JP2008270787A5 - - Google Patents
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- Publication number
- JP2008270787A5 JP2008270787A5 JP2008078647A JP2008078647A JP2008270787A5 JP 2008270787 A5 JP2008270787 A5 JP 2008270787A5 JP 2008078647 A JP2008078647 A JP 2008078647A JP 2008078647 A JP2008078647 A JP 2008078647A JP 2008270787 A5 JP2008270787 A5 JP 2008270787A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- element group
- antenna
- region
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims 64
- 239000004065 semiconductor Substances 0.000 claims 15
- 230000004913 activation Effects 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 230000005669 field effect Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- 150000003377 silicon compounds Chemical class 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008078647A JP2008270787A (ja) | 2007-03-26 | 2008-03-25 | 半導体装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007079190 | 2007-03-26 | ||
| JP2008078647A JP2008270787A (ja) | 2007-03-26 | 2008-03-25 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008270787A JP2008270787A (ja) | 2008-11-06 |
| JP2008270787A5 true JP2008270787A5 (enExample) | 2011-05-06 |
Family
ID=39745611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008078647A Withdrawn JP2008270787A (ja) | 2007-03-26 | 2008-03-25 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US8619003B2 (enExample) |
| EP (1) | EP1988575A3 (enExample) |
| JP (1) | JP2008270787A (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010076187A2 (en) | 2008-12-30 | 2010-07-08 | Stmicroelectronics S.R.L. | Integrated electronic device with transceiving antenna and magnetic interconnection |
| US7863752B2 (en) * | 2009-02-25 | 2011-01-04 | Capella Photonics, Inc. | MEMS device with integrated via and spacer |
| WO2010144617A2 (en) * | 2009-06-10 | 2010-12-16 | The Regents Of The University Of California | Milli-meter-wave-wireless-interconnect (m2w2 - interconnect) method for short-range communications with ultra-high data rate capability |
| US8712571B2 (en) * | 2009-08-07 | 2014-04-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for wireless transmission of diagnostic information |
| US9240100B2 (en) | 2010-02-10 | 2016-01-19 | Leap Forward Gaming | Virtual players card |
| JP5498811B2 (ja) * | 2010-02-17 | 2014-05-21 | アルプス電気株式会社 | 静電容量式の入力装置 |
| KR102109668B1 (ko) * | 2010-04-08 | 2020-05-12 | 니치아 카가쿠 고교 가부시키가이샤 | 발광 장치 및 그 제조 방법 |
| GB2490303A (en) * | 2011-03-17 | 2012-10-31 | Plastic Logic Ltd | Encapsulated arrays of electronic switching devices |
| EP2508931A1 (en) * | 2011-04-05 | 2012-10-10 | Advanced Acoustic SF GmbH | Micro mirror array screen |
| CN104051357B (zh) | 2013-03-15 | 2017-04-12 | 财团法人工业技术研究院 | 环境敏感电子装置以及其封装方法 |
| JP2014183349A (ja) * | 2013-03-18 | 2014-09-29 | Renesas Electronics Corp | 半導体装置及び半導体チップ |
| US9184143B2 (en) * | 2013-12-05 | 2015-11-10 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device with bump adjustment and manufacturing method thereof |
| JP6526947B2 (ja) * | 2014-04-30 | 2019-06-05 | 株式会社半導体エネルギー研究所 | 拭き取り装置および積層体の作製装置 |
| CN105789837A (zh) | 2014-12-26 | 2016-07-20 | 环旭电子股份有限公司 | 用于无线通信的天线 |
| TWI568077B (zh) * | 2014-12-26 | 2017-01-21 | 環鴻科技股份有限公司 | 用於無線通訊之天線 |
| JP2016144261A (ja) * | 2015-01-30 | 2016-08-08 | ソニー株式会社 | 静電アクチュエータおよびスイッチ |
| JP6486735B2 (ja) * | 2015-03-17 | 2019-03-20 | 東芝メモリ株式会社 | 半導体製造方法および半導体製造装置 |
| CH711295B1 (fr) * | 2015-07-06 | 2019-11-29 | Cartier Int Ag | Procédé de fixation par assemblage anodique. |
| US10145906B2 (en) * | 2015-12-17 | 2018-12-04 | Analog Devices Global | Devices, systems and methods including magnetic structures |
| WO2017111769A1 (en) * | 2015-12-22 | 2017-06-29 | Intel Corporation | Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric |
| KR101814729B1 (ko) * | 2016-09-05 | 2018-01-04 | (주)파코코리아인더스 | 기상 관측용 기압소자 및 이를 이용한 기압 측정 시스템 |
| US10621824B2 (en) | 2016-09-23 | 2020-04-14 | Igt | Gaming system player identification device |
| NO345389B1 (en) * | 2017-03-15 | 2021-01-11 | Norbit Its | Patch antenna feed |
| JPWO2019048985A1 (ja) | 2017-09-06 | 2020-10-29 | 株式会社半導体エネルギー研究所 | 蓄電システム、車両、電子機器及び半導体装置 |
| CN109727530A (zh) * | 2017-10-31 | 2019-05-07 | 昆山工研院新型平板显示技术中心有限公司 | 柔性显示模组及柔性显示模组制备方法 |
| EP3503287A1 (en) | 2017-12-21 | 2019-06-26 | IMEC vzw | Improvements in or relating to antenna arrangements |
| US11427731B2 (en) | 2018-03-23 | 2022-08-30 | Teledyne Micralyne, Inc. | Adhesive silicon oxynitride film |
| US11280934B2 (en) * | 2018-06-21 | 2022-03-22 | SeeScan, Inc. | Electromagnetic marker devices for buried or hidden use |
| JP6592761B1 (ja) * | 2018-07-05 | 2019-10-23 | 株式会社エム・システム技研 | 計装システム |
| CN112701444B (zh) * | 2019-10-22 | 2022-06-28 | 华为技术有限公司 | 天线、天线封装方法及终端 |
| US11296750B2 (en) * | 2020-05-12 | 2022-04-05 | Nxp B.V. | Near-field wireless device including a first near-field antenna and a second near-field antenna |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2902002A1 (de) * | 1979-01-19 | 1980-07-31 | Gerhard Krause | Dreidimensional integrierte elektronische schaltungen |
| US5034753A (en) * | 1989-06-01 | 1991-07-23 | Weber Robert J | Acoustically coupled antenna |
| US5202652A (en) * | 1989-10-13 | 1993-04-13 | Hitachi, Ltd. | Surface acoustic wave filter device formed on a plurality of piezoelectric substrates |
| EP0886232B1 (en) * | 1997-06-20 | 2007-09-05 | Hitachi, Ltd. | Reader and/or writer apparatus, power feeding system, and communication system |
| JPH1168033A (ja) | 1997-08-15 | 1999-03-09 | Matsushita Electric Ind Co Ltd | マルチチップモジュール |
| JP4167443B2 (ja) | 2002-01-30 | 2008-10-15 | 日本放送協会 | 固体撮像素子 |
| US6891506B2 (en) * | 2002-06-21 | 2005-05-10 | Research In Motion Limited | Multiple-element antenna with parasitic coupler |
| JP3808092B2 (ja) | 2003-08-08 | 2006-08-09 | 松下電器産業株式会社 | 電子デバイスおよびその製造方法 |
| JP4131544B2 (ja) | 2004-02-13 | 2008-08-13 | 学校法人慶應義塾 | 電子回路 |
| CN1938901B (zh) * | 2004-03-26 | 2012-08-15 | 株式会社半导体能源研究所 | 半导体器件 |
| US20050218398A1 (en) * | 2004-04-06 | 2005-10-06 | Availableip.Com | NANO-electronics |
| US7119745B2 (en) * | 2004-06-30 | 2006-10-10 | International Business Machines Corporation | Apparatus and method for constructing and packaging printed antenna devices |
| JP4912641B2 (ja) * | 2004-08-23 | 2012-04-11 | 株式会社半導体エネルギー研究所 | 無線チップの作製方法 |
| US7405698B2 (en) * | 2004-10-01 | 2008-07-29 | De Rochemont L Pierre | Ceramic antenna module and methods of manufacture thereof |
| US7106079B2 (en) | 2004-10-22 | 2006-09-12 | Sun Microsystems, Inc. | Using an interposer to facilate capacitive communication between face-to-face chips |
| KR100750742B1 (ko) * | 2005-02-14 | 2007-08-22 | 삼성전자주식회사 | Rf 시스템 및 그 제조방법 |
| US7295029B2 (en) | 2005-03-24 | 2007-11-13 | Memsic, Inc. | Chip-scale package for integrated circuits |
| US7495462B2 (en) | 2005-03-24 | 2009-02-24 | Memsic, Inc. | Method of wafer-level packaging using low-aspect ratio through-wafer holes |
| US7262622B2 (en) | 2005-03-24 | 2007-08-28 | Memsic, Inc. | Wafer-level package for integrated circuits |
| JP2006332576A (ja) | 2005-04-25 | 2006-12-07 | Matsushita Electric Works Ltd | 半導体装置およびその製造方法 |
| US7688272B2 (en) * | 2005-05-30 | 2010-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP4071253B2 (ja) * | 2005-08-25 | 2008-04-02 | 東芝テック株式会社 | 複合アンテナ |
| TWI404924B (zh) * | 2005-08-26 | 2013-08-11 | Semiconductor Energy Lab | 粒子偵測感測器、製造粒子偵測感測器的方法、以及使用粒子偵測感測器偵測粒子的方法 |
| WO2007029435A1 (ja) | 2005-09-02 | 2007-03-15 | Nec Corporation | 伝送方法、インターフェース回路、半導体装置、半導体パッケージ、半導体モジュールおよびメモリモジュール |
| JP4592542B2 (ja) | 2005-09-08 | 2010-12-01 | 三菱電機株式会社 | 半導体装置 |
| JP2007079190A (ja) | 2005-09-15 | 2007-03-29 | Matsushita Electric Ind Co Ltd | ディスプレイ駆動装置 |
| US7728427B2 (en) * | 2007-12-07 | 2010-06-01 | Lctank Llc | Assembling stacked substrates that can form cylindrical inductors and adjustable transformers |
-
2008
- 2008-03-18 EP EP08005048A patent/EP1988575A3/en not_active Withdrawn
- 2008-03-24 US US12/053,932 patent/US8619003B2/en not_active Expired - Fee Related
- 2008-03-25 JP JP2008078647A patent/JP2008270787A/ja not_active Withdrawn
-
2012
- 2012-12-28 US US13/729,270 patent/US8902123B2/en not_active Expired - Fee Related
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