JP2013539238A5 - - Google Patents

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Publication number
JP2013539238A5
JP2013539238A5 JP2013532182A JP2013532182A JP2013539238A5 JP 2013539238 A5 JP2013539238 A5 JP 2013539238A5 JP 2013532182 A JP2013532182 A JP 2013532182A JP 2013532182 A JP2013532182 A JP 2013532182A JP 2013539238 A5 JP2013539238 A5 JP 2013539238A5
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JP
Japan
Prior art keywords
glass
support
semiconductor component
optoelectronic semiconductor
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013532182A
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English (en)
Japanese (ja)
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JP2013539238A (ja
Filing date
Publication date
Priority claimed from DE102010042217A external-priority patent/DE102010042217A1/de
Application filed filed Critical
Publication of JP2013539238A publication Critical patent/JP2013539238A/ja
Publication of JP2013539238A5 publication Critical patent/JP2013539238A5/ja
Pending legal-status Critical Current

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JP2013532182A 2010-10-08 2011-10-05 オプトエレクトロニクス半導体コンポーネント及びその製造方法 Pending JP2013539238A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010042217.7 2010-10-08
DE102010042217A DE102010042217A1 (de) 2010-10-08 2010-10-08 Optoelektronisches Halbleiterbauelement und Verfahren zu seiner Herstellung
PCT/EP2011/067381 WO2012045772A1 (de) 2010-10-08 2011-10-05 Optoelektronisches halbleiterbauelement und verfahren zu seiner herstellung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015047523A Division JP6009020B2 (ja) 2010-10-08 2015-03-10 オプトエレクトロニクス半導体コンポーネント及びその製造方法

Publications (2)

Publication Number Publication Date
JP2013539238A JP2013539238A (ja) 2013-10-17
JP2013539238A5 true JP2013539238A5 (enExample) 2014-09-04

Family

ID=44764153

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013532182A Pending JP2013539238A (ja) 2010-10-08 2011-10-05 オプトエレクトロニクス半導体コンポーネント及びその製造方法
JP2015047523A Active JP6009020B2 (ja) 2010-10-08 2015-03-10 オプトエレクトロニクス半導体コンポーネント及びその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015047523A Active JP6009020B2 (ja) 2010-10-08 2015-03-10 オプトエレクトロニクス半導体コンポーネント及びその製造方法

Country Status (7)

Country Link
US (1) US20130207151A1 (enExample)
EP (1) EP2625724B1 (enExample)
JP (2) JP2013539238A (enExample)
KR (1) KR101845840B1 (enExample)
CN (1) CN103155187B (enExample)
DE (1) DE102010042217A1 (enExample)
WO (1) WO2012045772A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150083967A1 (en) 2012-04-24 2015-03-26 Koha Co., Ltd. Phosphor, Method for Manufacturing same, and light-emitting device
DE102012210083A1 (de) 2012-06-15 2013-12-19 Osram Gmbh Optoelektronisches halbleiterbauelement
KR101964418B1 (ko) * 2012-07-02 2019-04-01 엘지이노텍 주식회사 형광체 조성물 및 이를 포함하는 조명 장치
DE102012107290A1 (de) 2012-08-08 2014-02-13 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil, Konversionsmittelplättchen und Verfahren zur Herstellung eines Konversionsmittelplättchens
DE102012107797A1 (de) * 2012-08-23 2014-02-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements und Licht emittierendes Halbleiterbauelement
DE102012108160A1 (de) * 2012-09-03 2014-03-06 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
DE102012110668A1 (de) * 2012-11-07 2014-05-08 Osram Opto Semiconductors Gmbh Konvertermaterial, Verfahren zur Herstellung eines Konvertermaterials und optoelektronisches Bauelement
DE102012220980A1 (de) * 2012-11-16 2014-05-22 Osram Gmbh Optoelektronisches halbleiterbauelement
JP7068771B2 (ja) * 2013-07-08 2022-05-17 ルミレッズ ホールディング ベーフェー 波長変換式半導体発光デバイス
CN103489857B (zh) * 2013-09-06 2017-06-06 中山市天健照明电器有限公司 一种白光led发光装置
EP3092666B1 (en) * 2014-01-07 2019-08-28 Lumileds Holding B.V. Glueless light emitting device with phosphor converter
JP2015142046A (ja) * 2014-01-29 2015-08-03 シャープ株式会社 波長変換部材、発光装置、および波長変換部材の製造方法
JP6252982B2 (ja) * 2014-02-06 2017-12-27 日本電気硝子株式会社 ガラス部材及びその製造方法
JP6575923B2 (ja) * 2014-09-26 2019-09-18 日本電気硝子株式会社 波長変換部材及びそれを用いた発光装置
JP2017188592A (ja) 2016-04-06 2017-10-12 日亜化学工業株式会社 発光装置
DE102017104134A1 (de) * 2017-02-28 2018-08-30 Osram Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
CN110612001B (zh) * 2018-06-14 2023-06-30 因特瓦克公司 多色介电涂层及uv喷墨打印
US10475968B1 (en) 2018-07-19 2019-11-12 Osram Opto Semiconductors Gmbh Optoelectronic component and a method for producing an optoelectronic component
EP3608959B1 (en) * 2018-08-06 2023-11-15 Nichia Corporation Light emitting device and method for manufacturing same
JP6963720B2 (ja) * 2018-08-30 2021-11-10 日亜化学工業株式会社 発光装置
WO2023072867A1 (en) * 2021-10-29 2023-05-04 Ams-Osram International Gmbh Optoelectronic semiconductor chip, optoelectronic component and method for producing an optoelectronic semiconductor chip

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
US20030102473A1 (en) * 2001-08-15 2003-06-05 Motorola, Inc. Structure and method for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate
DE102004019802B4 (de) * 2004-03-11 2007-01-25 Schott Ag Verwendung eines lumineszierenden Glases als Konversionsmedium zur Erzeugung von weißem Licht
US7553683B2 (en) * 2004-06-09 2009-06-30 Philips Lumiled Lighting Co., Llc Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices
US8324641B2 (en) * 2007-06-29 2012-12-04 Ledengin, Inc. Matrix material including an embedded dispersion of beads for a light-emitting device
US8134292B2 (en) * 2004-10-29 2012-03-13 Ledengin, Inc. Light emitting device with a thermal insulating and refractive index matching material
DE102005023134A1 (de) * 2005-05-19 2006-11-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Lumineszenzkonversions-LED
JP4765525B2 (ja) * 2005-06-29 2011-09-07 日本電気硝子株式会社 発光色変換部材
JP2007048864A (ja) * 2005-08-09 2007-02-22 Nippon Electric Glass Co Ltd 蛍光体複合材料
JP2007191702A (ja) * 2005-12-22 2007-08-02 Nippon Electric Glass Co Ltd 発光色変換材料
JP4969119B2 (ja) * 2006-03-20 2012-07-04 日本碍子株式会社 発光ダイオード装置
US8481977B2 (en) * 2006-03-24 2013-07-09 Goldeneye, Inc. LED light source with thermally conductive luminescent matrix
JP4978886B2 (ja) * 2006-06-14 2012-07-18 日本電気硝子株式会社 蛍光体複合材料及び蛍光体複合部材
US20080121911A1 (en) * 2006-11-28 2008-05-29 Cree, Inc. Optical preforms for solid state light emitting dice, and methods and systems for fabricating and assembling same
DE102007057812A1 (de) * 2007-11-30 2009-06-25 Schott Ag Lichtemittierende Vorrichtung und Verfahren zu deren Herstellung sowie Lichtkonverter und dessen Verwendung
US20090200561A1 (en) * 2008-01-30 2009-08-13 Burrell Anthony K Composite phosphors based on coating porous substrates
DE102008021666A1 (de) * 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh Lichtemittierende Vorrichtung und Verfahren zur Herstellung einer lichtemittierenden Vorrichtung
DE102010009456A1 (de) 2010-02-26 2011-09-01 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement mit einem Halbleiterchip und einem Konversionselement und Verfahren zu dessen Herstellung

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