CN106842966B - 一种温度控制器 - Google Patents

一种温度控制器 Download PDF

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Publication number
CN106842966B
CN106842966B CN201611218907.0A CN201611218907A CN106842966B CN 106842966 B CN106842966 B CN 106842966B CN 201611218907 A CN201611218907 A CN 201611218907A CN 106842966 B CN106842966 B CN 106842966B
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temperature
plasma
control
power
input
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Chinese (zh)
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CN106842966A (zh
Inventor
科坦·马哈德斯瓦拉萨瓦米
卡尔蒂克·拉马斯瓦米
布赖恩·廖
塞吉奥·秀吉
达·D·源
汉密第·诺巴卡施
大卫·帕拉加斯维勒
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Applied Materials Inc
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Applied Materials Inc
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B15/00—Systems controlled by a computer
    • G05B15/02—Systems controlled by a computer electric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32908—Utilities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
CN201611218907.0A 2010-05-27 2011-05-20 一种温度控制器 Active CN106842966B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US34907310P 2010-05-27 2010-05-27
US61/349,073 2010-05-27
US13/040,149 2011-03-03
US13/040,149 US8880227B2 (en) 2010-05-27 2011-03-03 Component temperature control by coolant flow control and heater duty cycle control
CN201180025294.8A CN102907181B (zh) 2010-05-27 2011-05-20 通过冷却剂流量控制及加热器占空比控制的组件温度控制

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201180025294.8A Division CN102907181B (zh) 2010-05-27 2011-05-20 通过冷却剂流量控制及加热器占空比控制的组件温度控制

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Publication Number Publication Date
CN106842966A CN106842966A (zh) 2017-06-13
CN106842966B true CN106842966B (zh) 2020-07-03

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CN201611218907.0A Active CN106842966B (zh) 2010-05-27 2011-05-20 一种温度控制器
CN201180025294.8A Expired - Fee Related CN102907181B (zh) 2010-05-27 2011-05-20 通过冷却剂流量控制及加热器占空比控制的组件温度控制

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Country Status (6)

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US (2) US8880227B2 (enExample)
JP (1) JP2013536539A (enExample)
KR (1) KR101476727B1 (enExample)
CN (2) CN106842966B (enExample)
TW (3) TWI564930B (enExample)
WO (1) WO2011149790A2 (enExample)

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TWI480918B (zh) 2015-04-11
TWI615883B (zh) 2018-02-21
CN106842966A (zh) 2017-06-13
KR20130020802A (ko) 2013-02-28
JP2013536539A (ja) 2013-09-19
TW201528330A (zh) 2015-07-16
TW201205637A (en) 2012-02-01
TW201709256A (zh) 2017-03-01
US9639097B2 (en) 2017-05-02
US20120048467A1 (en) 2012-03-01
KR101476727B1 (ko) 2014-12-26
US8880227B2 (en) 2014-11-04
WO2011149790A3 (en) 2012-01-26
CN102907181A (zh) 2013-01-30
CN102907181B (zh) 2017-02-15
US20150134128A1 (en) 2015-05-14
WO2011149790A2 (en) 2011-12-01
TWI564930B (zh) 2017-01-01

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