JP2013527325A5 - - Google Patents

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Publication number
JP2013527325A5
JP2013527325A5 JP2013513029A JP2013513029A JP2013527325A5 JP 2013527325 A5 JP2013527325 A5 JP 2013527325A5 JP 2013513029 A JP2013513029 A JP 2013513029A JP 2013513029 A JP2013513029 A JP 2013513029A JP 2013527325 A5 JP2013527325 A5 JP 2013527325A5
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composition according
micrometer
substrate
compound
additive
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JP2013513029A
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English (en)
Japanese (ja)
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JP5933532B2 (ja
JP2013527325A (ja
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Priority claimed from PCT/IB2011/052385 external-priority patent/WO2011151785A1/en
Publication of JP2013527325A publication Critical patent/JP2013527325A/ja
Publication of JP2013527325A5 publication Critical patent/JP2013527325A5/ja
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JP2013513029A 2010-06-01 2011-05-31 レベリング剤を含有する金属電解めっき用組成物 Active JP5933532B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35004510P 2010-06-01 2010-06-01
US61/350,045 2010-06-01
PCT/IB2011/052385 WO2011151785A1 (en) 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent

Publications (3)

Publication Number Publication Date
JP2013527325A JP2013527325A (ja) 2013-06-27
JP2013527325A5 true JP2013527325A5 (OSRAM) 2015-09-17
JP5933532B2 JP5933532B2 (ja) 2016-06-15

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JP2013513029A Active JP5933532B2 (ja) 2010-06-01 2011-05-31 レベリング剤を含有する金属電解めっき用組成物

Country Status (11)

Country Link
US (1) US9683302B2 (OSRAM)
EP (1) EP2576696B1 (OSRAM)
JP (1) JP5933532B2 (OSRAM)
KR (3) KR101829866B1 (OSRAM)
CN (1) CN102939339B (OSRAM)
IL (1) IL223183B (OSRAM)
MY (1) MY164464A (OSRAM)
RU (1) RU2603675C2 (OSRAM)
SG (2) SG185736A1 (OSRAM)
TW (1) TWI539036B (OSRAM)
WO (1) WO2011151785A1 (OSRAM)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2013133648A (ru) 2010-12-21 2015-01-27 Басф Се Композиция для электролитического осаждения металлов, содержащая выравнивающий агент
US9243339B2 (en) * 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
US10196751B2 (en) 2013-11-06 2019-02-05 Rohm And Haas Electronic Materials Llc Nitrogen containing polymers as levelers
WO2016020214A1 (en) * 2014-08-06 2016-02-11 Basf Se Process for preparing polymeric, ionic imidazolium compounds of high molecular weight
EP3177671A1 (en) * 2014-08-06 2017-06-14 Basf Se Improved process for preparing polymeric, ionic imidazolium compounds
JP2018517793A (ja) 2015-04-28 2018-07-05 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 電気めっき浴用の添加剤としてのビス無水物及びジアミンの反応生成物
US9932684B2 (en) 2015-08-06 2018-04-03 Rohm And Haas Electronic Materials Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
US10100421B2 (en) * 2015-08-06 2018-10-16 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
US10006136B2 (en) * 2015-08-06 2018-06-26 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
TWI608132B (zh) 2015-08-06 2017-12-11 羅門哈斯電子材料有限公司 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法
US20170067173A1 (en) * 2015-09-09 2017-03-09 Rohm And Haas Electronic Materials Llc Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits
AU2016355706B2 (en) * 2015-11-20 2020-02-06 Hexion Inc. Chemical products for surface protection
US10100420B2 (en) 2015-12-29 2018-10-16 Hong Kong Applied Science and Technology Research Institute Company Limtied Plating leveler for electrodeposition of copper pillar
US10519557B2 (en) * 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
US10190228B2 (en) * 2016-03-29 2019-01-29 Rohm And Haas Electronic Materials Llc Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
WO2018057590A1 (en) * 2016-09-22 2018-03-29 Macdermid Enthone Inc. Copper deposition in wafer level packaging of integrated circuits
WO2018073011A1 (en) 2016-10-20 2018-04-26 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
EP3559317B1 (en) * 2016-12-20 2025-02-12 Basf Se Composition for metal plating comprising suppressing agent for void free filling
US11535946B2 (en) 2017-06-01 2022-12-27 Basf Se Composition for tin or tin alloy electroplating comprising leveling agent
KR102641595B1 (ko) 2017-09-04 2024-02-27 바스프 에스이 평탄화 제제를 포함하는 금속 전기 도금용 조성물
EP3511444B1 (en) * 2018-01-16 2020-07-22 ATOTECH Deutschland GmbH Metal or metal alloy deposition composition and plating compound
KR102483615B1 (ko) * 2018-01-24 2023-01-03 삼성전기주식회사 비스-아릴 암모늄 화합물을 포함하는 도금용 평탄제 및 이를 이용한 구리 도금 방법
WO2019201623A2 (en) * 2018-04-19 2019-10-24 Basf Se Composition for cobalt or cobalt alloy electroplating
KR102662397B1 (ko) * 2018-10-23 2024-05-02 솔브레인 주식회사 전기도금 조성물 및 전기도금 방법
CN114450438A (zh) 2019-09-27 2022-05-06 巴斯夫欧洲公司 用于铜凸块电沉积的包含流平剂的组合物
CN114514339A (zh) 2019-09-27 2022-05-17 巴斯夫欧洲公司 用于铜凸块电沉积的包含流平剂的组合物
CN110938847B (zh) * 2019-10-30 2021-11-12 苏州清飙科技有限公司 电镀铜整平剂及其制备方法、以及电镀液
EP4127025B1 (en) 2020-04-03 2025-10-01 Basf Se Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent
EP3922662A1 (en) 2020-06-10 2021-12-15 Basf Se Polyalkanolamine
KR20230037553A (ko) 2020-07-13 2023-03-16 바스프 에스이 코발트 시드 상의 구리 전기도금을 위한 조성물
KR102339868B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물
US20250129503A1 (en) 2021-10-01 2025-04-24 Basf Se Composition for copper electrodeposition comprising a polyaminoamide type leveling agent
EP4551742A1 (en) 2022-07-07 2025-05-14 Basf Se Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition
CN120457244A (zh) 2022-12-19 2025-08-08 巴斯夫欧洲公司 用于铜纳米孪晶电沉积的组合物
WO2025026863A1 (en) 2023-08-03 2025-02-06 Basf Se Composition for copper electroplating on a metal seed

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3108006A (en) * 1959-07-13 1963-10-22 M & T Chemicals Inc Plating on aluminum
JPS55122892A (en) * 1979-03-16 1980-09-20 Furukawa Electric Co Ltd:The Plating bath for tin, tin-lead alloy
US5077414A (en) * 1990-03-29 1991-12-31 E. I. Du Pont De Nemours And Company Preparation of 1,3-disubstituted imidazolium salts
JPH04202305A (ja) * 1990-11-29 1992-07-23 Sanyo Chem Ind Ltd ４級塩変性スチレン系樹脂
JPH0754188A (ja) * 1993-08-06 1995-02-28 Nippon Steel Corp アルミ−クロム合金めっき鋼板の製造法
US5607570A (en) * 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution
JP3655388B2 (ja) * 1996-04-08 2005-06-02 ディップソール株式会社 錫めっき及び錫−鉛合金めっき用非酸性浴、及び該めっき浴を用いためっき方法
US6024857A (en) 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
FR2773991B1 (fr) 1998-01-26 2000-05-26 Oreal Utilisation a titre d'agent protecteur des fibres keratiniques de polymeres de polyammonium quaternaire heterocyclique et compositions cosmetiques
JP2001073182A (ja) 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US20050006245A1 (en) * 2003-07-08 2005-01-13 Applied Materials, Inc. Multiple-step electrodeposition process for direct copper plating on barrier metals
WO2001096632A2 (en) * 2000-06-15 2001-12-20 Applied Materials, Inc. A method and apparatus for conditioning electrochemical baths in plating technology
US6610192B1 (en) 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
US7316772B2 (en) 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US20030201191A1 (en) * 2002-04-29 2003-10-30 Applied Materials, Inc. Electrochemical method for direct organic additives analysis in copper baths
JP2004217565A (ja) 2003-01-15 2004-08-05 Shikoku Chem Corp 殺菌剤及び活性汚泥のバルキングならびにスカム解消方法
US7128822B2 (en) 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
DE10333239A1 (de) * 2003-07-21 2005-03-10 Basf Ag Verfahren zur Herstellung von gereinigten 1,3- substituierten Imidazoliumsalzen
TW200613586A (en) 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
JP4973829B2 (ja) * 2004-07-23 2012-07-11 上村工業株式会社 電気銅めっき浴及び電気銅めっき方法
US7771579B2 (en) 2004-12-03 2010-08-10 Taiwan Semiconductor Manufacturing Co. Electro chemical plating additives for improving stress and leveling effect
US7662981B2 (en) 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
KR101223386B1 (ko) * 2006-09-25 2013-01-16 에스케이종합화학 주식회사 이미다졸린계 부식억제제 조성물
RU2334831C2 (ru) * 2006-10-31 2008-09-27 Федеральное государственное унитарное предприятие "Калужский научно-исследовательский институт телемеханических устройств" Электролит меднения
JP2008195990A (ja) * 2007-02-09 2008-08-28 Dipsol Chem Co Ltd 電気アルミニウムめっき浴及びそれを用いためっき方法
PL2229367T3 (pl) * 2007-12-12 2015-08-31 Basf Se Sposób wytwarzania dipodstawionych soli imidazoliowych
EP2093278A1 (de) * 2008-02-05 2009-08-26 Evonik Goldschmidt GmbH Performance-Additive zur Verbesserung der Benetzungseigenschaften von ionischen Flüssigkeiten auf festen Oberflächen
EP2199315B1 (en) 2008-12-19 2013-12-11 Basf Se Composition for metal electroplating comprising leveling agent
KR101701526B1 (ko) 2008-12-22 2017-02-01 바스프 에스이 중합체 이온성 이미다졸륨 화합물의 제조 방법

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