JP2013539238A - オプトエレクトロニクス半導体コンポーネント及びその製造方法 - Google Patents

オプトエレクトロニクス半導体コンポーネント及びその製造方法 Download PDF

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Publication number
JP2013539238A
JP2013539238A JP2013532182A JP2013532182A JP2013539238A JP 2013539238 A JP2013539238 A JP 2013539238A JP 2013532182 A JP2013532182 A JP 2013532182A JP 2013532182 A JP2013532182 A JP 2013532182A JP 2013539238 A JP2013539238 A JP 2013539238A
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glass
support
phosphor
optoelectronic semiconductor
semiconductor component
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JP2013532182A
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Japanese (ja)
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JP2013539238A5 (enExample
Inventor
エーバーハート アンゲラ
ヒュッティンガー ローラント
シュミット ラインホルト
コッター シュテファン
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Osram GmbH
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Osram GmbH
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Publication of JP2013539238A5 publication Critical patent/JP2013539238A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies

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JP2013532182A 2010-10-08 2011-10-05 オプトエレクトロニクス半導体コンポーネント及びその製造方法 Pending JP2013539238A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010042217.7 2010-10-08
DE102010042217A DE102010042217A1 (de) 2010-10-08 2010-10-08 Optoelektronisches Halbleiterbauelement und Verfahren zu seiner Herstellung
PCT/EP2011/067381 WO2012045772A1 (de) 2010-10-08 2011-10-05 Optoelektronisches halbleiterbauelement und verfahren zu seiner herstellung

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JP2013539238A true JP2013539238A (ja) 2013-10-17
JP2013539238A5 JP2013539238A5 (enExample) 2014-09-04

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JP2013532182A Pending JP2013539238A (ja) 2010-10-08 2011-10-05 オプトエレクトロニクス半導体コンポーネント及びその製造方法
JP2015047523A Active JP6009020B2 (ja) 2010-10-08 2015-03-10 オプトエレクトロニクス半導体コンポーネント及びその製造方法

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Country Link
US (1) US20130207151A1 (enExample)
EP (1) EP2625724B1 (enExample)
JP (2) JP2013539238A (enExample)
KR (1) KR101845840B1 (enExample)
CN (1) CN103155187B (enExample)
DE (1) DE102010042217A1 (enExample)
WO (1) WO2012045772A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015521791A (ja) * 2012-06-15 2015-07-30 オスラム ゲーエムベーハーＯＳＲＡＭ ＧｍｂＨ オプトエレクトロニクス半導体素子
JP2015147705A (ja) * 2014-02-06 2015-08-20 日本電気硝子株式会社 ガラス部材及びその製造方法
JP2016066764A (ja) * 2014-09-26 2016-04-28 日本電気硝子株式会社 波長変換部材及びそれを用いた発光装置
JP2020035891A (ja) * 2018-08-30 2020-03-05 日亜化学工業株式会社 発光装置
JP2022031731A (ja) * 2018-08-06 2022-02-22 日亜化学工業株式会社 発光装置及びその製造方法

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US20150083967A1 (en) 2012-04-24 2015-03-26 Koha Co., Ltd. Phosphor, Method for Manufacturing same, and light-emitting device
KR101964418B1 (ko) * 2012-07-02 2019-04-01 엘지이노텍 주식회사 형광체 조성물 및 이를 포함하는 조명 장치
DE102012107290A1 (de) 2012-08-08 2014-02-13 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil, Konversionsmittelplättchen und Verfahren zur Herstellung eines Konversionsmittelplättchens
DE102012107797A1 (de) * 2012-08-23 2014-02-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements und Licht emittierendes Halbleiterbauelement
DE102012108160A1 (de) * 2012-09-03 2014-03-06 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
DE102012110668A1 (de) * 2012-11-07 2014-05-08 Osram Opto Semiconductors Gmbh Konvertermaterial, Verfahren zur Herstellung eines Konvertermaterials und optoelektronisches Bauelement
DE102012220980A1 (de) * 2012-11-16 2014-05-22 Osram Gmbh Optoelektronisches halbleiterbauelement
JP7068771B2 (ja) * 2013-07-08 2022-05-17 ルミレッズ ホールディング ベーフェー 波長変換式半導体発光デバイス
CN103489857B (zh) * 2013-09-06 2017-06-06 中山市天健照明电器有限公司 一种白光led发光装置
EP3092666B1 (en) * 2014-01-07 2019-08-28 Lumileds Holding B.V. Glueless light emitting device with phosphor converter
JP2015142046A (ja) * 2014-01-29 2015-08-03 シャープ株式会社 波長変換部材、発光装置、および波長変換部材の製造方法
JP2017188592A (ja) 2016-04-06 2017-10-12 日亜化学工業株式会社 発光装置
DE102017104134A1 (de) * 2017-02-28 2018-08-30 Osram Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
CN110612001B (zh) * 2018-06-14 2023-06-30 因特瓦克公司 多色介电涂层及uv喷墨打印
US10475968B1 (en) 2018-07-19 2019-11-12 Osram Opto Semiconductors Gmbh Optoelectronic component and a method for producing an optoelectronic component
WO2023072867A1 (en) * 2021-10-29 2023-05-04 Ams-Osram International Gmbh Optoelectronic semiconductor chip, optoelectronic component and method for producing an optoelectronic semiconductor chip

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JP2006037097A (ja) * 2004-06-09 2006-02-09 Lumileds Lighting Us Llc 作成済み波長変換素子を有する半導体発光装置
JP2007039303A (ja) * 2005-06-29 2007-02-15 Nippon Electric Glass Co Ltd 発光色変換部材
JP2007258228A (ja) * 2006-03-20 2007-10-04 Ngk Insulators Ltd 発光ダイオード素子用拡散板、発光ダイオード素子用拡散板構造および発光ダイオード装置
JP2008166740A (ja) * 2006-11-28 2008-07-17 Cree Inc 固体発光ダイの光学的プリフォーム並びにその作製および組み立ての方法及びシステム

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US20030102473A1 (en) * 2001-08-15 2003-06-05 Motorola, Inc. Structure and method for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate
DE102004019802B4 (de) * 2004-03-11 2007-01-25 Schott Ag Verwendung eines lumineszierenden Glases als Konversionsmedium zur Erzeugung von weißem Licht
US8324641B2 (en) * 2007-06-29 2012-12-04 Ledengin, Inc. Matrix material including an embedded dispersion of beads for a light-emitting device
US8134292B2 (en) * 2004-10-29 2012-03-13 Ledengin, Inc. Light emitting device with a thermal insulating and refractive index matching material
DE102005023134A1 (de) * 2005-05-19 2006-11-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Lumineszenzkonversions-LED
JP2007048864A (ja) * 2005-08-09 2007-02-22 Nippon Electric Glass Co Ltd 蛍光体複合材料
JP2007191702A (ja) * 2005-12-22 2007-08-02 Nippon Electric Glass Co Ltd 発光色変換材料
US8481977B2 (en) * 2006-03-24 2013-07-09 Goldeneye, Inc. LED light source with thermally conductive luminescent matrix
JP4978886B2 (ja) * 2006-06-14 2012-07-18 日本電気硝子株式会社 蛍光体複合材料及び蛍光体複合部材
DE102007057812A1 (de) * 2007-11-30 2009-06-25 Schott Ag Lichtemittierende Vorrichtung und Verfahren zu deren Herstellung sowie Lichtkonverter und dessen Verwendung
US20090200561A1 (en) * 2008-01-30 2009-08-13 Burrell Anthony K Composite phosphors based on coating porous substrates
DE102008021666A1 (de) * 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh Lichtemittierende Vorrichtung und Verfahren zur Herstellung einer lichtemittierenden Vorrichtung
DE102010009456A1 (de) 2010-02-26 2011-09-01 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement mit einem Halbleiterchip und einem Konversionselement und Verfahren zu dessen Herstellung

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2006037097A (ja) * 2004-06-09 2006-02-09 Lumileds Lighting Us Llc 作成済み波長変換素子を有する半導体発光装置
JP2007039303A (ja) * 2005-06-29 2007-02-15 Nippon Electric Glass Co Ltd 発光色変換部材
JP2007258228A (ja) * 2006-03-20 2007-10-04 Ngk Insulators Ltd 発光ダイオード素子用拡散板、発光ダイオード素子用拡散板構造および発光ダイオード装置
JP2008166740A (ja) * 2006-11-28 2008-07-17 Cree Inc 固体発光ダイの光学的プリフォーム並びにその作製および組み立ての方法及びシステム

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015521791A (ja) * 2012-06-15 2015-07-30 オスラム ゲーエムベーハーＯＳＲＡＭ ＧｍｂＨ オプトエレクトロニクス半導体素子
US10297729B2 (en) 2012-06-15 2019-05-21 Osram Opto Semiconductors Gmbh Optoelectronics semiconductor component
JP2015147705A (ja) * 2014-02-06 2015-08-20 日本電気硝子株式会社 ガラス部材及びその製造方法
JP2016066764A (ja) * 2014-09-26 2016-04-28 日本電気硝子株式会社 波長変換部材及びそれを用いた発光装置
JP2022031731A (ja) * 2018-08-06 2022-02-22 日亜化学工業株式会社 発光装置及びその製造方法
JP7217412B2 (ja) 2018-08-06 2023-02-03 日亜化学工業株式会社 発光装置及びその製造方法
JP2020035891A (ja) * 2018-08-30 2020-03-05 日亜化学工業株式会社 発光装置
US11043610B2 (en) 2018-08-30 2021-06-22 Nichia Corporation Light-emitting device
US11626536B2 (en) 2018-08-30 2023-04-11 Nichia Corporation Light-emitting device

Also Published As

Publication number Publication date
WO2012045772A1 (de) 2012-04-12
DE102010042217A1 (de) 2012-04-12
CN103155187B (zh) 2016-12-07
JP2015109483A (ja) 2015-06-11
KR101845840B1 (ko) 2018-04-06
US20130207151A1 (en) 2013-08-15
KR20130114671A (ko) 2013-10-17
JP6009020B2 (ja) 2016-10-19
EP2625724B1 (de) 2016-11-30
CN103155187A (zh) 2013-06-12
EP2625724A1 (de) 2013-08-14

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