JP2013530308A5 - - Google Patents

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Publication number
JP2013530308A5
JP2013530308A5 JP2013509562A JP2013509562A JP2013530308A5 JP 2013530308 A5 JP2013530308 A5 JP 2013530308A5 JP 2013509562 A JP2013509562 A JP 2013509562A JP 2013509562 A JP2013509562 A JP 2013509562A JP 2013530308 A5 JP2013530308 A5 JP 2013530308A5
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JP
Japan
Prior art keywords
chamber
target
housing
bearing
respect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2013509562A
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English (en)
Japanese (ja)
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JP2013530308A (ja
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Publication date
Priority claimed from EP10162560.6A external-priority patent/EP2387063B1/en
Application filed filed Critical
Publication of JP2013530308A publication Critical patent/JP2013530308A/ja
Publication of JP2013530308A5 publication Critical patent/JP2013530308A5/ja
Ceased legal-status Critical Current

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JP2013509562A 2010-05-11 2011-05-11 物理的気相堆積用のチャンバ Ceased JP2013530308A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10162560.6A EP2387063B1 (en) 2010-05-11 2010-05-11 Chamber for physical vapor deposition
EP10162560.6 2010-05-11
PCT/EP2011/057626 WO2011141513A1 (en) 2010-05-11 2011-05-11 Chamber for physical vapor deposition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016005561A Division JP6275755B2 (ja) 2010-05-11 2016-01-14 物理的気相堆積用のチャンバ

Publications (2)

Publication Number Publication Date
JP2013530308A JP2013530308A (ja) 2013-07-25
JP2013530308A5 true JP2013530308A5 (OSRAM) 2014-06-26

Family

ID=42320179

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013509562A Ceased JP2013530308A (ja) 2010-05-11 2011-05-11 物理的気相堆積用のチャンバ
JP2016005561A Expired - Fee Related JP6275755B2 (ja) 2010-05-11 2016-01-14 物理的気相堆積用のチャンバ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016005561A Expired - Fee Related JP6275755B2 (ja) 2010-05-11 2016-01-14 物理的気相堆積用のチャンバ

Country Status (7)

Country Link
US (1) US8758579B2 (OSRAM)
EP (2) EP2387063B1 (OSRAM)
JP (2) JP2013530308A (OSRAM)
KR (1) KR101667195B1 (OSRAM)
CN (1) CN102918622B (OSRAM)
TW (1) TWI537411B (OSRAM)
WO (1) WO2011141513A1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101913791B1 (ko) * 2014-07-22 2018-11-01 어플라이드 머티어리얼스, 인코포레이티드 타겟 어레인지먼트, 그를 구비한 프로세싱 장치 및 그의 제조 방법
TWI700750B (zh) * 2017-01-24 2020-08-01 美商應用材料股份有限公司 用於介電薄膜的選擇性沉積之方法及設備
EA202190605A1 (ru) 2018-09-03 2021-06-09 Агк Гласс Юроп Комплект для монтажа камеры для обработки поверхности
NL2023642B1 (en) 2019-08-14 2021-02-24 Leydenjar Tech B V Silicon composition material for use as battery anode
WO2022058014A1 (en) * 2020-09-17 2022-03-24 Applied Materials, Inc. Cathode assembly, deposition apparatus and method for sputter deposition
CN118401696A (zh) * 2021-12-16 2024-07-26 应用材料公司 用于溅射沉积的阴极组件、沉积设备和方法
NL2030360B1 (en) * 2021-12-30 2023-07-06 Leydenjar Tech B V Plasma-enhanced Chemical Vapour Deposition Apparatus

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5924758U (ja) * 1982-08-04 1984-02-16 株式会社徳田製作所 スパツタリング装置
US4519885A (en) * 1983-12-27 1985-05-28 Shatterproof Glass Corp. Method and apparatus for changing sputtering targets in a magnetron sputtering system
US5591314A (en) * 1995-10-27 1997-01-07 Morgan; Steven V. Apparatus for affixing a rotating cylindrical magnetron target to a spindle
US5824197A (en) * 1996-06-05 1998-10-20 Applied Materials, Inc. Shield for a physical vapor deposition chamber
US6254745B1 (en) * 1999-02-19 2001-07-03 Tokyo Electron Limited Ionized physical vapor deposition method and apparatus with magnetic bucket and concentric plasma and material source
JP4614037B2 (ja) * 2000-09-08 2011-01-19 Agcセラミックス株式会社 円筒状ターゲット
US20050051422A1 (en) * 2003-02-21 2005-03-10 Rietzel James G. Cylindrical magnetron with self cleaning target
US7097744B2 (en) * 2003-06-12 2006-08-29 Applied Materials, Inc. Method and apparatus for controlling darkspace gap in a chamber
US20050005846A1 (en) * 2003-06-23 2005-01-13 Venkat Selvamanickam High throughput continuous pulsed laser deposition process and apparatus
JP2005213585A (ja) * 2004-01-29 2005-08-11 Konica Minolta Opto Inc マグネトロンスパッタ装置
KR101358820B1 (ko) * 2004-10-18 2014-02-10 솔레라스 어드밴스드 코팅스 비브이비에이 회전가능한 스퍼터링 타겟을 지지하기 위한 평탄한엔드-블록
CN100564580C (zh) * 2004-10-18 2009-12-02 贝卡尔特先进涂层公司 一种用于承载可转动的溅射靶材的扁平端块
DE102004060423B4 (de) * 2004-12-14 2016-10-27 Heraeus Deutschland GmbH & Co. KG Rohrtarget und dessen Verwendung
CN1827545B (zh) * 2005-03-03 2012-11-07 应用材料两合股份有限公司 涂敷基底的系统及插入元件
EP1698715A1 (de) * 2005-03-03 2006-09-06 Applied Films GmbH & Co. KG Anlage zum Beschichten eines Substrats und Einschubelement
CN101137764B (zh) * 2005-03-11 2010-12-01 贝卡尔特先进涂层公司 单一的直角端块
US20070134500A1 (en) * 2005-12-14 2007-06-14 Klaus Hartig Sputtering targets and methods for depositing film containing tin and niobium
WO2009129115A2 (en) * 2008-04-14 2009-10-22 Angstrom Sciences, Inc. Cylindrical magnetron
US20100101949A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation

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