CN103080718B - 具有压阻式传感器芯片元件的压力传感器 - Google Patents

具有压阻式传感器芯片元件的压力传感器 Download PDF

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Publication number
CN103080718B
CN103080718B CN201180042379.7A CN201180042379A CN103080718B CN 103080718 B CN103080718 B CN 103080718B CN 201180042379 A CN201180042379 A CN 201180042379A CN 103080718 B CN103080718 B CN 103080718B
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CN
China
Prior art keywords
pressure
area
pressure sensor
sensor chip
adhesive
Prior art date
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Active
Application number
CN201180042379.7A
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English (en)
Chinese (zh)
Other versions
CN103080718A (zh
Inventor
乌尔里希·阿尔比克尔
克里斯托夫·松德雷格
彼得·迈斯特
约亨·冯·贝格
勒内·坦纳
杰弗里·M·施内林格
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Kistler Holding AG
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Kistler Holding AG
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Publication of CN103080718A publication Critical patent/CN103080718A/zh
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0046—Fluidic connecting means using isolation membranes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
CN201180042379.7A 2010-09-01 2011-08-29 具有压阻式传感器芯片元件的压力传感器 Active CN103080718B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37907210P 2010-09-01 2010-09-01
US61/379,072 2010-09-01
CH1462/10 2010-09-13
CH01462/10A CH703737A1 (de) 2010-09-13 2010-09-13 Drucksensor mit piezoresistivem sensorchip-element.
PCT/CH2011/000196 WO2012027853A1 (de) 2010-09-01 2011-08-29 Drucksensor mit piezoresistivem sensorchip-element

Publications (2)

Publication Number Publication Date
CN103080718A CN103080718A (zh) 2013-05-01
CN103080718B true CN103080718B (zh) 2015-02-11

Family

ID=43031550

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180042379.7A Active CN103080718B (zh) 2010-09-01 2011-08-29 具有压阻式传感器芯片元件的压力传感器

Country Status (6)

Country Link
US (1) US8567256B2 (enExample)
EP (1) EP2612125B1 (enExample)
JP (1) JP5715698B2 (enExample)
CN (1) CN103080718B (enExample)
CH (1) CH703737A1 (enExample)
WO (1) WO2012027853A1 (enExample)

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JP5974595B2 (ja) * 2012-04-03 2016-08-23 ミツミ電機株式会社 半導体センサ及びその製造方法
US20150248159A1 (en) * 2013-06-19 2015-09-03 Florida State University Research Foundation, Inc. Piezoresistive sensors and methods
EP2840375A1 (en) * 2013-08-19 2015-02-25 Sensirion AG Device with a micro- or nanoscale structure
TW201511552A (zh) * 2013-09-05 2015-03-16 Hon Hai Prec Ind Co Ltd 相機模組及其組裝方法
EP2871455B1 (en) 2013-11-06 2020-03-04 Invensense, Inc. Pressure sensor
EP3367082A1 (en) 2013-11-06 2018-08-29 Invensense, Inc. Pressure sensor
JP6248009B2 (ja) * 2014-07-31 2017-12-13 日立オートモティブシステムズ株式会社 圧力センサ
EP3076146B1 (en) 2015-04-02 2020-05-06 Invensense, Inc. Pressure sensor
PT3397702T (pt) 2015-12-29 2021-11-18 Univ Do Minho Tinta piezorresistiva, métodos e utilizações da mesma
JP2017134014A (ja) * 2016-01-29 2017-08-03 株式会社鷺宮製作所 圧力センサ
US10247632B2 (en) * 2016-06-23 2019-04-02 Honeywell International Oil filled gage reference side protection
JP6809122B2 (ja) * 2016-10-17 2021-01-06 株式会社デンソー 半導体装置
JP6806901B2 (ja) * 2016-11-30 2021-01-06 キストラー ホールディング アクチエンゲゼルシャフト 力を測定するための測定値ピックアップ
US10890502B2 (en) 2017-09-08 2021-01-12 Fuji Electric Co., Ltd. Pressure sensor device
US11225409B2 (en) 2018-09-17 2022-01-18 Invensense, Inc. Sensor with integrated heater
EP4660601A2 (en) 2019-02-27 2025-12-10 Kistler Holding AG Sensor
US11354161B2 (en) 2020-08-10 2022-06-07 Bank Of America Corporation Controlling memory utilization by a topic in a publish-subscribe environment
US11340828B2 (en) 2020-08-10 2022-05-24 Bank Of America Corporation Restoring messages to a memory utilized by a topic in a publish-subscribe environment
WO2023218189A1 (en) 2022-05-10 2023-11-16 Ramsay Technologies Ltd A sensor device and a method of forming a sensor device
WO2023223021A1 (en) 2022-05-16 2023-11-23 Ramsay Technologies Ltd An item of protective equipment
CN116380330B (zh) * 2023-05-31 2023-10-24 成都凯天电子股份有限公司 一种用于高温的无液体压阻式碳化硅压力传感器

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CN1284163A (zh) * 1997-12-22 2001-02-14 罗斯蒙特航空航天公司 与介质相容的压力传感器外壳
US6543292B1 (en) * 2001-03-29 2003-04-08 Rockwell Collins, Inc. Piezoresistive air pressure sensor
EP1584911A1 (en) * 2004-03-30 2005-10-12 Nagano Keiki Co., Ltd. Housing for a pressure sensor and method for maufacturing the same
CN1892198A (zh) * 2005-06-27 2007-01-10 株式会社电装 压力传感器
CN101044380A (zh) * 2004-08-23 2007-09-26 霍尼韦尔国际公司 使用背面检测和单个专用集成电路的压差测量
CN101720426A (zh) * 2007-04-30 2010-06-02 霍尼韦尔国际公司 用于传感应用的表面声波器件的机械封装

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US4993265A (en) * 1988-03-03 1991-02-19 The Foxboro Company Protected pressure sensor and method of making
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CN1284163A (zh) * 1997-12-22 2001-02-14 罗斯蒙特航空航天公司 与介质相容的压力传感器外壳
US6543292B1 (en) * 2001-03-29 2003-04-08 Rockwell Collins, Inc. Piezoresistive air pressure sensor
EP1584911A1 (en) * 2004-03-30 2005-10-12 Nagano Keiki Co., Ltd. Housing for a pressure sensor and method for maufacturing the same
CN101044380A (zh) * 2004-08-23 2007-09-26 霍尼韦尔国际公司 使用背面检测和单个专用集成电路的压差测量
CN1892198A (zh) * 2005-06-27 2007-01-10 株式会社电装 压力传感器
CN101720426A (zh) * 2007-04-30 2010-06-02 霍尼韦尔国际公司 用于传感应用的表面声波器件的机械封装

Also Published As

Publication number Publication date
WO2012027853A1 (de) 2012-03-08
US8567256B2 (en) 2013-10-29
JP5715698B2 (ja) 2015-05-13
CH703737A1 (de) 2012-03-15
JP2013537967A (ja) 2013-10-07
EP2612125A1 (de) 2013-07-10
CN103080718A (zh) 2013-05-01
EP2612125B1 (de) 2015-01-14
US20130167650A1 (en) 2013-07-04

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