JP2014199457A5 - - Google Patents

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Publication number
JP2014199457A5
JP2014199457A5 JP2014112840A JP2014112840A JP2014199457A5 JP 2014199457 A5 JP2014199457 A5 JP 2014199457A5 JP 2014112840 A JP2014112840 A JP 2014112840A JP 2014112840 A JP2014112840 A JP 2014112840A JP 2014199457 A5 JP2014199457 A5 JP 2014199457A5
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JP
Japan
Prior art keywords
adhesive
workpiece
bonding
workpieces
pair
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JP2014112840A
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English (en)
Japanese (ja)
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JP2014199457A (ja
JP6026463B2 (ja
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Publication of JP2014199457A5 publication Critical patent/JP2014199457A5/ja
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JP2014112840A 2014-05-30 2014-05-30 貼合ワークの製造装置及び貼合ワークの製造方法 Active JP6026463B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014112840A JP6026463B2 (ja) 2014-05-30 2014-05-30 貼合ワークの製造装置及び貼合ワークの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014112840A JP6026463B2 (ja) 2014-05-30 2014-05-30 貼合ワークの製造装置及び貼合ワークの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2010219946A Division JP5558993B2 (ja) 2010-09-29 2010-09-29 接着剤供給装置及び接着剤供給方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016076174A Division JP6161759B2 (ja) 2016-04-05 2016-04-05 貼合ワークの製造装置及び貼合ワークの製造方法

Publications (3)

Publication Number Publication Date
JP2014199457A JP2014199457A (ja) 2014-10-23
JP2014199457A5 true JP2014199457A5 (enExample) 2015-01-08
JP6026463B2 JP6026463B2 (ja) 2016-11-16

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ID=52356352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014112840A Active JP6026463B2 (ja) 2014-05-30 2014-05-30 貼合ワークの製造装置及び貼合ワークの製造方法

Country Status (1)

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JP (1) JP6026463B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6722744B2 (ja) * 2018-11-15 2020-07-15 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 接着剤塗布装置
CN117690810A (zh) * 2023-12-11 2024-03-12 安徽丰芯半导体有限公司 一种保证芯片贴合均匀度的芯片覆晶工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2908259B2 (ja) * 1994-12-09 1999-06-21 ウシオ電機株式会社 液晶パネルの貼り合わせ方法および装置
JP2003005194A (ja) * 2001-06-25 2003-01-08 Shimadzu Corp シール剤塗布装置、液晶滴下貼り合わせ装置および液晶パネル製造方法
JP2003093945A (ja) * 2001-09-27 2003-04-02 Shimadzu Corp シール剤塗布装置
JP2004170526A (ja) * 2002-11-18 2004-06-17 Tokyo Electron Ltd 液晶表示素子の製造方法及び液晶表示素子の製造装置
WO2005118159A1 (ja) * 2004-06-03 2005-12-15 Shibaura Mechatronics Corporation 樹脂層形成方法及び樹脂層形成装置、ディスク及びディスク製造方法
WO2008038414A1 (fr) * 2006-09-28 2008-04-03 Shibaura Mechatronics Corporation Procédé et appareil de liaison
JP5139736B2 (ja) * 2007-06-27 2013-02-06 東レエンジニアリング株式会社 液晶部品の製造方法および製造装置
WO2009054168A1 (ja) * 2007-10-22 2009-04-30 Sharp Kabushiki Kaisha 表示装置及びその製造方法

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