JP2013536539A5 - - Google Patents

Download PDF

Info

Publication number
JP2013536539A5
JP2013536539A5 JP2013512105A JP2013512105A JP2013536539A5 JP 2013536539 A5 JP2013536539 A5 JP 2013536539A5 JP 2013512105 A JP2013512105 A JP 2013512105A JP 2013512105 A JP2013512105 A JP 2013512105A JP 2013536539 A5 JP2013536539 A5 JP 2013536539A5
Authority
JP
Japan
Prior art keywords
coolant
plasma
temperature
flow rate
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013512105A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013536539A (ja
Filing date
Publication date
Priority claimed from US13/040,149 external-priority patent/US8880227B2/en
Application filed filed Critical
Publication of JP2013536539A publication Critical patent/JP2013536539A/ja
Publication of JP2013536539A5 publication Critical patent/JP2013536539A5/ja
Pending legal-status Critical Current

Links

JP2013512105A 2010-05-27 2011-05-20 クーラント流量の制御及びヒーターのデューティーサイクルの制御による部品温度制御 Pending JP2013536539A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US34907310P 2010-05-27 2010-05-27
US61/349,073 2010-05-27
US13/040,149 2011-03-03
US13/040,149 US8880227B2 (en) 2010-05-27 2011-03-03 Component temperature control by coolant flow control and heater duty cycle control
PCT/US2011/037436 WO2011149790A2 (en) 2010-05-27 2011-05-20 Component temperature control by coolant flow control and heater duty cycle control

Publications (2)

Publication Number Publication Date
JP2013536539A JP2013536539A (ja) 2013-09-19
JP2013536539A5 true JP2013536539A5 (enExample) 2014-07-24

Family

ID=45004685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013512105A Pending JP2013536539A (ja) 2010-05-27 2011-05-20 クーラント流量の制御及びヒーターのデューティーサイクルの制御による部品温度制御

Country Status (6)

Country Link
US (2) US8880227B2 (enExample)
JP (1) JP2013536539A (enExample)
KR (1) KR101476727B1 (enExample)
CN (2) CN106842966B (enExample)
TW (3) TWI564930B (enExample)
WO (1) WO2011149790A2 (enExample)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5465954B2 (ja) * 2008-09-29 2014-04-09 株式会社日立国際電気 基板処理装置及び判断プログラムを格納する記憶媒体及び基板処理装置の表示方法
US9338871B2 (en) * 2010-01-29 2016-05-10 Applied Materials, Inc. Feedforward temperature control for plasma processing apparatus
US8916793B2 (en) 2010-06-08 2014-12-23 Applied Materials, Inc. Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
US8880227B2 (en) 2010-05-27 2014-11-04 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
US8580693B2 (en) * 2010-08-27 2013-11-12 Applied Materials, Inc. Temperature enhanced electrostatic chucking in plasma processing apparatus
JP5732941B2 (ja) * 2011-03-16 2015-06-10 東京エレクトロン株式会社 プラズマエッチング装置及びプラズマエッチング方法
JP5712741B2 (ja) * 2011-03-31 2015-05-07 東京エレクトロン株式会社 プラズマ処理装置、プラズマ処理方法及び記憶媒体
US9165804B2 (en) 2011-04-29 2015-10-20 Applied Materials, Inc. Methods of cooling process chamber components
US10274270B2 (en) 2011-10-27 2019-04-30 Applied Materials, Inc. Dual zone common catch heat exchanger/chiller
US9436497B2 (en) * 2012-09-10 2016-09-06 Apple Inc. Linking multiple independent control systems to distribute response
US20140069130A1 (en) * 2012-09-10 2014-03-13 Semicat, Inc. Temperature control of semiconductor processing chambers
JP5998010B2 (ja) 2012-10-24 2016-09-28 株式会社Screenホールディングス 基板処理装置、基板処理システム、基板処理装置の制御方法、プログラムおよび記録媒体
JP6070145B2 (ja) * 2012-12-13 2017-02-01 オムロン株式会社 調節器、操作量出力方法、プログラムおよび記憶媒体
JP6159172B2 (ja) * 2013-06-26 2017-07-05 東京エレクトロン株式会社 温度制御方法及びプラズマ処理装置
JP6230437B2 (ja) * 2014-02-04 2017-11-15 東京エレクトロン株式会社 温度測定方法及びプラズマ処理システム
JP6158111B2 (ja) * 2014-02-12 2017-07-05 東京エレクトロン株式会社 ガス供給方法及び半導体製造装置
JP6123741B2 (ja) * 2014-06-20 2017-05-10 トヨタ自動車株式会社 冷却器
US9823636B2 (en) * 2014-07-29 2017-11-21 Dell Products L.P. Systems and methods for parallel feedback temperature control
CN104155749A (zh) * 2014-09-04 2014-11-19 中国科学院光电技术研究所 一种可用于大口径地基太阳望远镜的热视场光阑温控装置
US20160149733A1 (en) * 2014-11-26 2016-05-26 Applied Materials, Inc. Control architecture for devices in an rf environment
US9872341B2 (en) 2014-11-26 2018-01-16 Applied Materials, Inc. Consolidated filter arrangement for devices in an RF environment
US10240870B2 (en) 2015-01-26 2019-03-26 Spex Sample Prep, Llc Method for operating a power-compensated fusion furnace
US11513042B2 (en) * 2015-01-26 2022-11-29 SPEX SamplePrep, LLC Power-compensated fusion furnace
US10780447B2 (en) * 2016-04-26 2020-09-22 Applied Materials, Inc. Apparatus for controlling temperature uniformity of a showerhead
US11837479B2 (en) 2016-05-05 2023-12-05 Applied Materials, Inc. Advanced temperature control for wafer carrier in plasma processing chamber
US20180053666A1 (en) 2016-08-19 2018-02-22 Applied Materials, Inc. Substrate carrier with array of independently controllable heater elements
US10725485B2 (en) * 2016-12-15 2020-07-28 Lam Research Corporation System and method for calculating substrate support temperature
DE102018204585A1 (de) * 2017-03-31 2018-10-04 centrotherm international AG Plasmagenerator, Plasma-Behandlungsvorrichtung und Verfahren zum gepulsten Bereitstellen von elektrischer Leistung
US10867812B2 (en) 2017-08-30 2020-12-15 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor manufacturing system and control method
US10415899B2 (en) * 2017-12-28 2019-09-17 Asm Ip Holding B.V. Cooling system, substrate processing system and flow rate adjusting method for cooling medium
US10816244B2 (en) 2018-03-01 2020-10-27 Laird Thermal Systems, Inc. Compressor chiller systems including thermoelectric modules, and corresponding control methods
CN112368415B (zh) 2018-07-05 2024-03-22 朗姆研究公司 衬底处理系统中的衬底支撑件的动态温度控制
US11183400B2 (en) 2018-08-08 2021-11-23 Lam Research Corporation Progressive heating of components of substrate processing systems using TCR element-based heaters
US10971384B2 (en) * 2018-09-13 2021-04-06 Lam Research Corporation Auto-calibrated process independent feedforward control for processing substrates
CN112753097B (zh) * 2018-09-24 2024-09-27 朗姆研究公司 多路复用的基于高tcr的安瓿加热器
TW202531282A (zh) * 2018-11-30 2025-08-01 日商東京威力科創股份有限公司 電漿處理裝置
WO2020122933A1 (en) * 2018-12-14 2020-06-18 Hewlett-Packard Development Company, L.P. Power control based on cumulative error
US11533783B2 (en) * 2019-07-18 2022-12-20 Applied Materials, Inc. Multi-zone heater model-based control in semiconductor manufacturing
CN110440602A (zh) * 2019-08-13 2019-11-12 德淮半导体有限公司 一种冷却水自动调节系统
JP7392118B2 (ja) * 2019-09-06 2023-12-05 キンタス・テクノロジーズ・エービー 熱間圧接装置内で冷却速度を制御する方法、制御モジュール、および圧接装置それ自体
CA3060479C (en) * 2019-09-20 2022-11-15 Payam Tavakoli System and method for controlling water heater output temperature
CN112951694B (zh) * 2019-11-26 2024-05-10 中微半导体设备(上海)股份有限公司 等离子体处理装置及其半导体晶圆的处理方法
CN112859498B (zh) 2019-11-28 2022-07-12 中强光电股份有限公司 照明装置、投影系统及其操作方法
KR20210126387A (ko) * 2020-04-10 2021-10-20 주성엔지니어링(주) 기판 처리 장치 및 방법
US12278094B2 (en) * 2020-05-08 2025-04-15 Applied Materials, Inc. Methods and apparatus for processing a substrate
US12191169B2 (en) 2020-07-19 2025-01-07 Applied Materials, Inc. Systems and methods for faceplate temperature control
WO2022040164A1 (en) * 2020-08-18 2022-02-24 Mattson Technology, Inc. Rapid thermal processing system with cooling system
JP7528659B2 (ja) * 2020-09-10 2024-08-06 東京エレクトロン株式会社 基板を加熱する装置及び方法
US12326282B2 (en) * 2023-01-05 2025-06-10 Applied Materials, Inc. Cooling flow in substrate processing according to predicted cooling parameters
WO2025230886A1 (en) * 2024-05-01 2025-11-06 Lam Research Corporation Temperature control of substrate processing chamber plates using pwm to analog converters and proportional valves
US20250349575A1 (en) * 2024-05-09 2025-11-13 Applied Materials, Inc. Semiconductor processing chamber thermal control
CN118655933B (zh) * 2024-08-20 2024-11-05 中国计量大学 提高量热仪等温控制收敛速度的方法、系统、设备及介质
CN118963456B (zh) * 2024-10-17 2025-01-24 青岛四方思锐智能技术有限公司 一种反应腔室温度的控制系统、方法及电子设备
CN120523262B (zh) * 2025-07-28 2025-10-31 上海芯源微企业发展有限公司 机台加热系统的控温方法、装置、可读介质及电子设备

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796170B2 (ja) * 1990-01-12 1995-10-18 日産車体株式会社 ロボットセット治具
JP3147392B2 (ja) 1991-03-04 2001-03-19 宇部サイコン株式会社 熱可塑性樹脂組成物
JPH0796170A (ja) * 1993-09-09 1995-04-11 Tokyo Electron Ltd 熱処理装置の温度制御方法
US5435145A (en) 1994-03-03 1995-07-25 General Electric Company Refrigerant flow rate control based on liquid level in simple vapor compression refrigeration cycles
US5548470A (en) 1994-07-19 1996-08-20 International Business Machines Corporation Characterization, modeling, and design of an electrostatic chuck with improved wafer temperature uniformity
US5644467A (en) 1995-09-28 1997-07-01 Applied Materials, Inc. Method and structure for improving gas breakdown resistance and reducing the potential of arcing in a electrostatic chuck
US5711851A (en) 1996-07-12 1998-01-27 Micron Technology, Inc. Process for improving the performance of a temperature-sensitive etch process
US6095426A (en) * 1997-11-07 2000-08-01 Siemens Building Technologies Room temperature control apparatus having feedforward and feedback control and method
KR100254793B1 (ko) * 1997-12-08 2000-05-01 윤종용 반도체장치 제조설비의 케미컬 분사장치 및 그 장치에 사용되는폐액조
US6018932A (en) 1998-01-07 2000-02-01 Premark Feg L.L.C. Gas exchange apparatus
US5997649A (en) * 1998-04-09 1999-12-07 Tokyo Electron Limited Stacked showerhead assembly for delivering gases and RF power to a reaction chamber
US6125025A (en) 1998-09-30 2000-09-26 Lam Research Corporation Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors
US6368975B1 (en) 1999-07-07 2002-04-09 Applied Materials, Inc. Method and apparatus for monitoring a process by employing principal component analysis
US6776801B2 (en) 1999-12-16 2004-08-17 Sail Star Inc. Dry cleaning method and apparatus
AU3084101A (en) * 2000-01-05 2001-07-16 Tokyo Electron Limited A method of wafer band-edge measurement using transmission spectroscopy and a process for controlling the temperature uniformity of a wafer
JP2001237226A (ja) 2000-02-23 2001-08-31 Kobe Steel Ltd プラズマ処理装置
US6635117B1 (en) 2000-04-26 2003-10-21 Axcelis Technologies, Inc. Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system
US6606234B1 (en) 2000-09-05 2003-08-12 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chuck and method for forming an electrostatic chuck having porous regions for fluid flow
US7069984B2 (en) * 2001-02-08 2006-07-04 Oriol Inc. Multi-channel temperature control system for semiconductor processing facilities
US20020139477A1 (en) * 2001-03-30 2002-10-03 Lam Research Corporation Plasma processing method and apparatus with control of plasma excitation power
JP3708031B2 (ja) * 2001-06-29 2005-10-19 株式会社日立製作所 プラズマ処理装置および処理方法
US6651761B1 (en) * 2001-09-27 2003-11-25 Ford Global Technologies, Llc Temperature control system for fuel cell electric vehicle cooling circuit
US6921724B2 (en) * 2002-04-02 2005-07-26 Lam Research Corporation Variable temperature processes for tunable electrostatic chuck
KR101044366B1 (ko) * 2002-06-12 2011-06-29 어플라이드 머티어리얼스, 인코포레이티드 기판을 처리하기 위한 플라즈마 방법 및 장치
JP2004063670A (ja) * 2002-07-26 2004-02-26 Dainippon Screen Mfg Co Ltd 制御装置および制御方法並びに熱処理装置および熱処理方法
CN1745282B (zh) * 2002-12-09 2010-04-21 哈德逊技术公司 用于优化致冷系统的方法和设备
US7221553B2 (en) * 2003-04-22 2007-05-22 Applied Materials, Inc. Substrate support having heat transfer system
JP2005026552A (ja) * 2003-07-04 2005-01-27 Matsushita Electric Ind Co Ltd プラズマ処理方法
DE10336599B4 (de) * 2003-08-08 2016-08-04 Daimler Ag Verfahren zur Ansteuerung eines Thermostaten in einem Kühlkreislauf eines Verbrennungsmotors
JP2005079415A (ja) 2003-09-02 2005-03-24 Hitachi High-Technologies Corp プラズマ処理装置
CN100570805C (zh) * 2003-09-22 2009-12-16 Mks仪器股份有限公司 避免射频等离子加工中的不稳定性的方法和装置
JP2005123308A (ja) * 2003-10-15 2005-05-12 Hitachi Kokusai Electric Inc 基板処理装置
JP2005210080A (ja) * 2003-12-25 2005-08-04 Tokyo Electron Ltd 温度調節方法及び温度調節装置
US7200996B2 (en) * 2004-05-06 2007-04-10 United Technologies Corporation Startup and control methods for an ORC bottoming plant
JP4522783B2 (ja) 2004-08-03 2010-08-11 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法
US7544251B2 (en) 2004-10-07 2009-06-09 Applied Materials, Inc. Method and apparatus for controlling temperature of a substrate
TWI314842B (en) 2005-01-28 2009-09-11 Advanced Display Proc Eng Co Plasma processing apparatus
JP2006339253A (ja) 2005-05-31 2006-12-14 Toshiba Corp プラズマ処理装置及びプラズマ処理方法
JP2006351887A (ja) 2005-06-17 2006-12-28 Hitachi High-Technologies Corp プラズマ処理装置
GB0516695D0 (en) * 2005-08-15 2005-09-21 Boc Group Plc Microwave plasma reactor
JP4878801B2 (ja) * 2005-09-26 2012-02-15 株式会社日立国際電気 基板処理装置、半導体装置の製造方法
US20070091541A1 (en) 2005-10-20 2007-04-26 Applied Materials, Inc. Method of processing a workpiece in a plasma reactor using feed forward thermal control
US8226769B2 (en) 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
JP4779807B2 (ja) 2006-05-29 2011-09-28 株式会社島津製作所 Icp発光分光分析装置
US20080060978A1 (en) 2006-06-14 2008-03-13 Paul Wegner Handling and extracting hydrocarbons from tar sands
CN101495822A (zh) * 2006-07-10 2009-07-29 埃地沃兹真空系统有限公司 控制温度的方法
JP4815298B2 (ja) 2006-07-31 2011-11-16 株式会社日立ハイテクノロジーズ プラズマ処理方法
US20080035306A1 (en) 2006-08-08 2008-02-14 White John M Heating and cooling of substrate support
US20080148706A1 (en) * 2006-12-22 2008-06-26 Mark Beauregard Method of maintaining aircraft gas turbine engine
JP4838197B2 (ja) 2007-06-05 2011-12-14 東京エレクトロン株式会社 プラズマ処理装置,電極温度調整装置,電極温度調整方法
US20090065181A1 (en) 2007-09-07 2009-03-12 Spx Cooling Technologies, Inc. System and method for heat exchanger fluid handling with atmospheric tower
WO2009076576A2 (en) 2007-12-12 2009-06-18 Eco2 Plastics Continuous system for processing particles
JP4486135B2 (ja) * 2008-01-22 2010-06-23 東京エレクトロン株式会社 温度制御機構およびそれを用いた処理装置
JP5551343B2 (ja) 2008-05-14 2014-07-16 東京エレクトロン株式会社 誘導結合プラズマ処理装置
US8596336B2 (en) 2008-06-03 2013-12-03 Applied Materials, Inc. Substrate support temperature control
JP5433171B2 (ja) * 2008-06-16 2014-03-05 株式会社日立ハイテクノロジーズ 試料温度の制御方法
KR20110075009A (ko) 2008-10-06 2011-07-05 서노베이션즈 인코포레이션 과열방지 적응형 태양열 급탕장치
JP5374109B2 (ja) * 2008-10-17 2013-12-25 株式会社アルバック 加熱真空処理方法
US20100116788A1 (en) 2008-11-12 2010-05-13 Lam Research Corporation Substrate temperature control by using liquid controlled multizone substrate support
JP5655010B2 (ja) 2009-02-11 2015-01-14 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 非接触基板処理のための方法及び装置
US8404572B2 (en) 2009-02-13 2013-03-26 Taiwan Semiconductor Manufacturing Co., Ltd Multi-zone temperature control for semiconductor wafer
US8916793B2 (en) 2010-06-08 2014-12-23 Applied Materials, Inc. Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
US9338871B2 (en) 2010-01-29 2016-05-10 Applied Materials, Inc. Feedforward temperature control for plasma processing apparatus
US8880227B2 (en) 2010-05-27 2014-11-04 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
US8608852B2 (en) 2010-06-11 2013-12-17 Applied Materials, Inc. Temperature controlled plasma processing chamber component with zone dependent thermal efficiencies

Similar Documents

Publication Publication Date Title
JP2013536539A5 (enExample)
CN102907181B (zh) 通过冷却剂流量控制及加热器占空比控制的组件温度控制
JP2013534695A5 (enExample)
US20140202679A1 (en) Hot water supply apparatus and control method thereof
JP5964244B2 (ja) プラズマ処理装置のフィードフォワード温度制御方法および当該方法を実行させる命令をストアしたコンピュータ可読媒体、温度コントローラおよび当該コントローラを有するプラズマ処理装置
WO2011156239A3 (en) Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
CN201196747Y (zh) 电热水器恒温控制装置
JP2012506128A5 (enExample)
US20080231304A1 (en) Apparatus and method for controlling temperature in a chuck system
SG195553A1 (en) Methods and apparatus for rapidly responsive heat control in plasma processing devices
TW201637077A (zh) 熱處理裝置及熱處理方法
WO2013062870A1 (en) Component temperature control using a combination of proportional control valves and pulsed valves
JP4862064B2 (ja) 電子制御装置
CN104076844B (zh) 一种电机冷却控制系统的控制方法
JP6129760B2 (ja) 温調装置
JP2008282413A (ja) 流体温度制御装置及び方法
Tang et al. Constrained off-line synthesis approach of model predictive control for networked control systems with network-induced delays
WO2021186976A1 (ja) 温度制御システム
KR100809490B1 (ko) 미세 유량 제어가 가능한 밸브 시스템 및 그의 미세 유량제어방법
CN110502049B (zh) 卡盘温度控制方法、卡盘温度控制系统及半导体设备
KR101609308B1 (ko) 솔레노이드 밸브 제어 장치 및 제어 방법
JP2003343270A (ja) 水温調節装置
JP2016217641A (ja) 湯水混合装置
JPH0331914A (ja) 温度調節方法
JPH0510588A (ja) 給湯器の出湯温度制御方法