JP2012094654A5 - - Google Patents

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Publication number
JP2012094654A5
JP2012094654A5 JP2010240093A JP2010240093A JP2012094654A5 JP 2012094654 A5 JP2012094654 A5 JP 2012094654A5 JP 2010240093 A JP2010240093 A JP 2010240093A JP 2010240093 A JP2010240093 A JP 2010240093A JP 2012094654 A5 JP2012094654 A5 JP 2012094654A5
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JP
Japan
Prior art keywords
electronic component
temporary
temporary pressure
substrate
bonding
Prior art date
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Application number
JP2010240093A
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English (en)
Japanese (ja)
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JP5702110B2 (ja
JP2012094654A (ja
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Priority to JP2010240093A priority Critical patent/JP5702110B2/ja
Priority claimed from JP2010240093A external-priority patent/JP5702110B2/ja
Publication of JP2012094654A publication Critical patent/JP2012094654A/ja
Publication of JP2012094654A5 publication Critical patent/JP2012094654A5/ja
Application granted granted Critical
Publication of JP5702110B2 publication Critical patent/JP5702110B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010240093A 2010-10-26 2010-10-26 電子部品の実装装置及び実装方法 Active JP5702110B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010240093A JP5702110B2 (ja) 2010-10-26 2010-10-26 電子部品の実装装置及び実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010240093A JP5702110B2 (ja) 2010-10-26 2010-10-26 電子部品の実装装置及び実装方法

Publications (3)

Publication Number Publication Date
JP2012094654A JP2012094654A (ja) 2012-05-17
JP2012094654A5 true JP2012094654A5 (enExample) 2013-11-28
JP5702110B2 JP5702110B2 (ja) 2015-04-15

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ID=46387685

Family Applications (1)

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JP2010240093A Active JP5702110B2 (ja) 2010-10-26 2010-10-26 電子部品の実装装置及び実装方法

Country Status (1)

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JP (1) JP5702110B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5650983B2 (ja) * 2010-10-26 2015-01-07 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP6663939B2 (ja) * 2017-02-13 2020-03-13 芝浦メカトロニクス株式会社 電子部品の実装装置と表示用部材の製造方法
KR102050477B1 (ko) * 2017-02-13 2019-11-29 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치와 표시용 부재의 제조 방법
KR102115746B1 (ko) * 2017-02-17 2020-05-27 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치와 표시용 부재의 제조 방법
JP6663940B2 (ja) * 2017-02-17 2020-03-13 芝浦メカトロニクス株式会社 電子部品の実装装置と表示用部材の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4802003B2 (ja) * 2006-01-30 2011-10-26 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5143670B2 (ja) * 2008-08-26 2013-02-13 芝浦メカトロニクス株式会社 テープ状部材の貼着装置
JP5173708B2 (ja) * 2008-09-29 2013-04-03 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5650983B2 (ja) * 2010-10-26 2015-01-07 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法

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