JP2014086563A - 電子部品 - Google Patents
電子部品 Download PDFInfo
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- JP2014086563A JP2014086563A JP2012234302A JP2012234302A JP2014086563A JP 2014086563 A JP2014086563 A JP 2014086563A JP 2012234302 A JP2012234302 A JP 2012234302A JP 2012234302 A JP2012234302 A JP 2012234302A JP 2014086563 A JP2014086563 A JP 2014086563A
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- Prior art keywords
- external terminal
- terminal member
- plating film
- electronic component
- outer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000007747 plating Methods 0.000 claims abstract description 50
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 230000002093 peripheral effect Effects 0.000 claims abstract description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000010931 gold Substances 0.000 claims abstract description 10
- 229910052737 gold Inorganic materials 0.000 claims abstract description 10
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052718 tin Inorganic materials 0.000 claims abstract description 6
- 239000003990 capacitor Substances 0.000 claims description 26
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 6
- 239000005486 organic electrolyte Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 24
- 238000003892 spreading Methods 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 239000008151 electrolyte solution Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- -1 polypropylene Polymers 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011149 active material Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/74—Terminals, e.g. extensions of current collectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/78—Cases; Housings; Encapsulations; Mountings
- H01G11/80—Gaskets; Sealings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/78—Cases; Housings; Encapsulations; Mountings
- H01G11/82—Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
【解決手段】外部端子部材23の露出部27が、ニッケル系金属からなる下地めっき膜32と、下地めっき膜32の上に形成される金または錫系金属からなる外層めっき膜33と、によって与えられる。外層めっき膜33は、厚みの比較的薄い領域36が厚みの比較的厚い領域37を取り囲むように形成される。薄い領域36では、はんだ濡れ性の良好な金属自体の量が少なく、また、下地めっき膜32が酸化されやすい。その結果、外部端子部材23の露出部27の周縁部では、はんだ濡れ性が低下し、はんだの濡れ広がりを抑制することができる。
【選択図】図3
Description
[実施例] 板材として、厚さ0.5mmのアルミニウム板を用意し、その一方主面にジンケート処理を施した後、下地めっき膜として、厚さ0.66μmの無光沢ニッケルめっき膜を形成し、その上に、外層めっき膜として、厚さ0.15μmの金めっき膜を形成した。その後、図3を参照して説明したプレス成形等を実施することにより、実施例に係る外部端子部材を得た。
上記の実施例および比較例の各々に係る外部端子部材における金めっき膜について、X線分析顕微鏡によりチャートを測定し、検出された元素ピークから膜厚を算出した。膜厚は、図4(A)のa、b、c、d、e、fに相当する箇所について、それぞれ算出した。その結果が表1に示されている。
周縁部の膜厚が中央部の膜厚に比べて半分以下と薄くなっていた。
平面寸法が102mm×102mmで、厚みが0.635mmのアルミナからなるリフロー用基板を用意し、実施例および比較例の各々に係る外部端子部材を、各々の露出部を上方に向けた状態で、リフロー用基板上に耐熱性両面粘着テープを用いて固定した。
12 コンデンサ素子(素子本体)
14 ケース
19,20 素子端子
21 本体部
22 蓋部
23,24 外部端子部材
25 絶縁部
27,28 露出部
31 板材
32 下地めっき膜
33 外層めっき膜
34 上型
35 下型
36 厚みの比較的薄い領域
37 厚みの比較的厚い領域
38 亀裂
Claims (5)
- 導電性金属からなる外部端子部材と、前記外部端子部材の所定の面側を外部に対する露出部としながら、当該外部端子部材に接する絶縁部と、を備え、前記外部端子部材の前記露出部にはんだが付与されることによって実装される、電子部品であって、
前記外部端子部材の前記露出部は、ニッケルまたはニッケル合金からなる下地めっき膜と、前記下地めっき膜の上に形成される金もしくは錫またはこれら金属の少なくとも一方を含む合金からなる外層めっき膜と、によって与えられ、
前記外層めっき膜は、その厚みの比較的薄い領域がその厚みの比較的厚い領域を取り囲むように形成されている、
電子部品。 - 前記外層めっき膜は、前記薄い領域において、亀裂を有する、請求項1に記載の電子部品。
- 前記外層めっき膜の厚み方向に測定した前記外部端子部材の厚みは、中央部に比べて、周縁部の方が小さい、請求項1または2に記載の電子部品。
- さらに、前記外部端子部材に電気的に接続される素子本体と、前記素子本体を収容するケースと、を備え、前記絶縁部は前記ケースの少なくとも一部を構成する、請求項1ないし3のいずれかに記載の電子部品。
- 当該電子部品が、有機系電解液を使用する電気二重層コンデンサである、請求項1ないし4のいずれかに記載の電子部品。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012234302A JP5673650B2 (ja) | 2012-10-24 | 2012-10-24 | 電子部品 |
US14/051,556 US9779886B2 (en) | 2012-10-24 | 2013-10-11 | Electronic component |
CN201310503960.5A CN103779109B (zh) | 2012-10-24 | 2013-10-23 | 电子部件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012234302A JP5673650B2 (ja) | 2012-10-24 | 2012-10-24 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014086563A true JP2014086563A (ja) | 2014-05-12 |
JP5673650B2 JP5673650B2 (ja) | 2015-02-18 |
Family
ID=50485108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012234302A Active JP5673650B2 (ja) | 2012-10-24 | 2012-10-24 | 電子部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9779886B2 (ja) |
JP (1) | JP5673650B2 (ja) |
CN (1) | CN103779109B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11830672B2 (en) | 2016-11-23 | 2023-11-28 | KYOCERA AVX Components Corporation | Ultracapacitor for use in a solder reflow process |
US11247538B2 (en) | 2016-12-22 | 2022-02-15 | Zeon Corporation | Laminated glass |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61107751A (ja) * | 1984-10-30 | 1986-05-26 | Nec Kansai Ltd | 樹脂モ−ルド型半導体装置 |
JP2000294454A (ja) * | 1999-04-08 | 2000-10-20 | Seiko Instruments Inc | 電気二重層キャパシタ |
JP2003342782A (ja) * | 2002-05-23 | 2003-12-03 | Fuji Denshi Kogyo Kk | ストライプめっき条及びストライプめっき方法 |
JP2004153141A (ja) * | 2002-10-31 | 2004-05-27 | Ngk Spark Plug Co Ltd | セラミック配線基板、それを用いた部品実装済み配線基板、及びそれらの製造方法 |
JP2005033131A (ja) * | 2003-07-11 | 2005-02-03 | Denso Corp | 半導体装置 |
JP2010135474A (ja) * | 2008-12-03 | 2010-06-17 | Ngk Spark Plug Co Ltd | 多層配線基板及びその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6861588B2 (en) * | 2002-07-16 | 2005-03-01 | Murata Manufacturing Co., Ltd. | Laminated ceramic electronic component and method of producing the same |
JP2005183373A (ja) * | 2003-11-27 | 2005-07-07 | Kyocera Corp | 電池用ケース、その製造方法および電池ならびに電気二重層キャパシタ用ケース、その製造方法および電気二重層キャパシタ |
JP2005166975A (ja) * | 2003-12-03 | 2005-06-23 | Sanyo Electric Co Ltd | 電気二重層コンデンサ、電解質電池及びこれらの製造方法 |
US20110102972A1 (en) | 2009-11-05 | 2011-05-05 | Samsung Elctro-Mechanics Co., Ltd. | Chip-type electric double layer capacitor cell and method of manufacturing the same |
JP2012156298A (ja) | 2011-01-26 | 2012-08-16 | Sanken Electric Co Ltd | Dc/dcコンバータモジュール |
-
2012
- 2012-10-24 JP JP2012234302A patent/JP5673650B2/ja active Active
-
2013
- 2013-10-11 US US14/051,556 patent/US9779886B2/en active Active
- 2013-10-23 CN CN201310503960.5A patent/CN103779109B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61107751A (ja) * | 1984-10-30 | 1986-05-26 | Nec Kansai Ltd | 樹脂モ−ルド型半導体装置 |
JP2000294454A (ja) * | 1999-04-08 | 2000-10-20 | Seiko Instruments Inc | 電気二重層キャパシタ |
JP2003342782A (ja) * | 2002-05-23 | 2003-12-03 | Fuji Denshi Kogyo Kk | ストライプめっき条及びストライプめっき方法 |
JP2004153141A (ja) * | 2002-10-31 | 2004-05-27 | Ngk Spark Plug Co Ltd | セラミック配線基板、それを用いた部品実装済み配線基板、及びそれらの製造方法 |
JP2005033131A (ja) * | 2003-07-11 | 2005-02-03 | Denso Corp | 半導体装置 |
JP2010135474A (ja) * | 2008-12-03 | 2010-06-17 | Ngk Spark Plug Co Ltd | 多層配線基板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US9779886B2 (en) | 2017-10-03 |
US20140111907A1 (en) | 2014-04-24 |
CN103779109B (zh) | 2017-01-04 |
CN103779109A (zh) | 2014-05-07 |
JP5673650B2 (ja) | 2015-02-18 |
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