JP2014187269A5 - - Google Patents
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- Publication number
- JP2014187269A5 JP2014187269A5 JP2013062009A JP2013062009A JP2014187269A5 JP 2014187269 A5 JP2014187269 A5 JP 2014187269A5 JP 2013062009 A JP2013062009 A JP 2013062009A JP 2013062009 A JP2013062009 A JP 2013062009A JP 2014187269 A5 JP2014187269 A5 JP 2014187269A5
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- JP
- Japan
- Prior art keywords
- substrate
- film
- dielectric constant
- stacked
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims 13
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000012528 membrane Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013062009A JP6092676B2 (ja) | 2013-03-25 | 2013-03-25 | 半導体装置の製造方法、基板処理装置及びプログラム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013062009A JP6092676B2 (ja) | 2013-03-25 | 2013-03-25 | 半導体装置の製造方法、基板処理装置及びプログラム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014187269A JP2014187269A (ja) | 2014-10-02 |
| JP2014187269A5 true JP2014187269A5 (enExample) | 2016-05-19 |
| JP6092676B2 JP6092676B2 (ja) | 2017-03-08 |
Family
ID=51834508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013062009A Active JP6092676B2 (ja) | 2013-03-25 | 2013-03-25 | 半導体装置の製造方法、基板処理装置及びプログラム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6092676B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101753658B1 (ko) * | 2015-10-22 | 2017-07-05 | (주)티티에스 | 정전척 |
| JP2020035869A (ja) | 2018-08-29 | 2020-03-05 | キオクシア株式会社 | マスク材、および半導体装置の製造方法 |
| KR102199999B1 (ko) * | 2020-10-08 | 2021-01-08 | 주식회사 유진테크 머티리얼즈 | 표면 보호 물질을 이용한 박막 형성 방법 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002280380A (ja) * | 2001-03-19 | 2002-09-27 | Japan Science & Technology Corp | 半導体装置の成膜方法 |
| JP3748218B2 (ja) * | 2001-09-10 | 2006-02-22 | 日本電信電話株式会社 | Ｍｉｓ型半導体装置の製造方法 |
| JP2007258286A (ja) * | 2006-03-22 | 2007-10-04 | Tokyo Electron Ltd | 熱処理装置、熱処理方法及び記憶媒体 |
| JP2010278190A (ja) * | 2009-05-28 | 2010-12-09 | Konica Minolta Holdings Inc | 薄膜トランジスタの製造方法、金属酸化物半導体薄膜及び薄膜トランジスタ |
| JP2011035158A (ja) * | 2009-07-31 | 2011-02-17 | Renesas Electronics Corp | 半導体装置の製造方法 |
| JP2012104703A (ja) * | 2010-11-11 | 2012-05-31 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法および基板処理装置 |
| CN102446741B (zh) * | 2010-10-07 | 2016-01-20 | 株式会社日立国际电气 | 半导体器件制造方法、衬底处理装置和半导体器件 |
| JP5214774B2 (ja) * | 2010-11-19 | 2013-06-19 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
| JP2012174764A (ja) * | 2011-02-18 | 2012-09-10 | Hitachi Kokusai Electric Inc | 基板処理装置及び半導体装置の製造方法 |
| JP5615207B2 (ja) * | 2011-03-03 | 2014-10-29 | 株式会社東芝 | 半導体装置の製造方法 |
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2013
- 2013-03-25 JP JP2013062009A patent/JP6092676B2/ja active Active