JP2014150439A - 高周波半導体スイッチおよび無線機器 - Google Patents
高周波半導体スイッチおよび無線機器 Download PDFInfo
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- JP2014150439A JP2014150439A JP2013018606A JP2013018606A JP2014150439A JP 2014150439 A JP2014150439 A JP 2014150439A JP 2013018606 A JP2013018606 A JP 2013018606A JP 2013018606 A JP2013018606 A JP 2013018606A JP 2014150439 A JP2014150439 A JP 2014150439A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- 230000005540 biological transmission Effects 0.000 claims description 14
- 230000015556 catabolic process Effects 0.000 claims description 8
- 238000003780 insertion Methods 0.000 abstract description 16
- 230000037431 insertion Effects 0.000 abstract description 16
- 238000010586 diagram Methods 0.000 description 10
- 230000001413 cellular effect Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 101710118890 Photosystem II reaction center protein Ycf12 Proteins 0.000 description 1
- 241000099989 Tanvia Species 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
- H03K17/693—Switching arrangements with several input- or output-terminals, e.g. multiplexers, distributors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7831—Field effect transistors with field effect produced by an insulated gate with multiple gate structure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/10—Modifications for increasing the maximum permissible switched voltage
- H03K17/102—Modifications for increasing the maximum permissible switched voltage in field-effect transistor switches
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/50—Circuits using different frequencies for the two directions of communication
- H04B1/52—Hybrid arrangements, i.e. arrangements for transition from single-path two-direction transmission to single-direction transmission on each of two paths or vice versa
Abstract
【解決手段】実施形態の高周波半導体スイッチ1は、端子T1へ、高周波信号が入力または出力され、端子T21〜T2xへ、高周波信号が入力または出力される。スルーFET群A 11は、直列に接続されたn個のMOSFET TA1〜TAnにより構成され、一端が端子T1へ接続される。x個のスルーFET群B 21〜2xは、それぞれが直列に接続されたm個のMOSFET TB1〜TBmにより構成され、それぞれの一端が端子T21〜T2xへ接続され、それぞれの他端がスルーFET群A 11の他端へ共通に接続される。シャントFET群31〜3xは、端子T21〜T2xと接地端子との間に複数のMOSFET TS1〜TSkが直列に接続される。
【選択図】 図1
Description
図1は、実施形態の高周波半導体スイッチの構成の例を示す回路図である。
m=Vin/(y・Vbk)
とする必要がある。
m=14
と求められる。
VA=xCB/(CA+xCB)・Vin
となる。
VdsB≦VdsA≦Vbk
とする必要がある。
VA≦(n/m)×(Vin/y)
となる。
VA=xCB/(CA+xCB)・Vinである。
CA=(WgA/n)・Coff、CB=(WgB/m)・Coffと表される。
n≧m・{y−WgA/(x・WgB)}
とする必要がある。
n≧6
とする必要がある。
11 スルーFET群A
21〜2x スルーFET群B
31〜3x シャントFET群
40 SP12Tスイッチ
50 無線機器
51 アンテナ
52a〜52f 送信回路
53a〜53f 受信回路
54 無線制御回路54
T1、T21〜T2x 端子
TA1〜TAn、TB1〜TBm、TS1〜TSk MOSFET
Claims (7)
- 第1の端子と、
複数の第2の端子と、
直列に接続されたMOSFETにより構成され、一端が前記第1の端子へ接続される第1のスルーFET群と、
それぞれが直列に接続されたMOSFETにより構成され、それぞれの一端が前記第2の端子へ接続され、それぞれの他端が前記第1のスルーFET群の他端へ共通に接続される複数の第2のスルーFET群と、
前記第2の端子と接地端子との間に複数のMOSFETが直列に接続されたシャントFET群と
を備えることを特徴とする高周波半導体スイッチ。 - 前記第1のスルーFET群を構成する前記MOSFETの個数がnであり、
前記第2のスルーFET群を構成する前記MOSFETの個数がmであり、
前記第2のスルーFET群の個数がxであり、
前記MOSFETの個数mが、前記第1のスルーFET群が導通状態で前記第2のスルーFET群が非導通状態のときに、前記第2のスルーFET群の前記MOSFETのソース・ドレイン間電圧がブレークダウン電圧を超えないように決定され、
前記MOSFETの個数nが、前記第1のスルーFET群および前記第2のスルーFET群が非導通状態のときに、前記第1のスルーFET群の前記MOSFETのソース・ドレイン間電圧がブレークダウン電圧を超えないように、前記xおよび前記mの値にもとづいて決定される
ことを特徴とする請求項1に記載の高周波半導体スイッチ。 - 前記第2のスルーFET群の前記MOSFETのソース・ドレイン間に印加される最大電圧のブレークダウン電圧に対する比をyとし、
前記第1のスルーFET群の前記MOSFETのゲート幅をWgA、
前記第2のスルーFET群の前記MOSFETのゲート幅をWgB
として、
前記nの値が、
n≧m・{y−WgA/(x・WgB)}
を満足するように決定される
ことを特徴とする請求項2に記載の高周波半導体スイッチ。 - 前記第1のスルーFET群の前記MOSFETの前記ゲート幅と前記第2のスルーFET群の前記MOSFETの前記ゲート幅が等しい
ことを特徴とする請求項3に記載の高周波半導体スイッチ。 - 前記第1のスルーFET群、前記第2のスルーFET群および前記シャントFET群の前記MOSFETが、SOI上に形成された完全空乏型MOSFETであり、バックゲートが電気的にフローティングである
ことを特徴とする請求項1乃至4のいずれか1項に記載の高周波半導体スイッチ。 - 電波を放射し受信するアンテナと、
前記アンテナを介して送信する送信回路と、
前記アンテナを介して受信した信号を復調する受信回路と、
前記アンテナが前記第1の端子に接続され、前記送信回路および前記受信回路がそれぞれ前記第2の端子に接続され、前記アンテナを前記送信回路または前記受信回路に切り替えて接続する請求項1乃至5のいずれか1項に記載の高周波半導体スイッチと、
前記高周波半導体スイッチに端子切り替え信号を出力する無線制御回路と、
を備えることを特徴とする無線機器。 - 前記送信回路および前記受信回路が、送受信回路として一体化されている
ことを特徴とする請求項6に記載の無線機器。
Priority Applications (4)
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JP2013018606A JP5997624B2 (ja) | 2013-02-01 | 2013-02-01 | 高周波半導体スイッチおよび無線機器 |
US13/931,522 US9209800B2 (en) | 2013-02-01 | 2013-06-28 | High freuency semiconductor switch and wireless device |
CN201310351389.XA CN103973280A (zh) | 2013-02-01 | 2013-08-13 | 高频半导体开关及无线设备 |
US14/928,879 US9461643B2 (en) | 2013-02-01 | 2015-10-30 | High freuency semiconductor switch and wireless device |
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JP2013018606A JP5997624B2 (ja) | 2013-02-01 | 2013-02-01 | 高周波半導体スイッチおよび無線機器 |
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JP2014150439A true JP2014150439A (ja) | 2014-08-21 |
JP5997624B2 JP5997624B2 (ja) | 2016-09-28 |
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Cited By (1)
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---|---|---|---|---|
WO2022239601A1 (ja) * | 2021-05-14 | 2022-11-17 | 株式会社村田製作所 | スイッチ装置およびフロントエンド回路 |
Families Citing this family (8)
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US9667246B2 (en) * | 2013-10-04 | 2017-05-30 | Peregrine Semiconductor Corporation | Optimized RF switching device architecture for impedance control applications |
US20160191085A1 (en) * | 2014-08-13 | 2016-06-30 | Skyworks Solutions, Inc. | Transmit front end module for dual antenna applications |
US9831869B2 (en) | 2015-01-30 | 2017-11-28 | Peregrine Semiconductor Corporation | Radio frequency switching circuit with distributed switches |
US9685946B2 (en) | 2015-01-30 | 2017-06-20 | Peregrine Semiconductor Corporation | Radio frequency switching circuit with distributed switches |
TWI547091B (zh) * | 2015-02-17 | 2016-08-21 | 絡達科技股份有限公司 | 可降低訊號損失的天線切換裝置 |
JP2016174236A (ja) * | 2015-03-16 | 2016-09-29 | 株式会社東芝 | 半導体装置 |
CN108229038B (zh) * | 2018-01-10 | 2021-05-25 | 西北核技术研究所 | 三电极场畸变气体开关的模型构建方法和导通过程模拟方法 |
WO2024073556A1 (en) * | 2022-09-30 | 2024-04-04 | Psemi Corporation | Methods and devices to control radiated spurious emission in rf antenna switches |
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JP2012134317A (ja) * | 2010-12-21 | 2012-07-12 | Toshiba Corp | 半導体装置 |
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JP4960414B2 (ja) | 2009-08-31 | 2012-06-27 | 株式会社東芝 | 半導体スイッチ |
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- 2013-02-01 JP JP2013018606A patent/JP5997624B2/ja active Active
- 2013-06-28 US US13/931,522 patent/US9209800B2/en active Active
- 2013-08-13 CN CN201310351389.XA patent/CN103973280A/zh active Pending
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2015
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JP2005515657A (ja) * | 2001-10-10 | 2005-05-26 | ペレグリン セミコンダクター コーポレーション | スイッチ回路および高周波信号のスイッチング方法 |
JP2009038500A (ja) * | 2007-07-31 | 2009-02-19 | Samsung Electro Mech Co Ltd | スイッチ回路 |
JP2012134317A (ja) * | 2010-12-21 | 2012-07-12 | Toshiba Corp | 半導体装置 |
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US9209800B2 (en) | 2015-12-08 |
CN103973280A (zh) | 2014-08-06 |
US20160056819A1 (en) | 2016-02-25 |
US20140220909A1 (en) | 2014-08-07 |
US9461643B2 (en) | 2016-10-04 |
JP5997624B2 (ja) | 2016-09-28 |
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