TW201140739A - Three-dimensional mounting method and apparatus - Google Patents

Three-dimensional mounting method and apparatus Download PDF

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Publication number
TW201140739A
TW201140739A TW100101395A TW100101395A TW201140739A TW 201140739 A TW201140739 A TW 201140739A TW 100101395 A TW100101395 A TW 100101395A TW 100101395 A TW100101395 A TW 100101395A TW 201140739 A TW201140739 A TW 201140739A
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Taiwan
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joined
layer
lowermost
calibration
upper layer
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TW100101395A
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Chinese (zh)
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TWI506717B (en
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Katsumi Terada
Takuji Obayashi
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Toray Eng Co Ltd
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Disclosed is a three-dimensional packaging method for sequentially laminating a plurality of upper layers to be joined including feedthrough electrodes on a lowest layer to be joined including electrodes while the positions of the electrodes are adjusted with respect to each other, which comprises recognizing positions for alignment on the lowest layer to be joined; and sequentially adjusting the positions of all the upper layers to be joined at predetermined positions where the electrodes are sequentially connected with reference to the recognized positions for alignment on the lowest layer to be joined, and sequentially laminating the upper layers to be joined disposed at the predetermined positions. Also disclosed is a three-dimensional packaging device. Since all the upper layers to be joined are sequentially positioned and laminated with reference to the recognized positions on the lowest layer to be joined, the need for reading the upper surfaces of the upper layers to be joined, which are not easily read using conventional technology, is eliminated, and the layers can be easily and accurately positioned. As a result, packaging accuracy is significantly improved, and reliability of highly accurate three-dimensional packaging is also improved.

Description

201140739 六、發明說明： 【發明所屬之技術領域】 本發明有關於使半導體元件等之被接合物在上下方向依 序疊層進行接合之三維安裝方法及裝置。 【先前技術】 作為半導體元件之三維安裝方法者有在晶片之上依序疊 層晶片之COC工法(Chip On Chip)、在晶圓之上依序疊層晶 片之COW工法(Chip On Wafer)、在晶圓之上依序疊層晶圓 之WOW工法(Wafer On Wafer)等。在任何一種之三維安妒 方法中’需要以上層之被接合物之電極之位置對準下層之被 接合物之電極（包含突狀體(bump))之位置之狀態，依序疊層 上層被接合物，和進行接合(例如，專利文獻1)。 在此種之三維安裝中，在先前技術是當依序疊層上層被接 合物時，利用辨識手段(例如，CCD攝影機)從上方辨識不層 之被接合物之位置（例如，其電極之位置或校準標記之位 置），以辨識到之下層之被接合物之位置作為基準，對準疊 層在其上之上層被接合物之位置，利用辨識手段從上方辨識 疊層之上層被接合物之位置，以辨識到之被接合物之位置作 為基準’對準疊層於其上之上層被接合物之位置，使該等之 動作依序地重複進行必要之次數，用來進行依序疊層之上層 被接合物之位置對準。 [先前技術文獻] !〇〇1〇1395 3 201140739 [專利文獻] [專利文獻1]曰本專利特開2009-110995號公報 【發明内容】 (發明所欲解決之問題） 然而，在以上述方式依序疊層之上層被接合物之位置作為 基準，進行被疊層在其上之被接合物之位置對準之方法中， 會有以下之問題。 亦即，對最下層之被接合物依序疊層之上層被接合物，通 常在其一面形成電路面，具有從該電路面朝向背面貫穿之電 極。使該電路面在下面側，對於位於其下方之被接合物，進 行電極間之位置對準之後，進行疊層接合。從上述電路面之 相反側之背面側辨識被接合之該上層被接合物之位置，以辨 識到之位置作為基準，再對準上層之被接合物之位置，進行 疊層和接合。因此，在進行疊層複數個上層被接合物之途中 之階段，必需經常從背面側讀取和辨識被疊層之上層被接合 物之位置。 但是’在以此方式進行依序疊層之被接合物中’通常電路 面側為清楚，可以明顯辨識電極之位置或位置對準用之校準 標記之位置的狀態’但是在背面側通常大多未清楚刻印或印 刷有標記形狀等，該標記亦為微小，極不容易讀取之狀態。 因此，在從背面側進行位置辨識之方法中，容易發生辨識誤 差，校準標記等之辨識誤差會直接造成安裝精確度之劣化。 100101395 4 201140739 另外，在以上層被接合狄背面之標記基準進行安裝之情況 時，因為成為使標記誤差依序累積之形式，所以依照叠層 數’對最下層之安裝偏移亦會變大。 因此本發明之課題是針對上財式之切技術之位置辨 識之問題，提供可讀高最終之三維組建㈣之安裝精確度 之-維安裝方法及裝置’成為可以使依序疊層之上層被接合 物以尚精確度確實而且容易地進行位置對準。 (解決問題之手段） 為著解決上狀問題，本發明之三維安裝方法係在具備有 電極之最下層被接合物上，以電極間互相位置對準之狀態， 依序疊層具備有貫穿電極之複數個上層被接合物，其特徵在 於··辨識上述最下層被接合物之校準用位置，以辨識到之最 下層被接合物之校準用位置作為基準，使電極依序連接到全 部上層被接合物之位置，依序對準在既定之位置，依序疊層 對準在既定之位置之上層被接合物。 在此種方式之本發明之三維安裝方法中，首先，辨識最下 層被接合物之校準用位置，以該最下層被接合物之位置作為 基準，依序進行被依序疊層之全部上層被接合物之位置對 準。因此，上層被接合物不論疊層多少層，上層被接合物（上 層被接合物之上面[電路面之相反側之背面]側）不會成為位 置對準用之基準，不需要辨識關於該不容易讀取側之面之位 置。位置對準用之上層被接合物之校準用位置，假如可以在 100101395 5 201140739 下面侧（電路面侧)之容易讀取之面被辨識時，可以進行高精 確度之辨識。其結果是全部上層被接合物以同一最下層被接 合物之校準用位置作為基準，進行位置對準，和在各個上層 被接合物之位置對準時，各個上層被接合物之校準用位置可 以在容易讀取之下面側（電路面侧）辨識，所以不會有位置對 準用之辨識誤差之產生之餘地，可以抑制安裝誤差之發生， 可以成為穩定之極高精確度之三維安裝。 在上述本發明之三維安裝方法t，更具體而言，利用第i 辨識手段辨識（從上方辨識）上述最下層被接合物之校準用 位置和進行記憶，利用第2辨識手段依序辨識(從下方辨識） 複數個上層被接合物之校準用位置，以被記憶之最下層被接 合物之校準用位置作為基準，可以依序對準在上述既定之位 置，並依序疊層校準用位置經辨識之上層被接合物。第工 辨識手段和第2辨識手段可輯建成為在上下方向具有視 野之2視野之賴手段，亦可以構建絲分狀辨識手段。 另外，對於各個被接合物之校準用位置之辨識，亦可以辨 識電極之位置或被接合物之外形位置，但是假如辨識形成特 定形狀(例如，十字形狀等）之附加有校準用之標記時，有助 於辨識精確度之提高。例如，可以利用附加在該最下層被接 合物之上面之校準用標記’辨識上述最下層被接合物之校準 用位置，利用附加在各個上層被接合物之下面之校準用桿 3己，辨識上述複數個上層被接合物之校準用位置。 100101395 / 201140739 另外，各個上層被接合物之高度隨著疊層之進行而變化， 所以田將被保持在頭部等之上層被接合物疊層在最下層被 接合物上或疊層在已#層於最下層被接合物之上層被接合 物上時’最好使由於加壓等之基準高度隨著疊層之進行而依 序變更。亦即，針對被依序疊層之每一個上層被接合物，在 相對於豐層方向之上述最下層被接合物之位置或與其相當 之基準位置，可以控制安裝高度。 另外’上層被接合物之校準用位置之辨識最好是例如利用 上述第2辨識手段辨識上層被接合物位於安裝位置時之上 層被接合物。在安装位置上進行辨識，依照該辨識繼續進行 安裝，成為大致不會有產生安裝誤差之餘地，有助於安裝精 確度之提高。但是例如，亦可以在將上層被接合物搬運到安 裝位置之途中，辨識上層被接合物之校準用位置(例如，相 對於保持上層被接合物之上層被接.合物之頭部之位置），根 據該辨識位置進行安裝。在此種情況時，因為可以不要在安 裝位置時之上層被接合物之校準用位置之辨識用之辨識手 k之進退動作，所以從搬運到安裝之一連串步驟所需要之時 間可以縮短。 在本發明中，作為被接合物，只要是將具備有貫穿電極之 複數個上層被接合物三維安裝在具備有電極之最下層被接 合物上者，可以使用所有形態、所有種類之被接合物，代表 性者為被接合物由晶片或晶圓構成。在此種情況時，可以使 100101395 7 201140739 二 ^ en _ 卫法、w〇w 本發明亦提供三維安 又任工法。 置係在具備有電極之最下合二，安裝裝 :準:狀態，依序疊層具備有貫穿電 物，其特徵在於具有：手段， 物台上之上述最下層被接合物之校準用位置；移2 = :=:上述被依序疊層之上層被接合物之頭部和 用以保持上妓τ賴接合狀上㈣物台之㈣ 2辨識手段，用來辨識被保持在上述頭部之上述上層被接人 物之校準用位置；和安裝層被接口 ㈣侧^ 讀控制手奴，以利用上述第！辨識手 ㈣識到之取下層被接合物之校準職置作為基準，使電極 依序連接到以上述第2辨識手段辨識到之全部上層被接合 物之位置’依相準在岐讀置，魏序㈣對準在既定 之位置之上層被接合物。 在該三維安裝裝置中’可以構建成具有記憶手段，用來記 憶利用上述第1辨識手段辨識到之最下層被接合物之校準 用位置，上述安展控制手段將利用上述第2辨識手段依序辨 識到之上層被接合物之位置記憶在上述記財段，以最下層 被接合物之鮮驗置料鲜，料對準在上述既定之位 置’依序疊層上層被接合物。 另外’可以構建成利用附加在該最下層被接合物上面之校 準用標記辨識上述最下層被接合物之校準驗置，利用附加 100101395 8 201140739 述複數個上 在各個上層被接合物下面之校準用標記辨識上 層被接合物之校準用位置。 之:外個最好構建成使上述安褒控制手段，針對被依序疊層 =:個上層被接合物，變化相對於疊層方向之上述最下層 t接合物之位置或與其相當之基準位置之安裝高度，以此方 式控制上層被接合物之4層高度方向之位置。 另外’最好上述第2辨識手段係由在保持上層被接合物之 頭部位於絲位置上時，_上層被接合物的手段所構成。 在此種之一維安裝震置中，代表性之被接合物有晶片或晶 (發明效果） 依照本發明之三維安裝方法及裝置時，因為以最下層被接 合物之辨識位置作為基準，使全部之上層被接合物依序地位 置對準和疊層，所以不需要讀取先前技術之不容易讀取之各 個上層被接合物之上面，可以容易地進行高精確度之位置對 準’可以大幅地提高安裝精確度和提高高精確度三維安裝之 確實性。 【實施方式】 以下參照圖式同時說明本發明之較佳實施形態。 圖1表示本發明之一實施形態之三維安裝裝置。三維安裝 裝置1之構成是在具備有電極2之作為最下層被接合物之最 下層晶片3上，依序地疊層複數個之具備有貫穿電極4之作 100101395 9 201140739 為複數上層被接合物之上層晶片5，成為使電極2、 相位置對準之狀態。三維安«置1，如圖2所示’且有· ^物持)在裁物台 之最下層晶片3之校準用位置(例如，校準用標記之位 )，和第2辨識手段’用來辨識被保持在頭部·如，加 塵·加熱用頭部）之上層晶片5之校準用位置(例如，校準 用標記之位置）；在本實施形態中，第1辨識手段和第2辨 識手段構建成為在上下2額具有視野之2視識手段之 2視野攝影機8。2視野攝影機8被設置在下方之最下層晶 片3和上方之上層晶片5之間，亦即，對上層晶片$之安裝 位置可以依照需要進行進退。 三維安裝裝置1具有移動手段可以用來控制保持有上述 依序叠層之上層晶片5之上述頭部7和保持有上述最下層晶 片3之上述載物台6之相對位置’利用該移動手段之控制使 上層晶片5對最下層晶片3產生位置對準。在本實施態樣 中，要進行該位置對料是㈣㈣台6侧之位置，但是亦 可以構建纽制頭部7侧之位置，亦相構建成控制兩側之 位置。 另外，三維安裝裝置1具有安裝控制手段9,以上述第工 辨識手段所辨識到之最下層晶片3之校準用位置作為基 準’貫穿電極4依序連接至以上述第2辨識手段所辨識到之 全部上層晶片5之位置，依序對準在既定之位置，在其下層 100101395 10 201140739 依序疊層對準在既定之位置之上層晶片5。 二維安裝以如圖3所示之方式進行。 首先，利用第1辨識手段(在2視野攝影機8之下方具有 視野之攝影機)辨識被保持在載物台6上之最下層晶片3之 杈準用位置（校準用標記之位置），將該位置資訊記憶在安 裝控制手段9内之記憶手段。以被記憶在該記憶手段之最下 層晶片3之校準用位置資訊作為基準，依序進行被依序疊層 之全部上層晶片5之位置對準。上層晶片5之校準用位置(校 準用標記之位置）利用第2辨識手段（在2視野攝影機8之 上方具有視野之攝影機）辨識，使該辨識位置資訊和被記憶 在上述記憶手段之最下層晶片3之校準用位置資訊進行對 照’以使電極2、4間之位置互相對準之方式，控制上層晶 片5之位置。實際上在本實施態樣中因為控制載物台6侧之 位置，所以根據兩個位置資訊進行載物台6之位置控制。 因為王口p上層日日片5之位置以同樣之方式進行位置對 準，所以例如在上層晶片5為任何層數之疊層之情況時，全 部上層晶片5’使以同—最下層晶片3之校準用位置作為基 準’進行位置對準。因此，不需要如先前技術之方式之從依 序疊層之各個上層晶片5之各虹面侧讀取位置資訊(亦 即’因為不清楚所以不容易讀取之位置資訊），用來進行位 置對準。作為各個上層晶片5之位置資訊，使用以第2辨識 手段讀取容易讀取之下面側驗置資訊，所以可以抑制上述 100101395 ,, 201140739 位置對準時之誤紐生，可以改良位置對準之精確度，因而 可以大幅地提高使頭部7下降進行安裝之精確度，和可以大 提门用以進行所希望之三維安装之確實性，有助於安裝 步驟之穩定性，和可靠度之提高。 卜對於成為最上層之±層晶片5不需要與途中層同樣 之貫穿電極4。 另外，在上述實施態樣中是在安裝位置從晶片下面細 行上層晶片5之利用第2辨識手段（在2視野攝影機8之」 方具有視野之攝影機）之位置辨識，但是亦可以如圖4月 不’將被保持在頭部7之上層晶片5搬運到安裝位置，制 運之途中’利用具有與上述不同構造之第2辨識手段(右 如’只在上方具有視野之攝影機u)辨識校準用位置，令 用該辨識位置資訊，在安裝位置處，可以位置對 準之最下層晶片3讀準隸置。依照_方切，因^ 層晶片5之讀取時間可以減少’所以可以縮短具有一連串負 作之三維安裝步驟全體之時間。 (產業上之可利用性) 本發明之三維絲方法㈣置可以㈣在使具備有電 極之被接合物在上下方向進行疊層之所有三維安裴。 【圖式簡單說明][Technical Field] The present invention relates to a three-dimensional mounting method and apparatus for laminating and bonding a semiconductor element or the like in a vertical direction. [Prior Art] As a method of three-dimensional mounting of semiconductor elements, there is a COC method (Chip On Chip) in which a wafer is sequentially stacked on a wafer, and a COW method (Chip On Wafer) in which a wafer is sequentially stacked on a wafer. A WOW method (Wafer On Wafer) in which wafers are sequentially stacked on a wafer. In any of the three-dimensional ampoules methods, the position of the electrode of the object to be joined (including the bump) of the lower layer is required to be positioned in the state of the electrode of the object to be joined, and the upper layer is sequentially laminated. The joint, and the joining are performed (for example, Patent Document 1). In such a three-dimensional installation, in the prior art, when the upper layer is to be joined in sequence, the position of the non-layered object to be bonded is recognized from above by an identification means (for example, a CCD camera) (for example, the position of the electrode thereof) Or the position of the calibration mark), the position of the bonded object on the lower layer is used as a reference, the position of the upper layer of the bonded object is aligned on the upper layer, and the upper layer of the bonded object is identified from above by the identification means. Positioning, aligning the position of the upper layer of the joined object with the position of the bonded object as a reference, and repeating the operations for the necessary number of times for sequentially laminating The upper layer is aligned by the position of the splicing object. [Prior Art Document] 〇〇1〇1395 3 201140739 [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-110995 (Summary of the Invention) However, in the above manner In the method of sequentially aligning the positions of the objects to be joined stacked on the basis of the positions of the upper layer bonded objects, there are the following problems. That is, the upper layer of the joined object is sequentially laminated on the lowermost joined object, and a circuit surface is usually formed on one surface thereof, and an electrode penetrating from the circuit surface toward the back surface is provided. The circuit surface is placed on the lower side, and the bonding between the electrodes is performed on the object to be bonded under the bonding, and then lamination bonding is performed. The position of the joined object to be joined is recognized from the back side of the opposite side of the circuit surface, and the position of the object to be joined is aligned with the position recognized as a reference, and laminated and joined. Therefore, at the stage of laminating a plurality of upper-layer objects to be joined, it is necessary to frequently read and recognize the position of the layer-by-layer bonded object from the back side. However, 'in the bonded body sequentially laminated in this manner, the side of the circuit is generally clear, and the position of the electrode or the position of the position of the alignment mark for alignment is clearly recognized'. However, it is often unclear on the back side. Marked or printed with a mark shape, etc., the mark is also small and extremely difficult to read. Therefore, in the method of performing position recognition from the back side, the identification error is liable to occur, and the identification error of the calibration mark or the like directly causes deterioration in mounting accuracy. 100101395 4 201140739 In addition, when the above layer is mounted by the mark reference on the back side of the bonded pair, since the mark error is sequentially accumulated, the mounting offset of the lowermost layer in accordance with the number of layers is also increased. Therefore, the object of the present invention is to provide a readable high-end three-dimensional assembly (four) installation accuracy-dimensional installation method and apparatus for the problem of position recognition of the cutting-edge technology of the upper-cut type. The splicing is indeed and easily aligned with good precision. (Means for Solving the Problem) In order to solve the problem of the upper surface, the three-dimensional mounting method of the present invention is provided with a through-electrode in a state in which the electrodes are positioned in alignment with each other on the lowermost layered object having the electrode. a plurality of upper layer bonded objects, characterized in that: the identification position of the lowermost layered object is recognized, and the calibration position of the lowest layer of the object to be joined is recognized as a reference, and the electrodes are sequentially connected to all the upper layers. The position of the conjugate is sequentially aligned at a predetermined position, and the layers are aligned in a predetermined position above the layered object. In the three-dimensional mounting method of the present invention in this manner, first, the calibration position of the lowermost layer of the object to be joined is identified, and all the upper layers which are sequentially laminated are sequentially guided with the position of the lowermost layered object as a reference. The position of the joint is aligned. Therefore, regardless of how many layers are laminated on the upper layer, the upper layer is to be bonded (the upper surface of the upper layer to be bonded (the side opposite to the side of the circuit surface) is not used as a reference for alignment, and it is not necessary to recognize that it is not easy. Read the position of the side of the side. For the alignment of the upper layer bonded object, if it can be recognized on the easy-to-read side of the 100101395 5 201140739 lower side (circuit side), high precision can be identified. As a result, all of the upper-layer objects to be joined are aligned with respect to the calibration position of the same lowermost layered object, and when the positions of the respective upper-layer objects are aligned, the alignment positions of the respective upper-layer objects can be The easy-to-read lower side (circuit side) is recognized, so there is no room for the identification error for position alignment, and the occurrence of mounting errors can be suppressed, making it a stable and highly accurate three-dimensional installation. In the above-described three-dimensional mounting method t of the present invention, more specifically, the ith identification means is used to identify (identify from above) the calibration position and memory of the lowermost layered object, and sequentially identify by the second identification means (from Recognized below) The calibration position of the plurality of upper-layer objects is aligned with the calibration position of the lowest-level object to be bonded, and can be sequentially aligned at the predetermined position, and the calibration positions are sequentially laminated. Identify the upper layer of the spliced object. The identification method and the second identification means can be built into a means of having two fields of view in the vertical direction, and a wire division identification means can also be constructed. In addition, for the identification of the calibration position of each of the objects to be joined, the position of the electrode or the position of the object to be joined may be recognized, but if a mark for calibration is formed by adding a mark for calibration to a specific shape (for example, a cross shape or the like), Helps identify the increase in accuracy. For example, the calibration mark of the lowermost layer to be joined may be identified by the calibration mark 'added to the uppermost layer of the joined object, and the calibration rod 3 attached to the lower surface of each of the upper layered objects may be used to identify the above. A calibration position for a plurality of upper layer bonded objects. 100101395 / 201140739 In addition, the height of each upper layer to be joined varies with the progress of the lamination, so the field will be held on the top layer or the like, and the layer will be laminated on the lowermost layer to be joined or laminated. When the layer is on the bonded object on the uppermost layer of the bonded object, it is preferable that the reference height due to pressurization or the like is sequentially changed as the stacking progresses. That is, the mounting height can be controlled for each of the upper layer-joined objects to be laminated in this order at the position of the lowermost layer-joined object with respect to the layering direction or a reference position corresponding thereto. Further, it is preferable that the position for aligning the upper layer joined object is identified by the second identification means, for example, by using the second identification means to identify the upper layer joined object when the upper layer joined object is positioned at the mounting position. Identification is performed at the installation position, and the installation is continued in accordance with the identification, so that there is substantially no room for installation errors, which contributes to an improvement in the accuracy of the installation. However, for example, it is also possible to identify the calibration position of the upper layer of the joined object while transporting the upper layer to be bonded to the mounting position (for example, relative to the position of the head of the upper layer of the upper layer to be bonded). Install according to the identified position. In this case, since it is possible to recognize the advancement and retreat of the identification hand k for identifying the position for aligning the upper layer of the joined object at the mounting position, the time required for the series of steps from transport to installation can be shortened. In the present invention, as long as the plurality of upper-layer objects to be joined having the penetrating electrodes are three-dimensionally attached to the lowermost layer-attached material including the electrodes, all the forms and all kinds of objects to be joined can be used. The representative is that the object to be bonded is composed of a wafer or a wafer. In this case, it is possible to make 100101395 7 201140739 2 ^ en _ 卫法, w〇w The invention also provides a three-dimensional security method. The arrangement is provided with the lowest level of the electrode, and the mounting: quasi-state, sequentially laminated with the through-substance, and characterized by: means, the calibration position of the lowermost layer of the object on the object table ; shift 2 = :=: the above-mentioned layered upper layer is joined to the head and the (4) 2 identification means for maintaining the upper 妓 赖 接合 joint (4) object is used to identify that the head is held in the above head The above-mentioned upper layer is connected to the calibration position of the character; and the mounting layer is controlled by the interface (four) side ^ control slave to use the above! The identification hand (4) recognizes that the calibration position of the lower layer is to be used as a reference, and the electrodes are sequentially connected to the positions of all the upper-layer objects to be identified by the second identification means. The sequence (4) is aligned with the layered object above the predetermined position. In the three-dimensional mounting apparatus, 'the memory means can be constructed to memorize the calibration position of the lowest layer of the object to be joined identified by the first identification means, and the safety control means sequentially uses the second identification means. It is recognized that the position of the upper layer to be joined is stored in the above-mentioned money-saving section, and the uppermost layer of the object to be joined is freshly placed, and the upper layer of the object to be joined is sequentially laminated in the predetermined position. In addition, it can be constructed to identify the calibration of the lowermost layer of the object by using the calibration mark attached to the lowermost object to be bonded, and the plurality of calibrations for the upper layer of the object to be bonded are described by using 100101395 8 201140739. The mark identifies the position for calibration of the upper joined object. It is preferable that the outer layer is constructed such that the above-mentioned ampule control means, for the sequential stacking =: the upper layer of the joined object, changes the position of the lowermost layer t-joint relative to the laminating direction or a reference position corresponding thereto The mounting height controls the position of the four layers of the upper layer of the joined object in the height direction. Further, it is preferable that the second identifying means is constituted by a means for arranging the upper layer when the head of the upper layer joined object is positioned at the position of the wire. In such a one-dimensional mounting mount, a representative bonded object has a wafer or a crystal (effect of the invention). According to the three-dimensional mounting method and apparatus of the present invention, since the identification position of the lowermost joined object is used as a reference, All of the upper layers are sequentially aligned and laminated by the bonding objects, so that it is not necessary to read the upper layers of the upper bonding objects which are not easily read by the prior art, and it is possible to easily perform high-accuracy alignment. Significantly improve installation accuracy and increase the accuracy of high-accuracy 3D installations. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Fig. 1 shows a three-dimensional mounting apparatus according to an embodiment of the present invention. The three-dimensional mounting apparatus 1 is configured such that a plurality of the through-electrodes 4 are provided in a plurality of the lowermost wafers 3 including the electrodes 2 as the lowermost layer to be joined. The upper layer wafer 5 is in a state in which the electrodes 2 are aligned. The three-dimensional setting is set to 1, as shown in FIG. 2, and the object is placed at the position of the lowermost wafer 3 of the cutting table (for example, the position of the calibration mark), and the second identification means is used. Identifying a calibration position (for example, a position of a calibration mark) of the upper wafer 5 held in the head, such as a dusting/heating head; in the present embodiment, the first identification means and the second identification means The two-view camera 8 is constructed as a two-view means having a field of view on the top and bottom. The two-view camera 8 is disposed between the lowermost lower layer wafer 3 and the upper upper layer wafer 5, that is, the upper layer wafer is mounted. The position can be advanced and retracted as needed. The three-dimensional mounting device 1 has a moving means for controlling the relative position of the head 7 holding the above-mentioned sequentially laminated upper wafer 5 and the above-described stage 6 holding the lowermost wafer 3 by using the moving means Control causes the upper wafer 5 to be aligned to the lowermost wafer 3. In the present embodiment, the position is to be the position of the (4) (four) table 6 side, but the position of the side of the button 7 can also be constructed, and the position of the two sides is also constructed. Further, the three-dimensional mounting apparatus 1 has a mounting control means 9 for sequentially connecting the alignment position of the lowermost wafer 3 recognized by the above-described identification means to the 'through electrode 4' to be sequentially recognized by the second identification means. The positions of all the upper wafers 5 are sequentially aligned at a predetermined position, and the lower layer 100101395 10 201140739 is sequentially laminated to align the wafer 5 at a predetermined position. The two-dimensional installation is carried out in the manner shown in FIG. First, the first identification means (a camera having a field of view below the two-view camera 8) is used to recognize the position (the position of the calibration mark) of the lowermost wafer 3 held on the stage 6, and the position information is used. Memorize means of memory in the installation control means 9. The alignment of all of the upper wafers 5 sequentially stacked is sequentially performed with reference to the calibration position information of the lowermost wafer 3 memorized by the memory means. The calibration position of the upper wafer 5 (the position of the calibration mark) is identified by the second identification means (a camera having a field of view above the two-view camera 8), and the identification position information and the lowest-level wafer stored in the memory means are recorded. The calibration of the positional information of 3 is controlled to control the position of the upper wafer 5 so that the positions between the electrodes 2 and 4 are aligned with each other. Actually, in the present embodiment, since the position of the stage 6 side is controlled, the position control of the stage 6 is performed based on the two pieces of position information. Since the position of the upper layer 5 of the upper layer of the king's mouth is aligned in the same manner, for example, when the upper wafer 5 is a laminate of any number of layers, all of the upper wafers 5' are made the same as the lowermost wafer 3. The calibration position is used as a reference to perform position alignment. Therefore, it is not necessary to read the position information (i.e., the position information that is not easy to read because it is unclear) from the respective rainbow side sides of the respective upper layer wafers 5 which are sequentially laminated as in the prior art. alignment. As the position information of each of the upper layer wafers 5, the lower side inspection information that is easy to read is read by the second identification means, so that the misalignment of the above-mentioned 100101395, 201140739 position alignment can be suppressed, and the alignment accuracy can be improved. Therefore, the accuracy of mounting the head 7 for mounting can be greatly improved, and the reliability of the door can be used for the desired three-dimensional installation, which contributes to the stability of the mounting step and the improvement of reliability. It is not necessary for the ± layer wafer 5 to be the uppermost layer to have the same through electrode 4 as the intermediate layer. Further, in the above-described embodiment, the position identification of the upper layer wafer 5 by the second identification means (a camera having a field of view on the side of the two-view camera 8) is performed at a mounting position from the lower side of the wafer, but it is also possible as shown in FIG. The month is not 'moved to the mounting position on the upper layer 5 of the head 7, and the second identification means having the different structure as described above (right as the camera u having the field of view only above) is identified on the way of manufacture. The quasi-use position is used to determine the position information, and at the installation position, the lowermost wafer 3 that can be aligned is read and placed. According to the _ square cut, since the reading time of the wafer 5 can be reduced, the time for the entire three-dimensional mounting step having a series of negative operations can be shortened. (Industrial Applicability) The three-dimensional wire method of the present invention (4) can be used to (4) all three-dimensional ampules in which the object to be joined having the electrode is stacked in the vertical direction. [Simple diagram]

是本發明之-實施態樣之三維安裝裝置之概略構造 100101395 12 201140739 圖2是立體圖，用來表示圖1之三維安裝裝置之2視野之 辨識手段之最下層、上層被接合物之校準用位置辨識之狀 態。 圖3是概略構造圖，用來表示本發明之依序疊層上層被接 合物之狀態。 圖4是概略構造圖，用來表示上層被接合物之另一辨識方 法之實例。 【主要元件符號說明】 1 三維安裝裝置 2 電極 3 作為最下層被接合物之最下層晶片 4 貫穿電極 5 作為上層被接合物之上層晶片 6 載物台 7 頭部 8 作為具備有第1辨識手段和第2辨識手段之2視野 辨識手段之2視野攝影機 9 安裝控制手段 11 作為第2辨識手段之攝影機 100101395 13FIG. 2 is a perspective view showing the position of the lowermost layer and the upper layer of the object to be aligned of the two-dimensional identification device of the three-dimensional mounting device of FIG. The status of the identification. Fig. 3 is a schematic structural view showing the state of the laminated upper layer of the composite of the present invention. Fig. 4 is a schematic structural view showing an example of another identification method of the upper layer joined object. [Description of main component symbols] 1 Three-dimensional mounting device 2 Electrode 3 As the lowermost layer of the lowermost bonded object 4 Through-electrode 5 As the upper-layer bonded object Upper-layer wafer 6 Stage 7 Head 8 as the first identification means Two visual field recognition means for the second visual recognition means and the second visual recognition means 9 Mounting control means 11 As the second identification means, the camera 100101395 13

Claims (1)

201140739 七、申請專利範圍： 1·一種三維安裝方法，係、在具備有電極之最下層被接合物 上以電極間互相位置對準之狀態，依序疊層具備有貫穿電 極之複數個上層被接合物者，其賴在於：賴上述最下層 被接合物之校準用位置，以辨識到之最下層被接合物之校準 用位置作為基準，使電極依序連接到全部上層被接合物之位 置，依序對準在此既定之位置，依序疊層對準在岐之位置 之上層被接合物。 2. 如申請專利範圍第1項之三維安裝方法，其中，利用第 1辨識手段_上述最下層被接合物之鮮用位置並加以 記憶，利用第2辨識手段依序辨識複數個上層被接合物之校 準用位置，以被記憶之最下層被接合物之校準用位置作為基 準’將校準用位置被辨識之上層被接合物依序對準在上述既 定之位置並依序疊層。 3. 如申請專利範圍第1項之三維安裝方法，其中，利用附 加在該最下層被接合物上面之校準用標記，來辨識上述最下 層被接合物之校準用位置，並利用附加在各個上層被接合物 下面之校準用標記，來辨識上述複數個上層被接合物之校準 用位置。 4. 如申請專利範圍第1項之三維安裝方法，其中，針對被 依序疊層之每一個上層被接合物，控制相對於疊層方向之上· 述最下層被接合物之位置或與其相當之基準位置之安裝高 100101395 14 201140739 度。 5·如中請專利範圍» 2項之三維安裂方法，其中，當上層 •被接合物位於安裝位置上時，_第2辨識手段辨識上純 接合物。 6. 如申請專利範圍第m項中任1之三維安裝方法， 其中，上述被接合物由晶片或晶圓構成。 7. 種二維安裝裝置，係在具備有電極之最下層被接合物 上，以電極間互相位置對準之狀態，依序疊層具備有貫穿電 極之複數個上層被接合物者，其特徵在於具有：第丨辨識手 段，用來韻被保持絲物台上之上述最下層被接合物之校 準用位置；移動手段，可控㈣以保持上述被依序疊層之上 層被接合物之頭部和用以保持上述最下層被接合物之上述 載物台之相對位置；第2辨識手段，用來辨識被保持在上述 頭部之上述上層被接合物之校準用位置；和安裝控制手段， 以利用上述第1辨識手段辨識到之最下層被接合物之校準 用位置作為基準’使電極依序連接到以上述第2辨識手段辨 識到之全部上層被接合物之位置，依序對準在此既定之位 -置’並依序㈣對準麵定之位置之上層被接合物。 . 8.如中請專利範圍第7項之三維安裝裝置，其中，具有記 憶手段’用來記憶個上述第丨辨識手段辨朗之最下層被 接合物之校準用位置，上述安裝控射段以將彻上述^ 2 辨識手段依序辨識到之上層被接合物之位置記憶在上述記 100101395 15 201140739 憶手段的最下層被接合物之校準用位置作為基準，依序對準 在上述既定之位置，並依序疊層上層被接合物。 9. 如申請專利範圍第7項之三維安裝裝置，其中，利用附 加在該最下層被接合物上面之校準用標記，來辨識上述最下 層被接合物之校準用位置，並利用附加在各個上層被接合物 下面之校準用標記’來辨識上述複數個上層被接合物之校準 用位置。 10. 如申請專利範圍第7項之三維安裝裝置，其中，上述 安裝控制手段係針對被依序疊層之每一個上層被接合物，以 變化對於疊層方向之上述最下層被接合物之位置或與其相 當之基準位置之安裝高度的方式，控制上層被接合物之叠層 高度方向之位置。 11. 如申請專利範圍第7項之三維安裝裝置，其中，上述 第2辨識手段係在保持上層被接合物之頭部位於安裝位置 上時’辨識上層被接合物。 、 12·如中請專利範圍第7至u項中任—項之三維安裝裝 置’其中，上述被接合物由晶片或晶圓構成。 100101395 16201140739 VII. Patent application scope: 1. A three-dimensional mounting method in which a plurality of upper layers having through electrodes are sequentially laminated in a state in which electrodes are aligned with each other on a lowermost layered object having electrodes. The splicer is based on the position of the aligning of the lowermost joined object, and the electrode is sequentially connected to the position of all the upper joined objects with the calibration position of the lowest bonded object as the reference. Aligning sequentially at this predetermined position, the layers are aligned in alignment with the layered objects above the crucible. 2. The three-dimensional mounting method according to the first aspect of the patent application, wherein the first identification means _ the fresh position of the lowermost joined object is used and memorized, and the plurality of upper layer spliced objects are sequentially identified by the second identification means. The calibration position is based on the calibration position of the lowest layer of the object to be bonded as the reference. The calibration position is recognized. The upper layer of the bonded object is sequentially aligned at the predetermined position and sequentially laminated. 3. The three-dimensional mounting method of claim 1, wherein the calibration mark attached to the lowermost layer of the joined object is used to identify the calibration position of the lowermost joined object, and is attached to each upper layer A calibration mark under the object to be bonded is used to identify the calibration position of the plurality of upper layer objects. 4. The three-dimensional mounting method according to claim 1, wherein for each of the upper-layer objects to be laminated in order, the position of the lowermost layered object above or opposite to the lamination direction is controlled or equivalent thereto The installation of the reference position is high 100101395 14 201140739 degrees. 5. The three-dimensional anti-cracking method of the patent scope»2, wherein the upper identification means the pure joint when the upper layer is to be placed at the mounting position. 6. The three-dimensional mounting method according to any one of claim 1, wherein the object to be bonded is composed of a wafer or a wafer. 7. A two-dimensional mounting device in which a plurality of upper-layer conjugates having a penetrating electrode are laminated in a state in which the electrodes are positioned on the lowest layer of the electrode, and the electrodes are aligned with each other. The method includes: a second identification means for maintaining a calibration position of the lowermost layer of the joined object on the wire stage; and a moving means for controlling (four) to maintain the head of the upper layer of the joined object in sequence And a relative position of the stage for holding the lowermost joined object; and a second identifying means for identifying a calibration position of the upper bonded object held by the head; and mounting control means, By using the calibration position of the lowermost layered object identified by the first identification means as a reference, the electrodes are sequentially connected to the positions of all the upper layer objects to be recognized by the second identification means, and sequentially aligned. This predetermined position - set 'and in order (4) is aligned with the top layer of the bonded object. 8. The three-dimensional mounting device of claim 7, wherein the memory means is for storing a calibration position of the lowermost layer of the object to be distinguished by the second identification means, wherein the mounting control section is The position of the upper layer of the object to be bonded is sequentially recognized by the above-mentioned identification means, and the position of the alignment of the lowermost layer of the object to be recorded is used as a reference, and sequentially aligned at the predetermined position. The upper layer of the joined object is laminated in sequence. 9. The three-dimensional mounting apparatus of claim 7, wherein the calibration mark attached to the lowermost layer of the joined object is used to identify the calibration position of the lowermost joined object, and is attached to each upper layer. The calibration mark under the object to be bonded identifies the calibration position of the plurality of upper-layer objects. 10. The three-dimensional mounting device of claim 7, wherein the mounting control means is for each of the upper layer-joined objects to be laminated in order to change the position of the lowermost layer of the joined object in the lamination direction. The position of the stacking height of the upper layer of the joined object is controlled in such a manner as to match the mounting height of the reference position. 11. The three-dimensional mounting apparatus of claim 7, wherein the second identifying means identifies the upper layer of the joined object while maintaining the head of the upper joined object at the mounting position. 12. The three-dimensional mounting device of any one of clauses 7 to 5, wherein the object to be bonded is composed of a wafer or a wafer. 100101395 16
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JP7177781B2 (en) * 2017-03-16 2022-11-24 エーファウ・グループ・エー・タルナー・ゲーエムベーハー Method for bonding at least three substrates
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