contactless Cleaning, Lithographic Apparatus and Device Manufacturing Method
JP4599334B2 (ja) 物品支持部材を製造する方法
CN114846409A (zh) 晶片夹具硬突节生产和翻新
CN114503034A (zh) 清洁装置、光刻设备、去除水或其它污染物的方法、和器件制造方法
JP4892523B2 (ja) 光学エレメントから堆積を除去する方法、リソグラフィ装置、およびデバイスを製造する方法
NL2006603A (en) Substrate table, lithographic apparatus and device manufacturing method.
EP4359868A1 (en) Lithographic apparatus, substrate table, and manufacturing method
NL2006647A (en) Grazing incidence reflectors, lithographic apparatus, methods for manufacturing a grazing incidence reflector and methods for manufacturing a device.
NL2009725A (en) Cleaning a support that holds a patterning device inside a lithography apparatus.

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees