JP2015063755A5 - - Google Patents

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Publication number
JP2015063755A5
JP2015063755A5 JP2014180021A JP2014180021A JP2015063755A5 JP 2015063755 A5 JP2015063755 A5 JP 2015063755A5 JP 2014180021 A JP2014180021 A JP 2014180021A JP 2014180021 A JP2014180021 A JP 2014180021A JP 2015063755 A5 JP2015063755 A5 JP 2015063755A5
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JP
Japan
Prior art keywords
hydrogen
alkyl
hydroxyl
dielectric
substrate
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Application number
JP2014180021A
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English (en)
Japanese (ja)
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JP2015063755A (ja
JP6444663B2 (ja
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Publication of JP2015063755A publication Critical patent/JP2015063755A/ja
Publication of JP2015063755A5 publication Critical patent/JP2015063755A5/ja
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Publication of JP6444663B2 publication Critical patent/JP6444663B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014180021A 2013-09-04 2014-09-04 アルカリに安定なピリミジン誘導体含有触媒による誘電体の無電解メタライゼーション Expired - Fee Related JP6444663B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361873389P 2013-09-04 2013-09-04
US61/873,389 2013-09-04

Publications (3)

Publication Number Publication Date
JP2015063755A JP2015063755A (ja) 2015-04-09
JP2015063755A5 true JP2015063755A5 (https=) 2018-10-25
JP6444663B2 JP6444663B2 (ja) 2018-12-26

Family

ID=51494103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014180021A Expired - Fee Related JP6444663B2 (ja) 2013-09-04 2014-09-04 アルカリに安定なピリミジン誘導体含有触媒による誘電体の無電解メタライゼーション

Country Status (5)

Country Link
EP (1) EP2845922A1 (https=)
JP (1) JP6444663B2 (https=)
KR (1) KR20150027726A (https=)
CN (1) CN104513974B (https=)
TW (1) TWI567233B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384081B (zh) * 2008-06-13 2013-02-01 China Steel Corp Manufacture of Medium Carbon and Sulfur Series Fast Cutting Steel
JP6479641B2 (ja) * 2015-12-11 2019-03-06 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP6563324B2 (ja) * 2015-12-11 2019-08-21 東京エレクトロン株式会社 基板処理装置および基板処理方法
US20170251557A1 (en) * 2016-02-29 2017-08-31 Rohm And Haas Electronic Materials Llc Horizontal method of electroless metal plating of substrates with ionic catalysts
TWI638821B (zh) * 2016-08-24 2018-10-21 李長榮化學工業股份有限公司 金屬觸媒及其製備與應用
CN106435543B (zh) * 2016-09-21 2018-07-06 芜湖扬展新材料科技服务有限公司 航空钛合金的制备方法
KR102662397B1 (ko) * 2018-10-23 2024-05-02 솔브레인 주식회사 전기도금 조성물 및 전기도금 방법
US20210140051A1 (en) * 2019-11-11 2021-05-13 Rohm And Haas Electronic Materials Llc Electroless copper plating and counteracting passivation
CN113445031B (zh) * 2021-06-24 2022-07-08 广东硕成科技股份有限公司 一种金属活性剂及其制备方法
CN120924953B (zh) * 2025-08-06 2026-03-17 深圳市天熙科技开发有限公司 用于6g通讯的极低粗糙度的化学银镀液及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2116389C3 (de) 1971-03-30 1980-04-03 Schering Ag, 1000 Berlin Und 4619 Bergkamen Lösung zur Aktivierung von Oberflächen für die Metallisierung
DE3149919A1 (de) * 1981-12-11 1983-06-23 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zum haftfesten metallisieren von polyimid
DE3328765A1 (de) * 1983-08-05 1985-02-14 Schering AG, 1000 Berlin und 4709 Bergkamen Loesung zur vorbehandlung von polyimid
US4976990A (en) * 1986-09-30 1990-12-11 Macdermid, Incorporated Process for metallizing non-conductive substrates
GB8725148D0 (en) * 1987-10-27 1987-12-02 Omi International Gb Ltd Catalyst
US5503877A (en) 1989-11-17 1996-04-02 Atotech Deutschalnd Gmbh Complex oligomeric or polymeric compounds for the generation of metal seeds on a substrate
JP3892730B2 (ja) * 2002-01-30 2007-03-14 関東化学株式会社 無電解金めっき液
JP2004190075A (ja) * 2002-12-10 2004-07-08 Kanto Chem Co Inc 無電解金めっき液
JP5434222B2 (ja) * 2009-04-17 2014-03-05 コニカミノルタ株式会社 金属パターン形成方法および金属パターン
JP5780920B2 (ja) * 2011-10-31 2015-09-16 新光電気工業株式会社 無電解銅めっき浴

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