TWI506717B - 三維安裝方法及裝置 - Google Patents
三維安裝方法及裝置 Download PDFInfo
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Description
本發明有關於使半導體元件等之被接合物在上下方向依序疊層進行接合之三維安裝方法及裝置。
作為半導體元件之三維安裝方法者有在晶片之上依序疊層晶片之COC工法(Chip On Chip)、在晶圓之上依序疊層晶片之COW工法(Chip On Wafer)、在晶圓之上依序疊層晶圓之WOW工法(Wafer On Wafer)等。在任何一種之三維安裝方法中,需要以上層之被接合物之電極之位置對準下層之被接合物之電極(包含突狀體(bump))之位置之狀態,依序疊層上層被接合物,和進行接合(例如,專利文獻1)。
在此種之三維安裝中,在先前技術是當依序疊層上層被接合物時,利用辨識手段(例如,CCD攝影機)從上方辨識下層之被接合物之位置(例如,其電極之位置或校準標記之位置),以辨識到之下層之被接合物之位置作為基準,對準疊層在其上之上層被接合物之位置,利用辨識手段從上方辨識疊層之上層被接合物之位置,以辨識到之被接合物之位置作為基準,對準疊層於其上之上層被接合物之位置,使該等之動作依序地重複進行必要之次數,用來進行依序疊層之上層被接合物之位置對準。
[專利文獻1]日本專利特開2009-110995號公報
然而,在以上述方式依序疊層之上層被接合物之位置作為基準,進行被疊層在其上之被接合物之位置對準之方法中,會有以下之問題。
亦即,對最下層之被接合物依序疊層之上層被接合物,通常在其一面形成電路面,具有從該電路面朝向背面貫穿之電極。使該電路面在下面側,對於位於其下方之被接合物,進行電極間之位置對準之後,進行疊層接合。從上述電路面之相反側之背面側辨識被接合之該上層被接合物之位置,以辨識到之位置作為基準,再對準上層之被接合物之位置,進行疊層和接合。因此,在進行疊層複數個上層被接合物之途中之階段,必需經常從背面側讀取和辨識被疊層之上層被接合物之位置。
但是,在以此方式進行依序疊層之被接合物中,通常電路面側為清楚,可以明顯辨識電極之位置或位置對準用之校準標記之位置的狀態,但是在背面側通常大多未清楚刻印或印刷有標記形狀等,該標記亦為微小,極不容易讀取之狀態。因此,在從背面側進行位置辨識之方法中,容易發生辨識誤差,校準標記等之辨識誤差會直接造成安裝精確度之劣化。另外,在以上層被接合物之背面之標記基準進行安裝之情況時,因為成為使標記誤差依序累積之形式,所以依照疊層數,對最下層之安裝偏移亦會變大。
因此本發明之課題是針對上述方式之先前技術之位置辨識之問題,提供可以提高最終之三維組建狀態之安裝精確度之三維安裝方法及裝置,成為可以使依序疊層之上層被接合物以高精確度確實而且容易地進行位置對準。
為著解決上述之問題,本發明之三維安裝方法係在具備有電極之最下層被接合物上,以電極間互相位置對準之狀態,依序疊層具備有貫穿電極之複數個上層被接合物,其特徵在於:辨識上述最下層被接合物之校準用位置,以辨識到之最下層被接合物之校準用位置作為基準,使電極依序連接到全部上層被接合物之位置,依序對準在既定之位置,依序疊層對準在既定之位置之上層被接合物。
在此種方式之本發明之三維安裝方法中,首先,辨識最下層被接合物之校準用位置,以該最下層被接合物之位置作為基準,依序進行被依序疊層之全部上層被接合物之位置對準。因此,上層被接合物不論疊層多少層,上層被接合物(上層被接合物之上面[電路面之相反側之背面]側)不會成為位置對準用之基準,不需要辨識關於該不容易讀取側之面之位置。位置對準用之上層被接合物之校準用位置,假如可以在下面側(電路面側)之容易讀取之面被辨識時,可以進行高精確度之辨識。其結果是全部上層被接合物以同一最下層被接合物之校準用位置作為基準,進行位置對準,和在各個上層被接合物之位置對準時,各個上層被接合物之校準用位置可以在容易讀取之下面側(電路面側)辨識,所以不會有位置對準用之辨識誤差之產生之餘地,可以抑制安裝誤差之發生,可以成為穩定之極高精確度之三維安裝。
在上述本發明之三維安裝方法中,更具體而言,利用第1辨識手段辨識(從上方辨識)上述最下層被接合物之校準用位置和進行記憶,利用第2辨識手段依序辨識(從下方辨識)複數個上層被接合物之校準用位置,以被記憶之最下層被接合物之校準用位置作為基準,可以依序對準在上述既定之位置,並依序疊層校準用位置經辨識之上層被接合物。第1辨識手段和第2辨識手段可以構建成為在上下方向具有視野之2視野之辨識手段,亦可以構建成為分開之辨識手段。
另外,對於各個被接合物之校準用位置之辨識,亦可以辨識電極之位置或被接合物之外形位置,但是假如辨識形成特定形狀(例如,十字形狀等)之附加有校準用之標記時,有助於辨識精確度之提高。例如,可以利用附加在該最下層被接合物之上面之校準用標記,辨識上述最下層被接合物之校準用位置,利用附加在各個上層被接合物之下面之校準用標記,辨識上述複數個上層被接合物之校準用位置。
另外,各個上層被接合物之高度隨著疊層之進行而變化,所以當將被保持在頭部等之上層被接合物疊層在最下層被接合物上或疊層在已疊層於最下層被接合物之上層被接合物上時,最好使由於加壓等之基準高度隨著疊層之進行而依序變更。亦即,針對被依序疊層之每一個上層被接合物,在相對於疊層方向之上述最下層被接合物之位置或與其相當之基準位置,可以控制安裝高度。
另外,上層被接合物之校準用位置之辨識最好是例如利用上述第2辨識手段辨識上層被接合物位於安裝位置時之上層被接合物。在安裝位置上進行辨識,依照該辨識繼續進行安裝,成為大致不會有產生安裝誤差之餘地,有助於安裝精確度之提高。但是例如,亦可以在將上層被接合物搬運到安裝位置之途中,辨識上層被接合物之校準用位置(例如,相對於保持上層被接合物之上層被接合物之頭部之位置),根據該辨識位置進行安裝。在此種情況時,因為可以不要在安裝位置時之上層被接合物之校準用位置之辨識用之辨識手段之進退動作,所以從搬運到安裝之一連串步驟所需要之時間可以縮短。
在本發明中,作為被接合物,只要是將具備有貫穿電極之複數個上層被接合物三維安裝在具備有電極之最下層被接合物上者,可以使用所有形態、所有種類之被接合物,代表性者為被接合物由晶片或晶圓構成。在此種情況時,可以使用上述之COC工法、COW工法、WOW工法之任一工法。
本發明亦提供三維安裝裝置。亦即,本發明之三維安裝裝置係在具備有電極之最下層被接合物上,以電極間互相位置對準之狀態,依序疊層具備有貫穿電極之複數個上層被接合物,其特徵在於具有:第1辨識手段,用來辨識被保持在載物台上之上述最下層被接合物之校準用位置;移動手段,可以控制用以保持上述被依序疊層之上層被接合物之頭部和用以保持上述最下層被接合物之上述載物台之相對位置;第2辨識手段,用來辨識被保持在上述頭部之上述上層被接合物之校準用位置;和安裝控制手段,以利用上述第1辨識手段辨識到之最下層被接合物之校準用位置作為基準,使電極依序連接到以上述第2辨識手段辨識到之全部上層被接合物之位置,依序對準在既定之位置,並依序疊層對準在既定之位置之上層被接合物。
在該三維安裝裝置中,可以構建成具有記憶手段,用來記憶利用上述第1辨識手段辨識到之最下層被接合物之校準用位置,上述安裝控制手段將利用上述第2辨識手段依序辨識到之上層被接合物之位置記憶在上述記憶手段,以最下層被接合物之校準用位置作為基準,依序對準在上述既定之位置,依序疊層上層被接合物。
另外,可以構建成利用附加在該最下層被接合物上面之校準用標記辨識上述最下層被接合物之校準用位置,利用附加在各個上層被接合物下面之校準用標記辨識上述複數個上層被接合物之校準用位置。
另外,最好構建成使上述安裝控制手段,針對被依序疊層之每一個上層被接合物,變化相對於疊層方向之上述最下層被接合物之位置或與其相當之基準位置之安裝高度,以此方式控制上層被接合物之疊層高度方向之位置。
另外,最好上述第2辨識手段係由在保持上層被接合物之頭部位於安裝位置上時,辨識上層被接合物的手段所構成。
在此種之三維安裝裝置中,代表性之被接合物有晶片或晶圓。
依照本發明之三維安裝方法及裝置時,因為以最下層被接合物之辨識位置作為基準,使全部之上層被接合物依序地位置對準和疊層,所以不需要讀取先前技術之不容易讀取之各個上層被接合物之上面,可以容易地進行高精確度之位置對準,可以大幅地提高安裝精確度和提高高精確度三維安裝之確實性。
以下參照圖式同時說明本發明之較佳實施形態。
圖1表示本發明之一實施形態之三維安裝裝置。三維安裝裝置1之構成是在具備有電極2之作為最下層被接合物之最下層晶片3上,依序地疊層複數個之具備有貫穿電極4之作為複數上層被接合物之上層晶片5,成為使電極2、4間互相位置對準之狀態。三維安裝裝置1,如圖2所示,具有:第1辨識手段,用來辨識被保持(例如,吸著保持)在載物台6上之最下層晶片3之校準用位置(例如,校準用標記之位置);和第2辨識手段,用來辨識被保持在頭部7(例如,加壓‧加熱用頭部)之上層晶片5之校準用位置(例如,校準用標記之位置);在本實施形態中,第1辨識手段和第2辨識手段構建成為在上下2方向具有視野之2視野辨識手段之2視野攝影機8。2視野攝影機8被設置在下方之最下層晶片3和上方之上層晶片5之間,亦即,對上層晶片5之安裝位置可以依照需要進行進退。
三維安裝裝置1具有移動手段可以用來控制保持有上述依序疊層之上層晶片5之上述頭部7和保持有上述最下層晶片3之上述載物台6之相對位置,利用該移動手段之控制使上層晶片5對最下層晶片3產生位置對準。在本實施態樣中,要進行該位置對準時是控制載物台6側之位置,但是亦可以構建成控制頭部7側之位置,亦可以構建成控制兩側之位置。
另外,三維安裝裝置1具有安裝控制手段9,以上述第1辨識手段所辨識到之最下層晶片3之校準用位置作為基準,貫穿電極4依序連接至以上述第2辨識手段所辨識到之全部上層晶片5之位置,依序對準在既定之位置,在其下層依序疊層對準在既定之位置之上層晶片5。
三維安裝以如圖3所示之方式進行。
首先,利用第1辨識手段(在2視野攝影機8之下方具有視野之攝影機)辨識被保持在載物台6上之最下層晶片3之校準用位置(校準用標記之位置),將該位置資訊記憶在安裝控制手段9內之記憶手段。以被記憶在該記憶手段之最下層晶片3之校準用位置資訊作為基準,依序進行被依序疊層之全部上層晶片5之位置對準。上層晶片5之校準用位置(校準用標記之位置)利用第2辨識手段(在2視野攝影機8之上方具有視野之攝影機)辨識,使該辨識位置資訊和被記憶在上述記憶手段之最下層晶片3之校準用位置資訊進行對照,以使電極2、4間之位置互相對準之方式,控制上層晶片5之位置。實際上在本實施態樣中因為控制載物台6側之位置,所以根據兩個位置資訊進行載物台6之位置控制。
因為全部上層晶片5之位置以同樣之方式進行位置對準,所以例如在上層晶片5為任何層數之疊層之情況時,全部上層晶片5,使以同一最下層晶片3之校準用位置作為基準,進行位置對準。因此,不需要如先前技術之方式之從依序疊層之各個上層晶片5之各個上面側讀取位置資訊(亦即,因為不清楚所以不容易讀取之位置資訊),用來進行位置對準。作為各個上層晶片5之位置資訊,使用以第2辨識手段讀取容易讀取之下面側的位置資訊,所以可以抑制上述位置對準時之誤差發生,可以改良位置對準之精確度,因而可以大幅地提高使頭部7下降進行安裝之精確度,和可以大幅地提高用以進行所希望之三維安裝之確實性,有助於安裝步驟之穩定性,和可靠度之提高。
另外,對於成為最上層之上層晶片5不需要與途中層同樣之貫穿電極4。
另外,在上述實施態樣中是在安裝位置從晶片下面側進行上層晶片5之利用第2辨識手段(在2視野攝影機8之上方具有視野之攝影機)之位置辨識,但是亦可以如圖4所示,將被保持在頭部7之上層晶片5搬運到安裝位置,在搬運之途中,利用具有與上述不同構造之第2辨識手段(例如,只在上方具有視野之攝影機11)辨識校準用位置,使用該辨識位置資訊,在安裝位置處,可以位置對準在作為基準之最下層晶片3之校準用位置。依照此種方式時,因為上層晶片5之讀取時間可以減少,所以可以縮短具有一連串動作之三維安裝步驟全體之時間。
本發明之三維安裝方法和裝置可以適用在使具備有電極之被接合物在上下方向進行疊層之所有三維安裝。
1...三維安裝裝置
2...電極
3...作為最下層被接合物之最下層晶片
4...貫穿電極
5...作為上層被接合物之上層晶片
6...載物台
7...頭部
8...作為具備有第1辨識手段和第2辨識手段之2視野辨識手段之2視野攝影機
9...安裝控制手段
11...作為第2辨識手段之攝影機
圖1是本發明之一實施態樣之三維安裝裝置之概略構造圖。
圖2是立體圖,用來表示圖1之三維安裝裝置之2視野之辨識手段之最下層、上層被接合物之校準用位置辨識之狀態。
圖3是概略構造圖,用來表示本發明之依序疊層上層被接合物之狀態。
圖4是概略構造圖,用來表示上層被接合物之另一辨識方法之實例。
1...三維安裝裝置
2...電極
3...作為最下層被接合物之最下層晶片
4...貫穿電極
5...作為上層被接合物之上層晶片
6...載物台
7...頭部
8...作為具備有第1辨識手段和第2辨識手段之2視野辨識手段之2視野攝影機
Claims (12)
- 一種三維安裝方法,係於具備有電極之最下層被接合物上,在使電極彼此之位置對準的狀態下,依序疊層具備有貫穿電極之複數個上層被接合物並將上述電極彼此予以接合者,其特徵在於,辨識上述最下層被接合物之校準用位置,並以所辨識到最下層被接合物之校準用位置作為基準,一邊將所有上層被接合物之位置依序對準於電極將被依序連接之既定位置,一邊依序疊層被對準在既定位置之上層被接合物並將上述電極彼此予以接合。
- 如申請專利範圍第1項之三維安裝方法,其中,利用第1辨識手段辨識上述最下層被接合物之校準用位置並加以記憶,利用第2辨識手段依序辨識複數個上層被接合物之校準用位置,並以所記憶之最下層被接合物之校準用位置作為基準,一邊將校準用位置被辨識到之上層被接合物依序對準於上述既定位置,一邊依序進行疊層。
- 如申請專利範圍第1項之三維安裝方法,其中,利用附加在上述最下層被接合物上面之校準用標記,來辨識該最下層被接合物之校準用位置,並利用附加在各個上層被接合物下面之校準用標記,來辨識上述複數個上層被接合物之校準用位置。
- 如申請專利範圍第1項之三維安裝方法,其中, 針對被依序疊層之每一個上層被接合物,控制相對於疊層方向之上述最下層被接合物之位置或與其相當之基準位置之安裝高度。
- 如申請專利範圍第2項之三維安裝方法,其中,當上層被接合物位於安裝位置上時,利用第2辨識手段來辨識上層被接合物。
- 如申請專利範圍第1至5項中任一項之三維安裝方法,其中,上述被接合物係由晶片或晶圓所構成。
- 一種三維安裝裝置,係於具備有電極之最下層被接合物上,在使電極彼此之位置對準的狀態下,依序疊層具備有貫穿電極之複數個上層被接合物並將上述電極彼此予以接合者,其特徵在於,其具有:第1辨識手段,其辨識被保持在載物台上之上述最下層被接合物之校準用位置;移動手段,可控制保持上述將被依序疊層之上層被接合物之頭部和保持有上述最下層被接合物之上述載物台之相對位置;第2辨識手段,其辨識被保持在上述頭部之上述上層被接合物之校準用位置;和安裝控制手段,其以利用上述第1辨識手段所辨識到最下層被接合物之校準用位置作為基準,一邊將利用上述第2辨識手段所辨識到之所有上層被接合物之位置依序對準於電極將被依序連接之既定位置,一邊依序疊層被對準於既定位置之上層被接合物並將上述電極彼此予以接 合。
- 如申請專利範圍第7項之三維安裝裝置,其中,具有記憶手段,其記憶利用上述第1辨識手段所辨識到最下層被接合物之校準用位置,上述安裝控制手段係以被記憶在上述記憶手段的最下層被接合物之校準用位置作為基準,一邊將利用上述第2辨識手段所依序辨識到之上層被接合物之位置依序對準於上述既定位置,一邊依序疊層上層被接合物。
- 如申請專利範圍第7項之三維安裝裝置,其中,利用附加在上述最下層被接合物上面之校準用標記,來辨識該最下層被接合物之校準用位置,並利用附加在各個上層被接合物下面之校準用標記,來辨識上述複數個上層被接合物之校準用位置。
- 如申請專利範圍第7項之三維安裝裝置,其中,上述安裝控制手段係針對被依序疊層之每一個上層被接合物,以改變相對於疊層方向之上述最下層被接合物之位置或與其相當之基準位置之安裝高度的方式,控制上層被接合物之疊層高度方向之位置。
- 如申請專利範圍第7項之三維安裝裝置,其中,上述第2辨識手段係在保持上層被接合物之頭部位於安裝位置上時,辨識上層被接合物。
- 如申請專利範圍第7至11項中任一項之三維安裝裝 置,其中,上述被接合物係由晶片或晶圓所構成。
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JP2007194491A (ja) * | 2006-01-20 | 2007-08-02 | Renesas Technology Corp | 半導体装置、インタポーザチップ、および半導体装置の製造方法 |
US20080308946A1 (en) * | 2007-06-15 | 2008-12-18 | Micron Technology, Inc. | Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices |
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JPWO2011087003A1 (ja) | 2013-05-20 |
KR20120118458A (ko) | 2012-10-26 |
TW201140739A (en) | 2011-11-16 |
WO2011087003A1 (ja) | 2011-07-21 |
KR101802173B1 (ko) | 2017-11-28 |
JP5984394B2 (ja) | 2016-09-06 |
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