JP2014169475A5 - - Google Patents

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Publication number
JP2014169475A5
JP2014169475A5 JP2013041493A JP2013041493A JP2014169475A5 JP 2014169475 A5 JP2014169475 A5 JP 2014169475A5 JP 2013041493 A JP2013041493 A JP 2013041493A JP 2013041493 A JP2013041493 A JP 2013041493A JP 2014169475 A5 JP2014169475 A5 JP 2014169475A5
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JP
Japan
Prior art keywords
plating
substrate
substrate holder
japanese patent
holding
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JP2013041493A
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English (en)
Japanese (ja)
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JP6077886B2 (ja
JP2014169475A (ja
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Priority claimed from JP2013041493A external-priority patent/JP6077886B2/ja
Priority to JP2013041493A priority Critical patent/JP6077886B2/ja
Application filed filed Critical
Priority to US14/194,514 priority patent/US9624594B2/en
Priority to TW103107008A priority patent/TWI598472B/zh
Priority to KR1020140025107A priority patent/KR102080207B1/ko
Publication of JP2014169475A publication Critical patent/JP2014169475A/ja
Publication of JP2014169475A5 publication Critical patent/JP2014169475A5/ja
Publication of JP6077886B2 publication Critical patent/JP6077886B2/ja
Application granted granted Critical
Priority to US15/450,873 priority patent/US10077504B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013041493A 2013-03-04 2013-03-04 めっき装置 Expired - Fee Related JP6077886B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013041493A JP6077886B2 (ja) 2013-03-04 2013-03-04 めっき装置
US14/194,514 US9624594B2 (en) 2013-03-04 2014-02-28 Plating apparatus
TW103107008A TWI598472B (zh) 2013-03-04 2014-03-03 鍍敷裝置
KR1020140025107A KR102080207B1 (ko) 2013-03-04 2014-03-03 도금 장치
US15/450,873 US10077504B2 (en) 2013-03-04 2017-03-06 Plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013041493A JP6077886B2 (ja) 2013-03-04 2013-03-04 めっき装置

Publications (3)

Publication Number Publication Date
JP2014169475A JP2014169475A (ja) 2014-09-18
JP2014169475A5 true JP2014169475A5 (enExample) 2015-11-19
JP6077886B2 JP6077886B2 (ja) 2017-02-08

Family

ID=51420276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013041493A Expired - Fee Related JP6077886B2 (ja) 2013-03-04 2013-03-04 めっき装置

Country Status (4)

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US (2) US9624594B2 (enExample)
JP (1) JP6077886B2 (enExample)
KR (1) KR102080207B1 (enExample)
TW (1) TWI598472B (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6239417B2 (ja) 2014-03-24 2017-11-29 株式会社荏原製作所 基板処理装置
US10024613B2 (en) * 2014-07-24 2018-07-17 Stoneage, Inc. Flexible tube cleaning lance positioner frame apparatus
EP3172519B1 (en) 2014-07-24 2018-07-18 Stoneage, Inc. Flexible tube cleaning lance positioner frame apparatus
JP2016089204A (ja) * 2014-10-31 2016-05-23 ダイハツ工業株式会社 電着塗装設備
JP6675257B2 (ja) * 2016-04-14 2020-04-01 株式会社荏原製作所 めっき装置及びめっき方法
KR102421298B1 (ko) * 2016-09-08 2022-07-15 가부시키가이샤 에바라 세이사꾸쇼 기판 홀더, 도금 장치, 기판 홀더의 제조 방법 및 기판을 유지하는 방법
US11769686B2 (en) 2016-09-29 2023-09-26 Intel Corporation Methods and apparatus for electroless plating dispense
TW201836720A (zh) * 2016-12-19 2018-10-16 英商Ｐ２Ｉ有限公司 關於表面改質之改良
JP6727117B2 (ja) * 2016-12-22 2020-07-22 株式会社荏原製作所 基板着脱装置、めっき装置、基板着脱装置の制御装置、基板着脱装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体
JP6860406B2 (ja) 2017-04-05 2021-04-14 株式会社荏原製作所 半導体製造装置、半導体製造装置の故障予知方法、および半導体製造装置の故障予知プログラム
JP6979900B2 (ja) * 2018-02-13 2021-12-15 株式会社荏原製作所 基板保持部材、基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
JP6971922B2 (ja) * 2018-06-27 2021-11-24 株式会社荏原製作所 基板ホルダ
JP7100556B2 (ja) * 2018-10-05 2022-07-13 株式会社荏原製作所 基板ホルダに基板を保持させるためおよび／又は基板ホルダによる基板の保持を解除するための装置、および同装置を有するめっき装置
CN109706510B (zh) * 2019-03-12 2020-10-02 苏州台祥机电设备有限公司 一种电镀挂具的自动搬运方法
CN110066981B (zh) * 2019-06-17 2023-11-28 浙江晶驰光电科技有限公司 正装基片定位装置及基片装载方法
PT3758049T (pt) * 2019-06-26 2022-03-21 Atotech Deutschland Gmbh & Co Kg Dispositivo e método para mover um objeto para uma estação de processamento, sistema de transporte e aparelho de processamento
PT3761348T (pt) 2019-07-05 2024-07-02 Atotech Deutschland Gmbh & Co Kg Sistema para transportar um substrato entre estações de processamento de um aparelho de processamento, aparelho de processamento e métodos de manusear um substrato
CN114342569A (zh) 2019-08-19 2022-04-12 德国艾托特克有限两合公司 高密度互连印刷电路板的制造顺序及高密度互连印刷电路板
JP7264780B2 (ja) * 2019-09-10 2023-04-25 株式会社荏原製作所 基板ホルダ及びそれを備えた基板めっき装置、並びに電気接点
CN110408981A (zh) * 2019-09-11 2019-11-05 河南理工大学 一种微导线的电镀连接装置
US11713932B2 (en) 2020-08-18 2023-08-01 Stoneage, Inc. Flexible tube cleaning lance positioner frame apparatus
CN112259493A (zh) * 2020-10-19 2021-01-22 绍兴同芯成集成电路有限公司 一种超薄晶圆电镀、化镀整合工艺
CN112442725B (zh) * 2020-11-27 2024-05-24 京东方科技集团股份有限公司 电化学沉积设备组和电化学沉积方法
EP4295390A1 (en) * 2021-02-22 2023-12-27 Evatec AG Vacuum treatment apparatus and methods for manufacturing vacuum treated substrates
JP7580417B2 (ja) * 2022-01-28 2024-11-11 三菱電機株式会社 電気的特性試験装置

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US3979847A (en) 1975-04-25 1976-09-14 Y-Tex Corporation Method for installing identification tag and tool therefor
JPS5811420A (ja) * 1981-07-14 1983-01-22 Hitachi Ltd めつき装置
JP2528942B2 (ja) * 1988-06-30 1996-08-28 株式会社中央製作所 めっき装置のハンガ―移送機構
JPH07299427A (ja) 1995-03-09 1995-11-14 Seiko Epson Corp ワーク洗浄方法および洗浄装置
US5976198A (en) * 1995-06-09 1999-11-02 Dainippon Screen Mfg. Co., Ltd. Substrate transfer and bath apparatus
US6068002A (en) * 1997-04-02 2000-05-30 Tokyo Electron Limited Cleaning and drying apparatus, wafer processing system and wafer processing method
KR100804714B1 (ko) 2000-03-17 2008-02-18 가부시키가이샤 에바라 세이사꾸쇼 도금장치 및 방법
JP4124327B2 (ja) * 2002-06-21 2008-07-23 株式会社荏原製作所 基板ホルダ及びめっき装置
JP3827627B2 (ja) * 2002-08-13 2006-09-27 株式会社荏原製作所 めっき装置及びめっき方法
US8655472B2 (en) * 2010-01-12 2014-02-18 Ebara Corporation Scheduler, substrate processing apparatus, and method of transferring substrates in substrate processing apparatus
JP5750327B2 (ja) * 2010-10-21 2015-07-22 株式会社荏原製作所 めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法
TWI580814B (zh) * 2010-10-21 2017-05-01 荏原製作所股份有限公司 基板處理裝置，以及鍍覆裝置及鍍覆方法
JP5795965B2 (ja) * 2011-05-30 2015-10-14 株式会社荏原製作所 めっき装置
TWI485286B (zh) * 2011-11-16 2015-05-21 荏原製作所股份有限公司 Electroless plating and electroless plating

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