JP2014120778A5 - - Google Patents

Download PDF

Info

Publication number
JP2014120778A5
JP2014120778A5 JP2013258482A JP2013258482A JP2014120778A5 JP 2014120778 A5 JP2014120778 A5 JP 2014120778A5 JP 2013258482 A JP2013258482 A JP 2013258482A JP 2013258482 A JP2013258482 A JP 2013258482A JP 2014120778 A5 JP2014120778 A5 JP 2014120778A5
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
device package
package according
ceramic layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013258482A
Other languages
English (en)
Japanese (ja)
Other versions
JP6457713B2 (ja
JP2014120778A (ja
Filing date
Publication date
Priority claimed from KR1020120146331A external-priority patent/KR102007404B1/ko
Application filed filed Critical
Publication of JP2014120778A publication Critical patent/JP2014120778A/ja
Publication of JP2014120778A5 publication Critical patent/JP2014120778A5/ja
Application granted granted Critical
Publication of JP6457713B2 publication Critical patent/JP6457713B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013258482A 2012-12-14 2013-12-13 発光素子パッケージ Active JP6457713B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0146331 2012-12-14
KR1020120146331A KR102007404B1 (ko) 2012-12-14 2012-12-14 발광소자 패키지

Publications (3)

Publication Number Publication Date
JP2014120778A JP2014120778A (ja) 2014-06-30
JP2014120778A5 true JP2014120778A5 (ko) 2017-01-26
JP6457713B2 JP6457713B2 (ja) 2019-01-23

Family

ID=49759174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013258482A Active JP6457713B2 (ja) 2012-12-14 2013-12-13 発光素子パッケージ

Country Status (5)

Country Link
US (1) US9437791B2 (ko)
EP (1) EP2744001A3 (ko)
JP (1) JP6457713B2 (ko)
KR (1) KR102007404B1 (ko)
CN (1) CN103872211B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140039740A (ko) * 2012-09-25 2014-04-02 엘지이노텍 주식회사 발광소자 패키지
KR20160017849A (ko) * 2014-08-06 2016-02-17 서울바이오시스 주식회사 고출력 발광 장치 및 그 제조 방법
CN104465950A (zh) * 2014-12-02 2015-03-25 深圳市华星光电技术有限公司 一种发光二极管以及发光二极管的制造方法
JP2016138901A (ja) * 2015-01-26 2016-08-04 株式会社日立エルジーデータストレージ 光モジュール、及び走査型画像表示装置
DE102015205354A1 (de) * 2015-03-24 2016-09-29 Osram Gmbh Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe
CN106486590A (zh) * 2015-08-26 2017-03-08 深圳市斯迈得半导体有限公司 一种通用于应用线材焊线技术中的混合焊线装置
US20170356640A1 (en) * 2016-06-10 2017-12-14 Innotec, Corp. Illumination assembly including thermal energy management
CN106601701B (zh) * 2017-01-19 2023-03-28 贵州煜立电子科技有限公司 大功率二端表面引出脚电子元器件立体封装方法及结构
DE102017117165B4 (de) * 2017-07-28 2023-04-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil und Verfahren zur Herstellung eines elektronischen Bauteils
CN107644894B (zh) * 2017-09-18 2023-11-24 京东方科技集团股份有限公司 一种有机电致发光器件、其制备方法及显示装置
JP2020025034A (ja) * 2018-08-08 2020-02-13 ローム株式会社 Ｌｅｄパッケージ、ｌｅｄ表示装置
CN109713107A (zh) * 2018-12-13 2019-05-03 佛山市国星光电股份有限公司 支架结构、led器件和灯组阵列

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417392A (en) * 1980-05-15 1983-11-29 Cts Corporation Process of making multi-layer ceramic package
JPS6457725A (en) 1987-08-28 1989-03-06 Taiyo Yuden Kk Wire bonding method
US6071371A (en) * 1998-02-02 2000-06-06 Delco Electronics Corporation Method of simultaneously attaching surface-mount and chip-on-board dies to a circuit board
JP3490906B2 (ja) * 1998-09-22 2004-01-26 日亜化学工業株式会社 半導体装置及びその製造方法
JP2000236040A (ja) * 1999-02-15 2000-08-29 Hitachi Ltd 半導体装置
JP4908669B2 (ja) * 2000-04-27 2012-04-04 ローム株式会社 チップ型発光素子
JP2006032804A (ja) 2004-07-20 2006-02-02 Koha Co Ltd 発光装置およびその製造方法
JP2006128511A (ja) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd 発光素子用セラミック基板
JP2006303419A (ja) * 2004-12-03 2006-11-02 Ngk Spark Plug Co Ltd セラミック基板
JP2006303069A (ja) 2005-04-19 2006-11-02 Sumitomo Metal Electronics Devices Inc 発光素子搭載用パッケージ
JP2007088220A (ja) * 2005-09-22 2007-04-05 Renesas Technology Corp 半導体装置の製造方法
JP4804109B2 (ja) * 2005-10-27 2011-11-02 京セラ株式会社 発光素子用配線基板および発光装置並びに発光素子用配線基板の製造方法
SG135066A1 (en) * 2006-02-20 2007-09-28 Micron Technology Inc Semiconductor device assemblies including face-to-face semiconductor dice, systems including such assemblies, and methods for fabricating such assemblies
JP2008041811A (ja) * 2006-08-03 2008-02-21 Ngk Spark Plug Co Ltd 配線基板および多数個取り配線基板ならびにその製造方法
JP2008135526A (ja) 2006-11-28 2008-06-12 Kyocera Corp 発光素子用連結基板および発光装置連結基板
US8021931B2 (en) * 2006-12-11 2011-09-20 Stats Chippac, Inc. Direct via wire bonding and method of assembling the same
US20080179618A1 (en) * 2007-01-26 2008-07-31 Ching-Tai Cheng Ceramic led package
US20080197461A1 (en) * 2007-02-15 2008-08-21 Taiwan Semiconductor Manufacturing Co.,Ltd. Apparatus for wire bonding and integrated circuit chip package
JP4177874B2 (ja) 2007-03-28 2008-11-05 京セラ株式会社 発光装置
JP2008288536A (ja) * 2007-05-21 2008-11-27 Panasonic Electric Works Co Ltd 表面実装型セラミック基板
JP5224802B2 (ja) * 2007-09-29 2013-07-03 京セラ株式会社 発光素子収納用パッケージ、発光装置ならびに発光素子収納用パッケージおよび発光装置の製造方法
JP2009094213A (ja) * 2007-10-05 2009-04-30 Panasonic Electric Works Co Ltd 発光装置
US20100072511A1 (en) * 2008-03-25 2010-03-25 Lin Charles W C Semiconductor chip assembly with copper/aluminum post/base heat spreader
JP2009239116A (ja) * 2008-03-27 2009-10-15 Sharp Corp 発光装置
JP2010073747A (ja) * 2008-09-16 2010-04-02 Sharp Corp ワイヤボンディング方法及び半導体装置
US8089086B2 (en) * 2009-10-19 2012-01-03 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light source
US8354743B2 (en) * 2010-01-27 2013-01-15 Honeywell International Inc. Multi-tiered integrated circuit package
JP2011205009A (ja) * 2010-03-26 2011-10-13 Kyocera Corp 表面実装型発光素子用配線基板および発光装置
CN102479907B (zh) * 2010-11-30 2015-01-07 展晶科技(深圳)有限公司 发光二极管封装结构
KR20120069291A (ko) * 2010-12-20 2012-06-28 삼성엘이디 주식회사 발광다이오드 패키지
KR101805118B1 (ko) * 2011-05-30 2017-12-05 엘지이노텍 주식회사 발광소자패키지

Similar Documents

Publication Publication Date Title
JP2014120778A5 (ko)
JP2015226056A5 (ko)
JP2018509758A5 (ko)
JP2015173289A5 (ko)
JP2013219357A5 (ko)
JP2013046072A5 (ko)
JP2016082231A5 (ko)
JP2016163045A5 (ko)
JP2008227531A5 (ko)
JP2018014335A5 (ko)
JP2014053606A5 (ko)
JP2014068013A5 (ko)
JP2014220542A5 (ko)
JP2013084878A5 (ko)
JP2016092411A5 (ko)
JP2013175748A5 (ko)
JP2012244170A5 (ko)
JP2010147281A5 (ja) 半導体装置
JP2010267789A5 (ko)
JP2016039365A5 (ko)
JP2020526004A5 (ko)
JP2018046255A5 (ko)
JP2018509770A5 (ko)
JP2014039039A5 (ko)
JP2012028429A5 (ja) 半導体装置