JP2013537967A5 - - Google Patents

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Publication number
JP2013537967A5
JP2013537967A5 JP2013526291A JP2013526291A JP2013537967A5 JP 2013537967 A5 JP2013537967 A5 JP 2013537967A5 JP 2013526291 A JP2013526291 A JP 2013526291A JP 2013526291 A JP2013526291 A JP 2013526291A JP 2013537967 A5 JP2013537967 A5 JP 2013537967A5
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JP
Japan
Prior art keywords
region
pressure sensor
pressure
sensor according
adhesive
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JP2013526291A
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English (en)
Japanese (ja)
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JP2013537967A (ja
JP5715698B2 (ja
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Priority claimed from CH01462/10A external-priority patent/CH703737A1/de
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Publication of JP2013537967A publication Critical patent/JP2013537967A/ja
Publication of JP2013537967A5 publication Critical patent/JP2013537967A5/ja
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Publication of JP5715698B2 publication Critical patent/JP5715698B2/ja
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JP2013526291A 2010-09-01 2011-08-29 ピエゾ抵抗センサ・チップ素子を有する圧力センサ Active JP5715698B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37907210P 2010-09-01 2010-09-01
US61/379,072 2010-09-01
CH1462/10 2010-09-13
CH01462/10A CH703737A1 (de) 2010-09-13 2010-09-13 Drucksensor mit piezoresistivem sensorchip-element.
PCT/CH2011/000196 WO2012027853A1 (de) 2010-09-01 2011-08-29 Drucksensor mit piezoresistivem sensorchip-element

Publications (3)

Publication Number Publication Date
JP2013537967A JP2013537967A (ja) 2013-10-07
JP2013537967A5 true JP2013537967A5 (enExample) 2014-10-16
JP5715698B2 JP5715698B2 (ja) 2015-05-13

Family

ID=43031550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013526291A Active JP5715698B2 (ja) 2010-09-01 2011-08-29 ピエゾ抵抗センサ・チップ素子を有する圧力センサ

Country Status (6)

Country Link
US (1) US8567256B2 (enExample)
EP (1) EP2612125B1 (enExample)
JP (1) JP5715698B2 (enExample)
CN (1) CN103080718B (enExample)
CH (1) CH703737A1 (enExample)
WO (1) WO2012027853A1 (enExample)

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Publication number Priority date Publication date Assignee Title
JP5974595B2 (ja) * 2012-04-03 2016-08-23 ミツミ電機株式会社 半導体センサ及びその製造方法
US20150248159A1 (en) * 2013-06-19 2015-09-03 Florida State University Research Foundation, Inc. Piezoresistive sensors and methods
EP2840375A1 (en) * 2013-08-19 2015-02-25 Sensirion AG Device with a micro- or nanoscale structure
TW201511552A (zh) * 2013-09-05 2015-03-16 Hon Hai Prec Ind Co Ltd 相機模組及其組裝方法
EP3367082A1 (en) 2013-11-06 2018-08-29 Invensense, Inc. Pressure sensor
EP2871455B1 (en) 2013-11-06 2020-03-04 Invensense, Inc. Pressure sensor
JP6248009B2 (ja) * 2014-07-31 2017-12-13 日立オートモティブシステムズ株式会社 圧力センサ
EP3614115B1 (en) 2015-04-02 2024-09-11 InvenSense, Inc. Pressure sensor
EP3397702B1 (en) 2015-12-29 2021-07-14 Universidade do Minho Piezoresistive ink, methods and uses thereof
JP2017134014A (ja) * 2016-01-29 2017-08-03 株式会社鷺宮製作所 圧力センサ
US10247632B2 (en) * 2016-06-23 2019-04-02 Honeywell International Oil filled gage reference side protection
JP6809122B2 (ja) * 2016-10-17 2021-01-06 株式会社デンソー 半導体装置
CN110036268B (zh) * 2016-11-30 2021-09-28 基斯特勒控股公司 用于测量力的测量传感器
US10890502B2 (en) 2017-09-08 2021-01-12 Fuji Electric Co., Ltd. Pressure sensor device
US11225409B2 (en) 2018-09-17 2022-01-18 Invensense, Inc. Sensor with integrated heater
WO2020173786A1 (en) 2019-02-27 2020-09-03 Kistler Holding Ag Sensor
US11340828B2 (en) 2020-08-10 2022-05-24 Bank Of America Corporation Restoring messages to a memory utilized by a topic in a publish-subscribe environment
US11354161B2 (en) 2020-08-10 2022-06-07 Bank Of America Corporation Controlling memory utilization by a topic in a publish-subscribe environment
WO2023218189A1 (en) 2022-05-10 2023-11-16 Ramsay Technologies Ltd A sensor device and a method of forming a sensor device
WO2023223021A1 (en) 2022-05-16 2023-11-23 Ramsay Technologies Ltd An item of protective equipment
CN116380330B (zh) * 2023-05-31 2023-10-24 成都凯天电子股份有限公司 一种用于高温的无液体压阻式碳化硅压力传感器

Family Cites Families (23)

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JPS594868B2 (ja) * 1977-07-01 1984-02-01 株式会社デンソー 半導体装置
JPS61226627A (ja) * 1985-03-30 1986-10-08 Shimadzu Corp 圧力検出器
US4993265A (en) * 1988-03-03 1991-02-19 The Foxboro Company Protected pressure sensor and method of making
JP2762807B2 (ja) * 1991-12-09 1998-06-04 株式会社日立製作所 差圧センサ
US5333505A (en) * 1992-01-13 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor pressure sensor for use at high temperature and pressure and method of manufacturing same
JP3114403B2 (ja) * 1992-12-22 2000-12-04 富士電機株式会社 半導体圧力センサ
US5614678A (en) * 1996-02-05 1997-03-25 Kulite Semiconductor Products, Inc. High pressure piezoresistive transducer
JPH09222372A (ja) * 1996-02-19 1997-08-26 Mitsubishi Electric Corp 半導体式センサ
US6076409A (en) * 1997-12-22 2000-06-20 Rosemount Aerospace, Inc. Media compatible packages for pressure sensing devices
JP2001208627A (ja) * 2000-01-24 2001-08-03 Saginomiya Seisakusho Inc 半導体圧力検出装置
JP2002082009A (ja) * 2000-06-30 2002-03-22 Denso Corp 圧力センサ
DE10107813A1 (de) * 2001-02-20 2002-09-05 Bosch Gmbh Robert Drucksensormodul
US6543292B1 (en) * 2001-03-29 2003-04-08 Rockwell Collins, Inc. Piezoresistive air pressure sensor
JP2002350260A (ja) * 2001-05-28 2002-12-04 Matsushita Electric Works Ltd 半導体圧力センサ
US7429495B2 (en) * 2002-08-07 2008-09-30 Chang-Feng Wan System and method of fabricating micro cavities
JP2004361208A (ja) * 2003-06-04 2004-12-24 Hitachi Unisia Automotive Ltd 圧力センサ
US7265477B2 (en) * 2004-01-05 2007-09-04 Chang-Feng Wan Stepping actuator and method of manufacture therefore
JP4608228B2 (ja) * 2004-03-30 2011-01-12 長野計器株式会社 圧力センサおよびその製造方法
US7077008B2 (en) * 2004-07-02 2006-07-18 Honeywell International Inc. Differential pressure measurement using backside sensing and a single ASIC
JP4556784B2 (ja) * 2005-06-27 2010-10-06 株式会社デンソー 圧力センサ
DE502006008139D1 (de) * 2005-07-20 2010-12-02 Kistler Holding Ag Sensoreinheit
US7576470B2 (en) * 2007-04-30 2009-08-18 Honeywell International Inc. Mechanical packaging of surface acoustic wave device for sensing applications
JP2010127883A (ja) * 2008-12-01 2010-06-10 Alps Electric Co Ltd Ｍｅｍｓセンサパッケージ

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