CH703737A1 - Drucksensor mit piezoresistivem sensorchip-element. - Google Patents

Drucksensor mit piezoresistivem sensorchip-element. Download PDF

Info

Publication number
CH703737A1
CH703737A1 CH01462/10A CH14622010A CH703737A1 CH 703737 A1 CH703737 A1 CH 703737A1 CH 01462/10 A CH01462/10 A CH 01462/10A CH 14622010 A CH14622010 A CH 14622010A CH 703737 A1 CH703737 A1 CH 703737A1
Authority
CH
Switzerland
Prior art keywords
underside
pressure
region
pressure sensor
sensor chip
Prior art date
Application number
CH01462/10A
Other languages
German (de)
English (en)
Inventor
Christof Sonderegger
Ulrich Albicker
Peter Meister
Jochen Von Berg
Rene Tanner
Jeffrey Schnellinger
Original Assignee
Kistler Holding Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kistler Holding Ag filed Critical Kistler Holding Ag
Priority to CH01462/10A priority Critical patent/CH703737A1/de
Priority to EP11751529.6A priority patent/EP2612125B1/de
Priority to CN201180042379.7A priority patent/CN103080718B/zh
Priority to US13/819,450 priority patent/US8567256B2/en
Priority to JP2013526291A priority patent/JP5715698B2/ja
Priority to PCT/CH2011/000196 priority patent/WO2012027853A1/de
Publication of CH703737A1 publication Critical patent/CH703737A1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0046—Fluidic connecting means using isolation membranes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
CH01462/10A 2010-09-01 2010-09-13 Drucksensor mit piezoresistivem sensorchip-element. CH703737A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH01462/10A CH703737A1 (de) 2010-09-13 2010-09-13 Drucksensor mit piezoresistivem sensorchip-element.
EP11751529.6A EP2612125B1 (de) 2010-09-01 2011-08-29 Drucksensor mit piezoresistivem sensorchip-element
CN201180042379.7A CN103080718B (zh) 2010-09-01 2011-08-29 具有压阻式传感器芯片元件的压力传感器
US13/819,450 US8567256B2 (en) 2010-09-01 2011-08-29 Pressure sensor having a piezoresistive sensor chip element
JP2013526291A JP5715698B2 (ja) 2010-09-01 2011-08-29 ピエゾ抵抗センサ・チップ素子を有する圧力センサ
PCT/CH2011/000196 WO2012027853A1 (de) 2010-09-01 2011-08-29 Drucksensor mit piezoresistivem sensorchip-element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH01462/10A CH703737A1 (de) 2010-09-13 2010-09-13 Drucksensor mit piezoresistivem sensorchip-element.

Publications (1)

Publication Number Publication Date
CH703737A1 true CH703737A1 (de) 2012-03-15

Family

ID=43031550

Family Applications (1)

Application Number Title Priority Date Filing Date
CH01462/10A CH703737A1 (de) 2010-09-01 2010-09-13 Drucksensor mit piezoresistivem sensorchip-element.

Country Status (6)

Country Link
US (1) US8567256B2 (enExample)
EP (1) EP2612125B1 (enExample)
JP (1) JP5715698B2 (enExample)
CN (1) CN103080718B (enExample)
CH (1) CH703737A1 (enExample)
WO (1) WO2012027853A1 (enExample)

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JP5974595B2 (ja) * 2012-04-03 2016-08-23 ミツミ電機株式会社 半導体センサ及びその製造方法
US20150248159A1 (en) * 2013-06-19 2015-09-03 Florida State University Research Foundation, Inc. Piezoresistive sensors and methods
EP2840375A1 (en) * 2013-08-19 2015-02-25 Sensirion AG Device with a micro- or nanoscale structure
TW201511552A (zh) * 2013-09-05 2015-03-16 Hon Hai Prec Ind Co Ltd 相機模組及其組裝方法
EP2871455B1 (en) 2013-11-06 2020-03-04 Invensense, Inc. Pressure sensor
EP3367082A1 (en) 2013-11-06 2018-08-29 Invensense, Inc. Pressure sensor
JP6248009B2 (ja) * 2014-07-31 2017-12-13 日立オートモティブシステムズ株式会社 圧力センサ
EP3076146B1 (en) 2015-04-02 2020-05-06 Invensense, Inc. Pressure sensor
PT3397702T (pt) 2015-12-29 2021-11-18 Univ Do Minho Tinta piezorresistiva, métodos e utilizações da mesma
JP2017134014A (ja) * 2016-01-29 2017-08-03 株式会社鷺宮製作所 圧力センサ
US10247632B2 (en) * 2016-06-23 2019-04-02 Honeywell International Oil filled gage reference side protection
JP6809122B2 (ja) * 2016-10-17 2021-01-06 株式会社デンソー 半導体装置
JP6806901B2 (ja) * 2016-11-30 2021-01-06 キストラー ホールディング アクチエンゲゼルシャフト 力を測定するための測定値ピックアップ
US10890502B2 (en) 2017-09-08 2021-01-12 Fuji Electric Co., Ltd. Pressure sensor device
US11225409B2 (en) 2018-09-17 2022-01-18 Invensense, Inc. Sensor with integrated heater
EP4660601A2 (en) 2019-02-27 2025-12-10 Kistler Holding AG Sensor
US11354161B2 (en) 2020-08-10 2022-06-07 Bank Of America Corporation Controlling memory utilization by a topic in a publish-subscribe environment
US11340828B2 (en) 2020-08-10 2022-05-24 Bank Of America Corporation Restoring messages to a memory utilized by a topic in a publish-subscribe environment
WO2023218189A1 (en) 2022-05-10 2023-11-16 Ramsay Technologies Ltd A sensor device and a method of forming a sensor device
WO2023223021A1 (en) 2022-05-16 2023-11-23 Ramsay Technologies Ltd An item of protective equipment
CN116380330B (zh) * 2023-05-31 2023-10-24 成都凯天电子股份有限公司 一种用于高温的无液体压阻式碳化硅压力传感器

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPS61226627A (ja) * 1985-03-30 1986-10-08 Shimadzu Corp 圧力検出器
US5702619A (en) * 1996-02-05 1997-12-30 Kulite Semiconductor Products, Inc. Method for fabricating a high pressure piezoresistive transducer
US6543292B1 (en) * 2001-03-29 2003-04-08 Rockwell Collins, Inc. Piezoresistive air pressure sensor

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JPS594868B2 (ja) * 1977-07-01 1984-02-01 株式会社デンソー 半導体装置
US4993265A (en) * 1988-03-03 1991-02-19 The Foxboro Company Protected pressure sensor and method of making
JP2762807B2 (ja) * 1991-12-09 1998-06-04 株式会社日立製作所 差圧センサ
US5333505A (en) * 1992-01-13 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor pressure sensor for use at high temperature and pressure and method of manufacturing same
JP3114403B2 (ja) * 1992-12-22 2000-12-04 富士電機株式会社 半導体圧力センサ
JPH09222372A (ja) * 1996-02-19 1997-08-26 Mitsubishi Electric Corp 半導体式センサ
US6076409A (en) * 1997-12-22 2000-06-20 Rosemount Aerospace, Inc. Media compatible packages for pressure sensing devices
JP2001208627A (ja) * 2000-01-24 2001-08-03 Saginomiya Seisakusho Inc 半導体圧力検出装置
JP2002082009A (ja) * 2000-06-30 2002-03-22 Denso Corp 圧力センサ
DE10107813A1 (de) * 2001-02-20 2002-09-05 Bosch Gmbh Robert Drucksensormodul
JP2002350260A (ja) * 2001-05-28 2002-12-04 Matsushita Electric Works Ltd 半導体圧力センサ
US7429495B2 (en) * 2002-08-07 2008-09-30 Chang-Feng Wan System and method of fabricating micro cavities
JP2004361208A (ja) * 2003-06-04 2004-12-24 Hitachi Unisia Automotive Ltd 圧力センサ
US7265477B2 (en) * 2004-01-05 2007-09-04 Chang-Feng Wan Stepping actuator and method of manufacture therefore
JP4608228B2 (ja) * 2004-03-30 2011-01-12 長野計器株式会社 圧力センサおよびその製造方法
US7077008B2 (en) * 2004-07-02 2006-07-18 Honeywell International Inc. Differential pressure measurement using backside sensing and a single ASIC
JP4556784B2 (ja) * 2005-06-27 2010-10-06 株式会社デンソー 圧力センサ
WO2007009277A1 (de) * 2005-07-20 2007-01-25 Kistler Holding Ag Sensoreinheit
US7576470B2 (en) * 2007-04-30 2009-08-18 Honeywell International Inc. Mechanical packaging of surface acoustic wave device for sensing applications
JP2010127883A (ja) * 2008-12-01 2010-06-10 Alps Electric Co Ltd Ｍｅｍｓセンサパッケージ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61226627A (ja) * 1985-03-30 1986-10-08 Shimadzu Corp 圧力検出器
US5702619A (en) * 1996-02-05 1997-12-30 Kulite Semiconductor Products, Inc. Method for fabricating a high pressure piezoresistive transducer
US6543292B1 (en) * 2001-03-29 2003-04-08 Rockwell Collins, Inc. Piezoresistive air pressure sensor

Also Published As

Publication number Publication date
WO2012027853A1 (de) 2012-03-08
US8567256B2 (en) 2013-10-29
JP5715698B2 (ja) 2015-05-13
JP2013537967A (ja) 2013-10-07
EP2612125A1 (de) 2013-07-10
CN103080718A (zh) 2013-05-01
EP2612125B1 (de) 2015-01-14
CN103080718B (zh) 2015-02-11
US20130167650A1 (en) 2013-07-04

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