JP2014220231A5 - - Google Patents
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- JP2014220231A5 JP2014220231A5 JP2014021856A JP2014021856A JP2014220231A5 JP 2014220231 A5 JP2014220231 A5 JP 2014220231A5 JP 2014021856 A JP2014021856 A JP 2014021856A JP 2014021856 A JP2014021856 A JP 2014021856A JP 2014220231 A5 JP2014220231 A5 JP 2014220231A5
- Authority
- JP
- Japan
- Prior art keywords
- radical
- plate
- diffuser plate
- precursor delivery
- showerhead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002243 precursor Substances 0.000 claims description 243
- 238000000034 method Methods 0.000 claims description 131
- 239000012212 insulator Substances 0.000 claims description 129
- 230000008569 process Effects 0.000 claims description 117
- 238000012545 processing Methods 0.000 claims description 52
- 239000000463 material Substances 0.000 claims description 41
- 238000009413 insulation Methods 0.000 claims description 38
- 238000001816 cooling Methods 0.000 claims description 37
- 239000002826 coolant Substances 0.000 claims description 32
- 239000004065 semiconductor Substances 0.000 claims description 32
- 238000009826 distribution Methods 0.000 claims description 28
- 239000012530 fluid Substances 0.000 claims description 26
- 230000013011 mating Effects 0.000 claims description 21
- 230000003746 surface roughness Effects 0.000 claims description 16
- 238000004891 communication Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000010453 quartz Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052594 sapphire Inorganic materials 0.000 claims description 7
- 239000010980 sapphire Substances 0.000 claims description 7
- 239000012809 cooling fluid Substances 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- 230000006798 recombination Effects 0.000 claims description 4
- 238000005215 recombination Methods 0.000 claims description 4
- 239000007789 gas Substances 0.000 description 176
- 239000010410 layer Substances 0.000 description 81
- 235000012431 wafers Nutrition 0.000 description 49
- 238000006243 chemical reaction Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 12
- 230000007246 mechanism Effects 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 230000007812 deficiency Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000011112 process operation Methods 0.000 description 6
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361765432P | 2013-02-15 | 2013-02-15 | |
| US61/765,432 | 2013-02-15 | ||
| US201361770251P | 2013-02-27 | 2013-02-27 | |
| US61/770,251 | 2013-02-27 | ||
| US13/934,620 US20140235069A1 (en) | 2013-02-15 | 2013-07-03 | Multi-plenum showerhead with temperature control |
| US13/934,620 | 2013-07-03 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018087939A Division JP2018160462A (ja) | 2013-02-15 | 2018-05-01 | 温度制御機能を備えるマルチプレナムシャワーヘッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014220231A JP2014220231A (ja) | 2014-11-20 |
| JP2014220231A5 true JP2014220231A5 (https=) | 2017-06-01 |
Family
ID=51351505
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014021856A Pending JP2014220231A (ja) | 2013-02-15 | 2014-02-07 | 温度制御機能を備えるマルチプレナムシャワーヘッド |
| JP2018087939A Pending JP2018160462A (ja) | 2013-02-15 | 2018-05-01 | 温度制御機能を備えるマルチプレナムシャワーヘッド |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018087939A Pending JP2018160462A (ja) | 2013-02-15 | 2018-05-01 | 温度制御機能を備えるマルチプレナムシャワーヘッド |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20140235069A1 (https=) |
| JP (2) | JP2014220231A (https=) |
| KR (1) | KR20140103080A (https=) |
| SG (1) | SG2014011712A (https=) |
| TW (2) | TW201828361A (https=) |
Families Citing this family (73)
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| US12281385B2 (en) * | 2015-06-15 | 2025-04-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gas dispenser and deposition apparatus using the same |
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-
2013
- 2013-07-03 US US13/934,620 patent/US20140235069A1/en not_active Abandoned
-
2014
- 2014-02-07 JP JP2014021856A patent/JP2014220231A/ja active Pending
- 2014-02-10 SG SG2014011712A patent/SG2014011712A/en unknown
- 2014-02-14 TW TW107110096A patent/TW201828361A/zh unknown
- 2014-02-14 TW TW103104956A patent/TWI626685B/zh active
- 2014-02-14 KR KR20140017451A patent/KR20140103080A/ko not_active Withdrawn
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2018
- 2018-05-01 JP JP2018087939A patent/JP2018160462A/ja active Pending
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