JP2014005464A5 - - Google Patents

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Publication number
JP2014005464A5
JP2014005464A5 JP2013116277A JP2013116277A JP2014005464A5 JP 2014005464 A5 JP2014005464 A5 JP 2014005464A5 JP 2013116277 A JP2013116277 A JP 2013116277A JP 2013116277 A JP2013116277 A JP 2013116277A JP 2014005464 A5 JP2014005464 A5 JP 2014005464A5
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JP
Japan
Prior art keywords
resin composition
insulating layer
mass
pigment
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013116277A
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English (en)
Japanese (ja)
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JP2014005464A (ja
JP5904160B2 (ja
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Publication date
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Priority to JP2013116277A priority Critical patent/JP5904160B2/ja
Priority claimed from JP2013116277A external-priority patent/JP5904160B2/ja
Publication of JP2014005464A publication Critical patent/JP2014005464A/ja
Publication of JP2014005464A5 publication Critical patent/JP2014005464A5/ja
Application granted granted Critical
Publication of JP5904160B2 publication Critical patent/JP5904160B2/ja
Active legal-status Critical Current
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JP2013116277A 2012-05-31 2013-05-31 樹脂組成物 Active JP5904160B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013116277A JP5904160B2 (ja) 2012-05-31 2013-05-31 樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012124032 2012-05-31
JP2012124032 2012-05-31
JP2013116277A JP5904160B2 (ja) 2012-05-31 2013-05-31 樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016048374A Division JP6217775B2 (ja) 2012-05-31 2016-03-11 樹脂組成物

Publications (3)

Publication Number Publication Date
JP2014005464A JP2014005464A (ja) 2014-01-16
JP2014005464A5 true JP2014005464A5 (enExample) 2015-07-16
JP5904160B2 JP5904160B2 (ja) 2016-04-13

Family

ID=49982577

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013116277A Active JP5904160B2 (ja) 2012-05-31 2013-05-31 樹脂組成物
JP2016048374A Active JP6217775B2 (ja) 2012-05-31 2016-03-11 樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016048374A Active JP6217775B2 (ja) 2012-05-31 2016-03-11 樹脂組成物

Country Status (3)

Country Link
JP (2) JP5904160B2 (enExample)
KR (2) KR102018392B1 (enExample)
TW (2) TW201817807A (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6458921B2 (ja) * 2014-02-26 2019-01-30 インテル・コーポレーション 硬化性エポキシ組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体
JP6269294B2 (ja) * 2014-04-24 2018-01-31 味の素株式会社 プリント配線板の絶縁層用樹脂組成物
TWI668269B (zh) * 2014-06-30 2019-08-11 日商味之素股份有限公司 Resin composition
KR102330406B1 (ko) * 2015-07-06 2021-11-23 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 그것을 사용한 프리프레그, 레진 시트, 적층판, 및 프린트 배선판
US10869390B2 (en) * 2015-07-06 2020-12-15 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminate, and printed circuit board
JP6867131B2 (ja) * 2015-09-30 2021-04-28 積水化学工業株式会社 積層体及び積層体の製造方法
WO2018124158A1 (ja) * 2016-12-28 2018-07-05 三菱瓦斯化学株式会社 プリプレグ、積層板、金属箔張積層板、プリント配線板、及び多層プリント配線板
CN110168015A (zh) 2017-03-14 2019-08-23 三井金属矿业株式会社 树脂组合物、带树脂铜箔、介电层、覆铜层压板、电容器元件以及内置电容器的印刷电路板
US11548977B2 (en) 2017-06-21 2023-01-10 Dic Corporation Active ester resin and composition and cured product using the same
US11407708B2 (en) 2017-06-21 2022-08-09 Dic Corporation Active ester compound and composition and cured product obtained using the same
JP7210901B2 (ja) 2017-06-26 2023-01-24 味の素株式会社 樹脂組成物層
JP6904125B2 (ja) 2017-07-18 2021-07-14 味の素株式会社 樹脂組成物
JP6859916B2 (ja) 2017-10-13 2021-04-14 味の素株式会社 樹脂組成物層
JP7185519B2 (ja) * 2017-12-25 2022-12-07 太陽インキ製造株式会社 熱硬化性樹脂充填材、その硬化物および多層プリント配線板
JP7296191B2 (ja) 2018-01-09 2023-06-22 味の素株式会社 硬化性樹脂組成物、樹脂シート、プリント配線板及び半導体装置
CN111936526B (zh) 2018-03-29 2022-09-30 Dic株式会社 固化性组合物及其固化物
US11901249B2 (en) 2018-03-29 2024-02-13 Dic Corporation Curable composition and cured product thereof
US11873356B2 (en) 2018-03-29 2024-01-16 Dic Corporation Curable composition and cured product thereof
JP7238374B2 (ja) * 2018-12-12 2023-03-14 株式会社レゾナック 封止用樹脂組成物及び半導体装置
JP7443778B2 (ja) * 2020-01-16 2024-03-06 株式会社レゾナック 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法
JP7540164B2 (ja) * 2020-02-18 2024-08-27 住友ベークライト株式会社 封止用樹脂組成物および電子装置
JP7388235B2 (ja) 2020-02-20 2023-11-29 味の素株式会社 樹脂組成物
JP7658250B2 (ja) * 2021-11-02 2025-04-08 味の素株式会社 樹脂組成物
WO2023199738A1 (ja) * 2022-04-11 2023-10-19 株式会社Adeka 組成物及び硬化物
JP7752918B2 (ja) 2022-09-13 2025-10-14 信越化学工業株式会社 ボンディングフィルム用硬化性樹脂組成物、ボンディングフィルム及びプリント配線板
JP7683584B2 (ja) * 2022-10-14 2025-05-27 味の素株式会社 樹脂組成物
JP2024163031A (ja) * 2023-05-10 2024-11-21 味の素株式会社 樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1171501A (ja) * 1997-08-29 1999-03-16 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた硬化物
JPH11130939A (ja) * 1997-10-29 1999-05-18 Hitachi Chem Co Ltd エポキシ樹脂組成物及びそれを用いた硬化物
JP2008121010A (ja) 2006-10-20 2008-05-29 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP2009231790A (ja) * 2008-02-27 2009-10-08 Ajinomoto Co Inc 多層プリント配線板の製造方法
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
TWI540170B (zh) * 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
JP2013023666A (ja) * 2011-07-25 2013-02-04 Sekisui Chem Co Ltd エポキシ樹脂材料、硬化物及びプラズマ粗化処理硬化物
JP6026095B2 (ja) * 2011-10-31 2016-11-16 太陽インキ製造株式会社 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板

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