JP2014177704A5 - - Google Patents

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Publication number
JP2014177704A5
JP2014177704A5 JP2014051819A JP2014051819A JP2014177704A5 JP 2014177704 A5 JP2014177704 A5 JP 2014177704A5 JP 2014051819 A JP2014051819 A JP 2014051819A JP 2014051819 A JP2014051819 A JP 2014051819A JP 2014177704 A5 JP2014177704 A5 JP 2014177704A5
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JP
Japan
Prior art keywords
void
coupon
area
hole
copper
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JP2014051819A
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English (en)
Japanese (ja)
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JP6423601B2 (ja
JP2014177704A (ja
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Priority claimed from US13/829,433 external-priority patent/US20140262801A1/en
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Publication of JP2014177704A publication Critical patent/JP2014177704A/ja
Publication of JP2014177704A5 publication Critical patent/JP2014177704A5/ja
Application granted granted Critical
Publication of JP6423601B2 publication Critical patent/JP6423601B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014051819A 2013-03-14 2014-03-14 スルーホールのフィリング方法 Expired - Fee Related JP6423601B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/829,433 US20140262801A1 (en) 2013-03-14 2013-03-14 Method of filling through-holes
US13/829,433 2013-03-14

Publications (3)

Publication Number Publication Date
JP2014177704A JP2014177704A (ja) 2014-09-25
JP2014177704A5 true JP2014177704A5 (https=) 2018-06-14
JP6423601B2 JP6423601B2 (ja) 2018-11-14

Family

ID=50396860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014051819A Expired - Fee Related JP6423601B2 (ja) 2013-03-14 2014-03-14 スルーホールのフィリング方法

Country Status (6)

Country Link
US (1) US20140262801A1 (https=)
EP (1) EP2778261B1 (https=)
JP (1) JP6423601B2 (https=)
KR (1) KR20140113549A (https=)
CN (2) CN110087406A (https=)
TW (1) TWI506165B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10154598B2 (en) * 2014-10-13 2018-12-11 Rohm And Haas Electronic Materials Llc Filling through-holes
CN104762643A (zh) * 2014-12-17 2015-07-08 安捷利电子科技（苏州）有限公司 一种通孔、盲孔和线路共镀的镀铜药水
JP6948053B2 (ja) * 2017-01-12 2021-10-13 上村工業株式会社 フィリングめっきシステム及びフィリングめっき方法
CN109327975A (zh) 2017-07-31 2019-02-12 奥特斯奥地利科技与系统技术有限公司 用于部件承载件中的孔的无缺陷铜填充的方法和镀覆装置
US20190136397A1 (en) * 2017-11-08 2019-05-09 Rohm And Haas Electronic Materials Llc Electroplated copper
TWI703148B (zh) * 2017-11-08 2020-09-01 美商羅門哈斯電子材料有限公司 銅電鍍組合物及在基板上電鍍銅之方法
US11152294B2 (en) 2018-04-09 2021-10-19 Corning Incorporated Hermetic metallized via with improved reliability
WO2020061437A1 (en) 2018-09-20 2020-03-26 Industrial Technology Research Institute Copper metallization for through-glass vias on thin glass
WO2020171940A1 (en) 2019-02-21 2020-08-27 Corning Incorporated Glass or glass ceramic articles with copper-metallized through holes and processes for making the same
CN111867269A (zh) * 2020-06-01 2020-10-30 东莞市斯坦得电子材料有限公司 高频板导通孔的除油整孔剂的制作工艺及其除油整孔过程
JP7274221B2 (ja) * 2020-11-11 2023-05-16 メック株式会社 エッチング剤及び回路基板の製造方法
US20220213610A1 (en) * 2021-01-06 2022-07-07 Rohm And Haas Electronic Materials Llc Photoresist resolution capabilities by copper electroplating anisotropically
CN112921367A (zh) * 2021-01-22 2021-06-08 盐城市贝加尔电子材料有限公司 一种用于高密度比孔径线路板通孔电镀的镀铜工艺
CN113668022A (zh) * 2021-06-21 2021-11-19 上海天承化学有限公司 一种电镀液及其电镀方法和应用
CN115087250A (zh) * 2022-07-14 2022-09-20 珠海中京电子电路有限公司 对接钻批量报废的检查方法、装置、设备及存储介质
CN115074789B (zh) * 2022-08-22 2022-11-25 深圳市板明科技股份有限公司 一种线路板盲孔快速填充电镀铜溶液及快速填充方法
CN117488377B (zh) * 2023-12-29 2024-04-05 上海尚容电子科技有限公司 一种电镀用整平剂的制备方法及其应用

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