JP2013536998A5 - - Google Patents

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Publication number
JP2013536998A5
JP2013536998A5 JP2013527082A JP2013527082A JP2013536998A5 JP 2013536998 A5 JP2013536998 A5 JP 2013536998A5 JP 2013527082 A JP2013527082 A JP 2013527082A JP 2013527082 A JP2013527082 A JP 2013527082A JP 2013536998 A5 JP2013536998 A5 JP 2013536998A5
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JP
Japan
Prior art keywords
semiconductor die
assembly
semiconductor
vertical
vertical stack
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JP2013527082A
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English (en)
Japanese (ja)
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JP2013536998A (ja
JP6000951B2 (ja
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Priority claimed from US12/873,945 external-priority patent/US8373280B2/en
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Publication of JP2013536998A5 publication Critical patent/JP2013536998A5/ja
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Publication of JP6000951B2 publication Critical patent/JP6000951B2/ja
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JP2013527082A 2010-09-01 2011-08-04 組立部品およびチップパッケージを組立てるための方法 Active JP6000951B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/873,945 2010-09-01
US12/873,945 US8373280B2 (en) 2010-09-01 2010-09-01 Manufacturing fixture for a ramp-stack chip package using solder for coupling a ramp component
PCT/US2011/046517 WO2012030469A2 (en) 2010-09-01 2011-08-04 Manufacturing fixture for a ramp-stack chip package

Publications (3)

Publication Number Publication Date
JP2013536998A JP2013536998A (ja) 2013-09-26
JP2013536998A5 true JP2013536998A5 (enExample) 2014-09-11
JP6000951B2 JP6000951B2 (ja) 2016-10-05

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Family Applications (1)

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JP2013527082A Active JP6000951B2 (ja) 2010-09-01 2011-08-04 組立部品およびチップパッケージを組立てるための方法

Country Status (7)

Country Link
US (1) US8373280B2 (enExample)
EP (1) EP2612355B1 (enExample)
JP (1) JP6000951B2 (enExample)
KR (1) KR101807743B1 (enExample)
CN (1) CN103081103A (enExample)
TW (1) TWI517353B (enExample)
WO (1) WO2012030469A2 (enExample)

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US20230247795A1 (en) 2022-01-28 2023-08-03 The Research Foundation For The State University Of New York Regenerative preheater for phase change cooling applications
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