JP2013536539A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013536539A5 JP2013536539A5 JP2013512105A JP2013512105A JP2013536539A5 JP 2013536539 A5 JP2013536539 A5 JP 2013536539A5 JP 2013512105 A JP2013512105 A JP 2013512105A JP 2013512105 A JP2013512105 A JP 2013512105A JP 2013536539 A5 JP2013536539 A5 JP 2013536539A5
- Authority
- JP
- Japan
- Prior art keywords
- coolant
- plasma
- temperature
- flow rate
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002826 coolant Substances 0.000 claims 24
- 238000000034 method Methods 0.000 claims 20
- 238000010438 heat treatment Methods 0.000 claims 13
- 239000012530 fluid Substances 0.000 claims 5
- 239000007788 liquid Substances 0.000 claims 2
- 230000001052 transient effect Effects 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34907310P | 2010-05-27 | 2010-05-27 | |
| US61/349,073 | 2010-05-27 | ||
| US13/040,149 | 2011-03-03 | ||
| US13/040,149 US8880227B2 (en) | 2010-05-27 | 2011-03-03 | Component temperature control by coolant flow control and heater duty cycle control |
| PCT/US2011/037436 WO2011149790A2 (en) | 2010-05-27 | 2011-05-20 | Component temperature control by coolant flow control and heater duty cycle control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013536539A JP2013536539A (ja) | 2013-09-19 |
| JP2013536539A5 true JP2013536539A5 (enExample) | 2014-07-24 |
Family
ID=45004685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013512105A Pending JP2013536539A (ja) | 2010-05-27 | 2011-05-20 | クーラント流量の制御及びヒーターのデューティーサイクルの制御による部品温度制御 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8880227B2 (enExample) |
| JP (1) | JP2013536539A (enExample) |
| KR (1) | KR101476727B1 (enExample) |
| CN (2) | CN106842966B (enExample) |
| TW (3) | TWI564930B (enExample) |
| WO (1) | WO2011149790A2 (enExample) |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5465954B2 (ja) * | 2008-09-29 | 2014-04-09 | 株式会社日立国際電気 | 基板処理装置及び判断プログラムを格納する記憶媒体及び基板処理装置の表示方法 |
| US9338871B2 (en) * | 2010-01-29 | 2016-05-10 | Applied Materials, Inc. | Feedforward temperature control for plasma processing apparatus |
| US8916793B2 (en) | 2010-06-08 | 2014-12-23 | Applied Materials, Inc. | Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow |
| US8880227B2 (en) | 2010-05-27 | 2014-11-04 | Applied Materials, Inc. | Component temperature control by coolant flow control and heater duty cycle control |
| US8580693B2 (en) * | 2010-08-27 | 2013-11-12 | Applied Materials, Inc. | Temperature enhanced electrostatic chucking in plasma processing apparatus |
| JP5732941B2 (ja) * | 2011-03-16 | 2015-06-10 | 東京エレクトロン株式会社 | プラズマエッチング装置及びプラズマエッチング方法 |
| JP5712741B2 (ja) * | 2011-03-31 | 2015-05-07 | 東京エレクトロン株式会社 | プラズマ処理装置、プラズマ処理方法及び記憶媒体 |
| US9165804B2 (en) | 2011-04-29 | 2015-10-20 | Applied Materials, Inc. | Methods of cooling process chamber components |
| US10274270B2 (en) | 2011-10-27 | 2019-04-30 | Applied Materials, Inc. | Dual zone common catch heat exchanger/chiller |
| US9436497B2 (en) * | 2012-09-10 | 2016-09-06 | Apple Inc. | Linking multiple independent control systems to distribute response |
| US20140069130A1 (en) * | 2012-09-10 | 2014-03-13 | Semicat, Inc. | Temperature control of semiconductor processing chambers |
| JP5998010B2 (ja) | 2012-10-24 | 2016-09-28 | 株式会社Screenホールディングス | 基板処理装置、基板処理システム、基板処理装置の制御方法、プログラムおよび記録媒体 |
| JP6070145B2 (ja) * | 2012-12-13 | 2017-02-01 | オムロン株式会社 | 調節器、操作量出力方法、プログラムおよび記憶媒体 |
| JP6159172B2 (ja) * | 2013-06-26 | 2017-07-05 | 東京エレクトロン株式会社 | 温度制御方法及びプラズマ処理装置 |
| JP6230437B2 (ja) * | 2014-02-04 | 2017-11-15 | 東京エレクトロン株式会社 | 温度測定方法及びプラズマ処理システム |
| JP6158111B2 (ja) * | 2014-02-12 | 2017-07-05 | 東京エレクトロン株式会社 | ガス供給方法及び半導体製造装置 |
| JP6123741B2 (ja) * | 2014-06-20 | 2017-05-10 | トヨタ自動車株式会社 | 冷却器 |
| US9823636B2 (en) * | 2014-07-29 | 2017-11-21 | Dell Products L.P. | Systems and methods for parallel feedback temperature control |
| CN104155749A (zh) * | 2014-09-04 | 2014-11-19 | 中国科学院光电技术研究所 | 一种可用于大口径地基太阳望远镜的热视场光阑温控装置 |
| US20160149733A1 (en) * | 2014-11-26 | 2016-05-26 | Applied Materials, Inc. | Control architecture for devices in an rf environment |
| US9872341B2 (en) | 2014-11-26 | 2018-01-16 | Applied Materials, Inc. | Consolidated filter arrangement for devices in an RF environment |
| US10240870B2 (en) | 2015-01-26 | 2019-03-26 | Spex Sample Prep, Llc | Method for operating a power-compensated fusion furnace |
| US11513042B2 (en) * | 2015-01-26 | 2022-11-29 | SPEX SamplePrep, LLC | Power-compensated fusion furnace |
| US10780447B2 (en) * | 2016-04-26 | 2020-09-22 | Applied Materials, Inc. | Apparatus for controlling temperature uniformity of a showerhead |
| US11837479B2 (en) | 2016-05-05 | 2023-12-05 | Applied Materials, Inc. | Advanced temperature control for wafer carrier in plasma processing chamber |
| US20180053666A1 (en) | 2016-08-19 | 2018-02-22 | Applied Materials, Inc. | Substrate carrier with array of independently controllable heater elements |
| US10725485B2 (en) * | 2016-12-15 | 2020-07-28 | Lam Research Corporation | System and method for calculating substrate support temperature |
| DE102018204585A1 (de) * | 2017-03-31 | 2018-10-04 | centrotherm international AG | Plasmagenerator, Plasma-Behandlungsvorrichtung und Verfahren zum gepulsten Bereitstellen von elektrischer Leistung |
| US10867812B2 (en) | 2017-08-30 | 2020-12-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor manufacturing system and control method |
| US10415899B2 (en) * | 2017-12-28 | 2019-09-17 | Asm Ip Holding B.V. | Cooling system, substrate processing system and flow rate adjusting method for cooling medium |
| US10816244B2 (en) | 2018-03-01 | 2020-10-27 | Laird Thermal Systems, Inc. | Compressor chiller systems including thermoelectric modules, and corresponding control methods |
| CN112368415B (zh) | 2018-07-05 | 2024-03-22 | 朗姆研究公司 | 衬底处理系统中的衬底支撑件的动态温度控制 |
| US11183400B2 (en) | 2018-08-08 | 2021-11-23 | Lam Research Corporation | Progressive heating of components of substrate processing systems using TCR element-based heaters |
| US10971384B2 (en) * | 2018-09-13 | 2021-04-06 | Lam Research Corporation | Auto-calibrated process independent feedforward control for processing substrates |
| CN112753097B (zh) * | 2018-09-24 | 2024-09-27 | 朗姆研究公司 | 多路复用的基于高tcr的安瓿加热器 |
| TW202531282A (zh) * | 2018-11-30 | 2025-08-01 | 日商東京威力科創股份有限公司 | 電漿處理裝置 |
| WO2020122933A1 (en) * | 2018-12-14 | 2020-06-18 | Hewlett-Packard Development Company, L.P. | Power control based on cumulative error |
| US11533783B2 (en) * | 2019-07-18 | 2022-12-20 | Applied Materials, Inc. | Multi-zone heater model-based control in semiconductor manufacturing |
| CN110440602A (zh) * | 2019-08-13 | 2019-11-12 | 德淮半导体有限公司 | 一种冷却水自动调节系统 |
| JP7392118B2 (ja) * | 2019-09-06 | 2023-12-05 | キンタス・テクノロジーズ・エービー | 熱間圧接装置内で冷却速度を制御する方法、制御モジュール、および圧接装置それ自体 |
| CA3060479C (en) * | 2019-09-20 | 2022-11-15 | Payam Tavakoli | System and method for controlling water heater output temperature |
| CN112951694B (zh) * | 2019-11-26 | 2024-05-10 | 中微半导体设备(上海)股份有限公司 | 等离子体处理装置及其半导体晶圆的处理方法 |
| CN112859498B (zh) | 2019-11-28 | 2022-07-12 | 中强光电股份有限公司 | 照明装置、投影系统及其操作方法 |
| KR20210126387A (ko) * | 2020-04-10 | 2021-10-20 | 주성엔지니어링(주) | 기판 처리 장치 및 방법 |
| US12278094B2 (en) * | 2020-05-08 | 2025-04-15 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
| US12191169B2 (en) | 2020-07-19 | 2025-01-07 | Applied Materials, Inc. | Systems and methods for faceplate temperature control |
| WO2022040164A1 (en) * | 2020-08-18 | 2022-02-24 | Mattson Technology, Inc. | Rapid thermal processing system with cooling system |
| JP7528659B2 (ja) * | 2020-09-10 | 2024-08-06 | 東京エレクトロン株式会社 | 基板を加熱する装置及び方法 |
| US12326282B2 (en) * | 2023-01-05 | 2025-06-10 | Applied Materials, Inc. | Cooling flow in substrate processing according to predicted cooling parameters |
| WO2025230886A1 (en) * | 2024-05-01 | 2025-11-06 | Lam Research Corporation | Temperature control of substrate processing chamber plates using pwm to analog converters and proportional valves |
| US20250349575A1 (en) * | 2024-05-09 | 2025-11-13 | Applied Materials, Inc. | Semiconductor processing chamber thermal control |
| CN118655933B (zh) * | 2024-08-20 | 2024-11-05 | 中国计量大学 | 提高量热仪等温控制收敛速度的方法、系统、设备及介质 |
| CN118963456B (zh) * | 2024-10-17 | 2025-01-24 | 青岛四方思锐智能技术有限公司 | 一种反应腔室温度的控制系统、方法及电子设备 |
| CN120523262B (zh) * | 2025-07-28 | 2025-10-31 | 上海芯源微企业发展有限公司 | 机台加热系统的控温方法、装置、可读介质及电子设备 |
Family Cites Families (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0796170B2 (ja) * | 1990-01-12 | 1995-10-18 | 日産車体株式会社 | ロボットセット治具 |
| JP3147392B2 (ja) | 1991-03-04 | 2001-03-19 | 宇部サイコン株式会社 | 熱可塑性樹脂組成物 |
| JPH0796170A (ja) * | 1993-09-09 | 1995-04-11 | Tokyo Electron Ltd | 熱処理装置の温度制御方法 |
| US5435145A (en) | 1994-03-03 | 1995-07-25 | General Electric Company | Refrigerant flow rate control based on liquid level in simple vapor compression refrigeration cycles |
| US5548470A (en) | 1994-07-19 | 1996-08-20 | International Business Machines Corporation | Characterization, modeling, and design of an electrostatic chuck with improved wafer temperature uniformity |
| US5644467A (en) | 1995-09-28 | 1997-07-01 | Applied Materials, Inc. | Method and structure for improving gas breakdown resistance and reducing the potential of arcing in a electrostatic chuck |
| US5711851A (en) | 1996-07-12 | 1998-01-27 | Micron Technology, Inc. | Process for improving the performance of a temperature-sensitive etch process |
| US6095426A (en) * | 1997-11-07 | 2000-08-01 | Siemens Building Technologies | Room temperature control apparatus having feedforward and feedback control and method |
| KR100254793B1 (ko) * | 1997-12-08 | 2000-05-01 | 윤종용 | 반도체장치 제조설비의 케미컬 분사장치 및 그 장치에 사용되는폐액조 |
| US6018932A (en) | 1998-01-07 | 2000-02-01 | Premark Feg L.L.C. | Gas exchange apparatus |
| US5997649A (en) * | 1998-04-09 | 1999-12-07 | Tokyo Electron Limited | Stacked showerhead assembly for delivering gases and RF power to a reaction chamber |
| US6125025A (en) | 1998-09-30 | 2000-09-26 | Lam Research Corporation | Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors |
| US6368975B1 (en) | 1999-07-07 | 2002-04-09 | Applied Materials, Inc. | Method and apparatus for monitoring a process by employing principal component analysis |
| US6776801B2 (en) | 1999-12-16 | 2004-08-17 | Sail Star Inc. | Dry cleaning method and apparatus |
| AU3084101A (en) * | 2000-01-05 | 2001-07-16 | Tokyo Electron Limited | A method of wafer band-edge measurement using transmission spectroscopy and a process for controlling the temperature uniformity of a wafer |
| JP2001237226A (ja) | 2000-02-23 | 2001-08-31 | Kobe Steel Ltd | プラズマ処理装置 |
| US6635117B1 (en) | 2000-04-26 | 2003-10-21 | Axcelis Technologies, Inc. | Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system |
| US6606234B1 (en) | 2000-09-05 | 2003-08-12 | Saint-Gobain Ceramics & Plastics, Inc. | Electrostatic chuck and method for forming an electrostatic chuck having porous regions for fluid flow |
| US7069984B2 (en) * | 2001-02-08 | 2006-07-04 | Oriol Inc. | Multi-channel temperature control system for semiconductor processing facilities |
| US20020139477A1 (en) * | 2001-03-30 | 2002-10-03 | Lam Research Corporation | Plasma processing method and apparatus with control of plasma excitation power |
| JP3708031B2 (ja) * | 2001-06-29 | 2005-10-19 | 株式会社日立製作所 | プラズマ処理装置および処理方法 |
| US6651761B1 (en) * | 2001-09-27 | 2003-11-25 | Ford Global Technologies, Llc | Temperature control system for fuel cell electric vehicle cooling circuit |
| US6921724B2 (en) * | 2002-04-02 | 2005-07-26 | Lam Research Corporation | Variable temperature processes for tunable electrostatic chuck |
| KR101044366B1 (ko) * | 2002-06-12 | 2011-06-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판을 처리하기 위한 플라즈마 방법 및 장치 |
| JP2004063670A (ja) * | 2002-07-26 | 2004-02-26 | Dainippon Screen Mfg Co Ltd | 制御装置および制御方法並びに熱処理装置および熱処理方法 |
| CN1745282B (zh) * | 2002-12-09 | 2010-04-21 | 哈德逊技术公司 | 用于优化致冷系统的方法和设备 |
| US7221553B2 (en) * | 2003-04-22 | 2007-05-22 | Applied Materials, Inc. | Substrate support having heat transfer system |
| JP2005026552A (ja) * | 2003-07-04 | 2005-01-27 | Matsushita Electric Ind Co Ltd | プラズマ処理方法 |
| DE10336599B4 (de) * | 2003-08-08 | 2016-08-04 | Daimler Ag | Verfahren zur Ansteuerung eines Thermostaten in einem Kühlkreislauf eines Verbrennungsmotors |
| JP2005079415A (ja) | 2003-09-02 | 2005-03-24 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| CN100570805C (zh) * | 2003-09-22 | 2009-12-16 | Mks仪器股份有限公司 | 避免射频等离子加工中的不稳定性的方法和装置 |
| JP2005123308A (ja) * | 2003-10-15 | 2005-05-12 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP2005210080A (ja) * | 2003-12-25 | 2005-08-04 | Tokyo Electron Ltd | 温度調節方法及び温度調節装置 |
| US7200996B2 (en) * | 2004-05-06 | 2007-04-10 | United Technologies Corporation | Startup and control methods for an ORC bottoming plant |
| JP4522783B2 (ja) | 2004-08-03 | 2010-08-11 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置及びプラズマ処理方法 |
| US7544251B2 (en) | 2004-10-07 | 2009-06-09 | Applied Materials, Inc. | Method and apparatus for controlling temperature of a substrate |
| TWI314842B (en) | 2005-01-28 | 2009-09-11 | Advanced Display Proc Eng Co | Plasma processing apparatus |
| JP2006339253A (ja) | 2005-05-31 | 2006-12-14 | Toshiba Corp | プラズマ処理装置及びプラズマ処理方法 |
| JP2006351887A (ja) | 2005-06-17 | 2006-12-28 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| GB0516695D0 (en) * | 2005-08-15 | 2005-09-21 | Boc Group Plc | Microwave plasma reactor |
| JP4878801B2 (ja) * | 2005-09-26 | 2012-02-15 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法 |
| US20070091541A1 (en) | 2005-10-20 | 2007-04-26 | Applied Materials, Inc. | Method of processing a workpiece in a plasma reactor using feed forward thermal control |
| US8226769B2 (en) | 2006-04-27 | 2012-07-24 | Applied Materials, Inc. | Substrate support with electrostatic chuck having dual temperature zones |
| JP4779807B2 (ja) | 2006-05-29 | 2011-09-28 | 株式会社島津製作所 | Icp発光分光分析装置 |
| US20080060978A1 (en) | 2006-06-14 | 2008-03-13 | Paul Wegner | Handling and extracting hydrocarbons from tar sands |
| CN101495822A (zh) * | 2006-07-10 | 2009-07-29 | 埃地沃兹真空系统有限公司 | 控制温度的方法 |
| JP4815298B2 (ja) | 2006-07-31 | 2011-11-16 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法 |
| US20080035306A1 (en) | 2006-08-08 | 2008-02-14 | White John M | Heating and cooling of substrate support |
| US20080148706A1 (en) * | 2006-12-22 | 2008-06-26 | Mark Beauregard | Method of maintaining aircraft gas turbine engine |
| JP4838197B2 (ja) | 2007-06-05 | 2011-12-14 | 東京エレクトロン株式会社 | プラズマ処理装置,電極温度調整装置,電極温度調整方法 |
| US20090065181A1 (en) | 2007-09-07 | 2009-03-12 | Spx Cooling Technologies, Inc. | System and method for heat exchanger fluid handling with atmospheric tower |
| WO2009076576A2 (en) | 2007-12-12 | 2009-06-18 | Eco2 Plastics | Continuous system for processing particles |
| JP4486135B2 (ja) * | 2008-01-22 | 2010-06-23 | 東京エレクトロン株式会社 | 温度制御機構およびそれを用いた処理装置 |
| JP5551343B2 (ja) | 2008-05-14 | 2014-07-16 | 東京エレクトロン株式会社 | 誘導結合プラズマ処理装置 |
| US8596336B2 (en) | 2008-06-03 | 2013-12-03 | Applied Materials, Inc. | Substrate support temperature control |
| JP5433171B2 (ja) * | 2008-06-16 | 2014-03-05 | 株式会社日立ハイテクノロジーズ | 試料温度の制御方法 |
| KR20110075009A (ko) | 2008-10-06 | 2011-07-05 | 서노베이션즈 인코포레이션 | 과열방지 적응형 태양열 급탕장치 |
| JP5374109B2 (ja) * | 2008-10-17 | 2013-12-25 | 株式会社アルバック | 加熱真空処理方法 |
| US20100116788A1 (en) | 2008-11-12 | 2010-05-13 | Lam Research Corporation | Substrate temperature control by using liquid controlled multizone substrate support |
| JP5655010B2 (ja) | 2009-02-11 | 2015-01-14 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 非接触基板処理のための方法及び装置 |
| US8404572B2 (en) | 2009-02-13 | 2013-03-26 | Taiwan Semiconductor Manufacturing Co., Ltd | Multi-zone temperature control for semiconductor wafer |
| US8916793B2 (en) | 2010-06-08 | 2014-12-23 | Applied Materials, Inc. | Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow |
| US9338871B2 (en) | 2010-01-29 | 2016-05-10 | Applied Materials, Inc. | Feedforward temperature control for plasma processing apparatus |
| US8880227B2 (en) | 2010-05-27 | 2014-11-04 | Applied Materials, Inc. | Component temperature control by coolant flow control and heater duty cycle control |
| US8608852B2 (en) | 2010-06-11 | 2013-12-17 | Applied Materials, Inc. | Temperature controlled plasma processing chamber component with zone dependent thermal efficiencies |
-
2011
- 2011-03-03 US US13/040,149 patent/US8880227B2/en active Active
- 2011-05-20 JP JP2013512105A patent/JP2013536539A/ja active Pending
- 2011-05-20 CN CN201611218907.0A patent/CN106842966B/zh active Active
- 2011-05-20 CN CN201180025294.8A patent/CN102907181B/zh not_active Expired - Fee Related
- 2011-05-20 WO PCT/US2011/037436 patent/WO2011149790A2/en not_active Ceased
- 2011-05-20 KR KR1020127032509A patent/KR101476727B1/ko active Active
- 2011-05-24 TW TW104106858A patent/TWI564930B/zh active
- 2011-05-24 TW TW100118159A patent/TWI480918B/zh not_active IP Right Cessation
- 2011-05-24 TW TW105137549A patent/TWI615883B/zh not_active IP Right Cessation
-
2014
- 2014-09-25 US US14/497,253 patent/US9639097B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013536539A5 (enExample) | ||
| CN102907181B (zh) | 通过冷却剂流量控制及加热器占空比控制的组件温度控制 | |
| JP2013534695A5 (enExample) | ||
| US20140202679A1 (en) | Hot water supply apparatus and control method thereof | |
| JP5964244B2 (ja) | プラズマ処理装置のフィードフォワード温度制御方法および当該方法を実行させる命令をストアしたコンピュータ可読媒体、温度コントローラおよび当該コントローラを有するプラズマ処理装置 | |
| WO2011156239A3 (en) | Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow | |
| CN201196747Y (zh) | 电热水器恒温控制装置 | |
| JP2012506128A5 (enExample) | ||
| US20080231304A1 (en) | Apparatus and method for controlling temperature in a chuck system | |
| SG195553A1 (en) | Methods and apparatus for rapidly responsive heat control in plasma processing devices | |
| TW201637077A (zh) | 熱處理裝置及熱處理方法 | |
| WO2013062870A1 (en) | Component temperature control using a combination of proportional control valves and pulsed valves | |
| JP4862064B2 (ja) | 電子制御装置 | |
| CN104076844B (zh) | 一种电机冷却控制系统的控制方法 | |
| JP6129760B2 (ja) | 温調装置 | |
| JP2008282413A (ja) | 流体温度制御装置及び方法 | |
| Tang et al. | Constrained off-line synthesis approach of model predictive control for networked control systems with network-induced delays | |
| WO2021186976A1 (ja) | 温度制御システム | |
| KR100809490B1 (ko) | 미세 유량 제어가 가능한 밸브 시스템 및 그의 미세 유량제어방법 | |
| CN110502049B (zh) | 卡盘温度控制方法、卡盘温度控制系统及半导体设备 | |
| KR101609308B1 (ko) | 솔레노이드 밸브 제어 장치 및 제어 방법 | |
| JP2003343270A (ja) | 水温調節装置 | |
| JP2016217641A (ja) | 湯水混合装置 | |
| JPH0331914A (ja) | 温度調節方法 | |
| JPH0510588A (ja) | 給湯器の出湯温度制御方法 |