JP2014139132A - 圧電セラミック電子部品、及び圧電セラミック電子部品の製造方法 - Google Patents
圧電セラミック電子部品、及び圧電セラミック電子部品の製造方法 Download PDFInfo
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Abstract
【解決手段】圧電磁器組成物が、一般式[100{(1-x)(K1-a-bNaaLib)(Nb1-cTac)O3−xM2M4O3}+αMn+βM4}(0.005≦x≦0.1、0≦a≦0.9、0≦b≦0.1、0≦a+b≦0.9、0≦c≦0.3、2≦α≦15、0.1≦β≦5.0)で表され、内部電極3はNiを主成分としている。圧電セラミック素体1は、内部電極3と上記圧電磁器組成物からなる圧電セラミック層とが還元雰囲気下、共焼結されてなる。
【選択図】図1
Description
+αMn+βM4 …(A)
0≦a≦0.9 …(2)
0≦b≦0.1 …(3)
0≦a+b≦0.9 …(4)
0≦c≦0.3 …(5)
2≦α≦15 …(6)
0.1≦β≦5.0 …(7)
KNbO3系化合物にM2M4O3を固溶させて主成分を形成することにより、良好な圧電特性を得ることができる。しかしながら、主成分中のM2M4O3の固溶モル比xが0.005未満の場合は、M2M4O3の固溶量が少な過ぎるため、所望の圧電特性を得ることができない。一方、前記固溶モル比xが0.1を超えた場合は、M2M4O3の固溶量が過剰となり、圧電特性の低下を招くおそれがある。
KNbO3系化合物のKサイトを構成するKの一部を、必要に応じてNaやLiなどの他のアルカリ金属と置換するのも好ましい。しかしながら、Naの置換モル比aが0.9を超える場合や、Liの置換モル比bが0.1を超える場合、又はこれら両者の置換モル比の総計(a+b)が0.9を超えると圧電特性の低下を招く。
KNbO3系化合物のNbの一部を、必要に応じてTaと置換するのも好ましい。しかしながら、Taの置換モル比aが0.3を超えると圧電特性の低下を招く。
上述したように主成分にMnを含有させることにより、特定4価元素M4の添加効果と相俟って還元雰囲気での焼結性を改善することが可能となる。しかし、Mnの含有モル量αが主成分100モルに対して2モル未満の場合は、Mnの添加効果を発揮することができず、焼結不良が生じて絶縁抵抗が低下し、分極不良を招くおそれがある。一方、Mnの含有モル量αが主成分100モルに対して15モルを超えて過剰になると、圧電特性の低下を招くおそれがある。
主成分中の特定4価元素M4とは別途に前記主成分に特定4価元素M4を含有させることにより、Mnの添加効果と相俟って還元雰囲気での焼結性を改善することが可能となる。しかし、特定4価元素M4の含有モル量βが主成分100モルに対して0.1モル未満の場合は、特定4価元素M4の添加効果を発揮することができず、焼結不良が生じて絶縁抵抗が低下し、分極不良を招くおそれがある。一方、特定4価元素M4の含有モル量βが主成分100モルに対して5.0モルを超えて過剰になると、圧電特性の低下を招くおそれがある。
+αMn+βM4+γNi …(C)
+αMn+βM4+δM3 …(D)
+αMn+βM4+γNi+δM3 …(E)
2a、2b 外部電極
3a〜3g 内部電極
Claims (8)
- 内部電極と圧電セラミック層とが交互に積層されて焼結されてなる圧電セラミック素体を備え、該圧電セラミック素体の表面に外部電極が形成された圧電セラミック電子部品において、
前記内部電極が、Niを主成分とすると共に、
前記圧電セラミック層が、一般式[100{(1-x)(K 1-a-b Na a Li b )(Nb 1-c Ta c )O 3 −xM2M4O 3 }+αMn+βM4](ただし、x、a、b、c、α、及びβは、それぞれ0.005≦x≦0.1、0≦a≦0.9、0≦b≦0.1、0≦a+b≦0.9、0≦c≦0.3、2≦α≦15、0.1≦β≦5.0である。)で表される圧電磁器組成物で形成されていることを特徴とする圧電セラミック電子部品。 - 前記圧電セラミック層と前記内部電極とが、還元雰囲気下、共焼結されてなることを特徴とする請求項1記載の圧電セラミック電子部品。
- 前記圧電セラミック層は、Niが、一般式{(1-x)(K 1-a-b Na a Li b )(Nb 1-c Ta c )O 3 −xM2M4O 3 }で表される主成分100モルに対し0.1〜5.0モルの範囲で含有されていることを特徴とする請求項1又は請求項2記載の圧電セラミック電子部品。
- 前記圧電セラミック層は、Sc、In、Yb、Y、Nd、Eu、Gd、Dy、Sm、Ho、Er、Tb、Lu、La、及びPrの群から選択された少なくとも1種の元素M3が、前記主成分100モルに対し0.1〜5.0モルの範囲で含有されていることを特徴とする請求項1乃至請求項3のいずれかに記載の圧電セラミック電子部品。
- セラミック素原料としてKを含有したK化合物、Nbを含有したNb化合物、Mnを含有したMn化合物、Ca、Ba、及びSrのうちの少なくともいずれか1種の元素M2を含有したM2化合物、Zr、Sn、及びHfのうちの少なくともいずれか1種の元素M4を含有したM4化合物を用意し、一般式[100{(1-x)(K 1-a-b Na a Li b )(Nb 1-c Ta c )O 3 −xM2M4O 3 }+αMn+βM4](ただし、x、a、b、c、α、及びβは、それぞれ0.005≦x≦0.1、0≦a≦0.9、0≦b≦0.1、0≦a+b≦0.9、0≦c≦0.3、2≦α≦15、0.1≦β≦5.0である。)を満足するように、前記セラミック素原料を秤量し、調合する調合工程と、
前記調合されたセラミック素原料からセラミックグリーンシートを作製するセラミックグリーンシート作製工程と、
Niを主成分とした導電性ペーストを作製する導電性ペースト作製工程と、
前記導電性ペーストを使用して前記セラミックグリーンシート上に所定形状の導電層を形成する導電層形成工程と、
前記導電層が形成されたセラミックグリーンシートを積層しセラミック積層体を形成する積層体形成工程と、
前記セラミック積層体を還元雰囲気下、焼成し、前記導電層と前記セラミックグリーンシートとを共焼結させる焼成工程とを含んでいることを特徴とする圧電セラミック電子部品の製造方法。 - 前記調合工程は、一般式{(1-x)(K 1-a-b Na a Li b )(Nb 1-c Ta c )O 3 −xM2M4O 3 }で表される主成分に対しMnを添加すると共に、化学量論比よりも過剰となるように前記主成分中の元素M4に加え更に前記元素M4を添加することを特徴とする請求項5記載のセラミック電子部品の製造方法。
- 前記調合工程は、一般式{(1-x)(K 1-a-b Na a Li b )(Nb 1-c Ta c )O 3 −xM2M4O 3 }で表される主成分100モルに対し、焼結後のNi含有量が0.1〜5.0モルとなるように、Niを含有したNi化合物を添加することを特徴とする請求項5又は請求項6記載の圧電セラミック電子部品の製造方法。
- 前記調合工程は、一般式{(1-x)(K 1-a-b Na a Li b )(Nb 1-c Ta c )O 3 −xM2M4O 3 }で表される主成分100モルに対し、Sc、In、Yb、Y、Nd、Eu、Gd、Dy、Sm、Ho、Er、Tb、Lu、La、及びPrの群から選択された少なくとも1種の元素M3が、焼結後に0.1〜5.0モルの含有量となるように、前記元素M3を含有したM3化合物を添加することを特徴とする請求項5乃至請求項7のいずれかに記載の圧電セラミック電子部品の製造方法。
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