JP2013530308A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013530308A5 JP2013530308A5 JP2013509562A JP2013509562A JP2013530308A5 JP 2013530308 A5 JP2013530308 A5 JP 2013530308A5 JP 2013509562 A JP2013509562 A JP 2013509562A JP 2013509562 A JP2013509562 A JP 2013509562A JP 2013530308 A5 JP2013530308 A5 JP 2013530308A5
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- target
- housing
- bearing
- respect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000005240 physical vapour deposition Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10162560.6A EP2387063B1 (en) | 2010-05-11 | 2010-05-11 | Chamber for physical vapor deposition |
| EP10162560.6 | 2010-05-11 | ||
| PCT/EP2011/057626 WO2011141513A1 (en) | 2010-05-11 | 2011-05-11 | Chamber for physical vapor deposition |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016005561A Division JP6275755B2 (ja) | 2010-05-11 | 2016-01-14 | 物理的気相堆積用のチャンバ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013530308A JP2013530308A (ja) | 2013-07-25 |
| JP2013530308A5 true JP2013530308A5 (OSRAM) | 2014-06-26 |
Family
ID=42320179
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013509562A Ceased JP2013530308A (ja) | 2010-05-11 | 2011-05-11 | 物理的気相堆積用のチャンバ |
| JP2016005561A Expired - Fee Related JP6275755B2 (ja) | 2010-05-11 | 2016-01-14 | 物理的気相堆積用のチャンバ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016005561A Expired - Fee Related JP6275755B2 (ja) | 2010-05-11 | 2016-01-14 | 物理的気相堆積用のチャンバ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8758579B2 (OSRAM) |
| EP (2) | EP2709138B1 (OSRAM) |
| JP (2) | JP2013530308A (OSRAM) |
| KR (1) | KR101667195B1 (OSRAM) |
| CN (1) | CN102918622B (OSRAM) |
| TW (1) | TWI537411B (OSRAM) |
| WO (1) | WO2011141513A1 (OSRAM) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016012038A1 (en) * | 2014-07-22 | 2016-01-28 | Applied Materials, Inc. | Target arrangement, processing apparatus therewith and manufacturing method thereof |
| TWI700750B (zh) * | 2017-01-24 | 2020-08-01 | 美商應用材料股份有限公司 | 用於介電薄膜的選擇性沉積之方法及設備 |
| EA202190605A1 (ru) | 2018-09-03 | 2021-06-09 | Агк Гласс Юроп | Комплект для монтажа камеры для обработки поверхности |
| NL2023642B1 (en) | 2019-08-14 | 2021-02-24 | Leydenjar Tech B V | Silicon composition material for use as battery anode |
| WO2022058014A1 (en) * | 2020-09-17 | 2022-03-24 | Applied Materials, Inc. | Cathode assembly, deposition apparatus and method for sputter deposition |
| CN118401696A (zh) * | 2021-12-16 | 2024-07-26 | 应用材料公司 | 用于溅射沉积的阴极组件、沉积设备和方法 |
| NL2030360B1 (en) * | 2021-12-30 | 2023-07-06 | Leydenjar Tech B V | Plasma-enhanced Chemical Vapour Deposition Apparatus |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5924758U (ja) * | 1982-08-04 | 1984-02-16 | 株式会社徳田製作所 | スパツタリング装置 |
| US4519885A (en) * | 1983-12-27 | 1985-05-28 | Shatterproof Glass Corp. | Method and apparatus for changing sputtering targets in a magnetron sputtering system |
| US5591314A (en) * | 1995-10-27 | 1997-01-07 | Morgan; Steven V. | Apparatus for affixing a rotating cylindrical magnetron target to a spindle |
| US5824197A (en) * | 1996-06-05 | 1998-10-20 | Applied Materials, Inc. | Shield for a physical vapor deposition chamber |
| US6254745B1 (en) * | 1999-02-19 | 2001-07-03 | Tokyo Electron Limited | Ionized physical vapor deposition method and apparatus with magnetic bucket and concentric plasma and material source |
| JP4614037B2 (ja) * | 2000-09-08 | 2011-01-19 | Ａｇｃセラミックス株式会社 | 円筒状ターゲット |
| US20050051422A1 (en) * | 2003-02-21 | 2005-03-10 | Rietzel James G. | Cylindrical magnetron with self cleaning target |
| US7097744B2 (en) * | 2003-06-12 | 2006-08-29 | Applied Materials, Inc. | Method and apparatus for controlling darkspace gap in a chamber |
| US20050005846A1 (en) * | 2003-06-23 | 2005-01-13 | Venkat Selvamanickam | High throughput continuous pulsed laser deposition process and apparatus |
| JP2005213585A (ja) * | 2004-01-29 | 2005-08-11 | Konica Minolta Opto Inc | マグネトロンスパッタ装置 |
| DE602005006008T2 (de) * | 2004-10-18 | 2009-06-18 | Bekaert Advanced Coatings | Endblock für eine sputter-vorrichtung mit drehbarem target |
| DE602005012850D1 (de) * | 2004-10-18 | 2009-04-02 | Bekaert Advanced Coatings | Flacher endblock als träger eines drehbaren sputter-targets |
| DE102004060423B4 (de) * | 2004-12-14 | 2016-10-27 | Heraeus Deutschland GmbH & Co. KG | Rohrtarget und dessen Verwendung |
| EP1698715A1 (de) * | 2005-03-03 | 2006-09-06 | Applied Films GmbH & Co. KG | Anlage zum Beschichten eines Substrats und Einschubelement |
| CN1827545B (zh) * | 2005-03-03 | 2012-11-07 | 应用材料两合股份有限公司 | 涂敷基底的系统及插入元件 |
| SI1856303T1 (sl) * | 2005-03-11 | 2009-06-30 | Bekaert Advanced Coatings | Enojni, pravokotni končni blok |
| US20070134500A1 (en) * | 2005-12-14 | 2007-06-14 | Klaus Hartig | Sputtering targets and methods for depositing film containing tin and niobium |
| EP2276870A4 (en) * | 2008-04-14 | 2012-07-25 | Angstrom Sciences Inc | CYLINDRICAL MAGNETRON |
| US20100101949A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation |
-
2010
- 2010-05-11 EP EP13196091.6A patent/EP2709138B1/en not_active Not-in-force
- 2010-05-11 EP EP10162560.6A patent/EP2387063B1/en not_active Not-in-force
- 2010-05-17 US US12/781,723 patent/US8758579B2/en not_active Expired - Fee Related
-
2011
- 2011-04-20 TW TW100113714A patent/TWI537411B/zh not_active IP Right Cessation
- 2011-05-11 WO PCT/EP2011/057626 patent/WO2011141513A1/en not_active Ceased
- 2011-05-11 KR KR1020127032144A patent/KR101667195B1/ko not_active Expired - Fee Related
- 2011-05-11 CN CN201180026737.5A patent/CN102918622B/zh not_active Expired - Fee Related
- 2011-05-11 JP JP2013509562A patent/JP2013530308A/ja not_active Ceased
-
2016
- 2016-01-14 JP JP2016005561A patent/JP6275755B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013530308A5 (OSRAM) | ||
| JP2012115757A5 (OSRAM) | ||
| USD611047S1 (en) | Electronic device | |
| JP2015519477A5 (OSRAM) | ||
| WO2012096466A3 (ko) | 박막 증착 장치 및 이를 포함한 기판 처리 시스템 | |
| WO2007053317A3 (en) | Protective offset sputtering | |
| JP2014082130A5 (OSRAM) | ||
| WO2010114823A3 (en) | Sputtering target for pvd chamber | |
| WO2012025369A3 (de) | Kältegerät mit einem ausziehbaren kühlgutbehälter | |
| USD653667S1 (en) | Server unit with door | |
| JP2007520634A5 (OSRAM) | ||
| JP2014525516A5 (OSRAM) | ||
| WO2017126846A3 (ko) | 냉장고 | |
| US8758579B2 (en) | Chamber for physical vapour deposition and door for a physical vapour deposition chamber | |
| PH12012000363B1 (en) | Glass substrate for magnetic recording medium, and magnetic recording medium using glass substrate for magnetic recording medium | |
| WO2012025366A3 (de) | Kältegerät mit einem ausziehbaren kühlgutbehälter | |
| USD614181S1 (en) | Electronic device | |
| WO2012025385A3 (de) | Kältegerät mit einem ausziehbaren kühlgutbehälter | |
| WO2013023173A3 (en) | Sputtering systems for liquid target materials | |
| WO2007058476A3 (en) | Antimicrobial coating based on kimchi lactic acid bacteria | |
| WO2009129115A3 (en) | Cylindrical magnetron | |
| WO2012175732A3 (en) | A cooling device comprising an easily mountable handle | |
| WO2010063555A3 (de) | Kältegerät mit drehteller | |
| CN206858649U (zh) | 靶材布置和处理设备 | |
| KR101778602B1 (ko) | 플라즈마 증착 장치용 전극 본체 구동수단 |