JP2013526009A - 処理ツールにおける粒子数減少のための空気流管理 - Google Patents
処理ツールにおける粒子数減少のための空気流管理 Download PDFInfo
- Publication number
- JP2013526009A JP2013526009A JP2013501433A JP2013501433A JP2013526009A JP 2013526009 A JP2013526009 A JP 2013526009A JP 2013501433 A JP2013501433 A JP 2013501433A JP 2013501433 A JP2013501433 A JP 2013501433A JP 2013526009 A JP2013526009 A JP 2013526009A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wafer
- transfer section
- processing area
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/42—Auxiliary equipment or operation thereof
- B01D46/44—Auxiliary equipment or operation thereof controlling filtration
- B01D46/446—Auxiliary equipment or operation thereof controlling filtration by pressure measuring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0396—Involving pressure control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/85978—With pump
- Y10T137/85986—Pumped fluid control
- Y10T137/86002—Fluid pressure responsive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/86292—System with plural openings, one a gas vent or access opening
- Y10T137/863—Access and outlet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/87169—Supply and exhaust
Abstract
【選択図】図6
Description
Claims (15)
- 基板生産ツールの空気流管理システムであって、
前記基板生産ツールをファンフィルタユニットにつなぐためのハウジングであって、前記ファンフィルタユニットは、前記ハウジングにろ過空気を提供する、ハウジングと、
前記基板生産ツールを減圧排気メカニズムにつなぐための設備結合部と、
前記ハウジングの下方につながれ、前記設備結合部との間で空気流を連通させる基板移送セクションと、
1つ又は2つ以上の基板移送スロットによって前記基板移送セクションにつながれた基板処理エリアと、
前記基板移送セクション及び前記基板処理エリアを実質的に内包したチャンバであって、前記ろ過空気を受け取るために前記ハウジングにつながれるとともに、超過気流の排出を提供するために前記設備結合部につながれ、前記基板処理エリア内を前記基板移送セクションと比べて低い圧力に維持するように構成されたチャンバと、
を備えるシステム。 - 請求項1に記載のシステムであって、
前記1つ又は2つ以上の基板移送スロットは、前記基板移送セクションと比べて低い前記基板処理エリア内の圧力を可能にするように配置される、システム。 - 請求項1に記載のシステムであって、
前記チャンバは、更に、前記基板移送セクション内を前記設備結合部と比べて高い圧力に維持するように構成される、システム。 - 請求項1に記載のシステムであって、
前記チャンバは、更に、前記基板処理エリア内を前記設備結合部と比べて高い圧力に維持するように構成される、システム。 - 請求項1に記載のシステムであって、
前記チャンバは、更に、複数の基板を基板収納から受け取って前記チャンバに入れる及び前記チャンバから取り出すための基板ポートを含み、前記基板ポートは、前記基板収納と比べて低い圧力に維持される、システム。 - 請求項1に記載のシステムであって、
前記基板処理エリアは、化学処理セクションを含む、システム。 - 請求項6に記載のシステムであって、
前記基板処理エリア内を前記基板移送セクションと比べて低い圧力に維持するように構成された前記チャンバは、前記化学処理セクション内の化学物質の蒸気を前記基板移送セクションに達しないように実質的に閉じ込める、システム。 - 請求項1に記載のシステムであって、更に、
前記基板移送セクション内に実質的に内包された線形基板横移動メカニズムを備え、前記線形基板横移動メカニズムは、その上に複数の線形基板キャリアを搭載されており、前記複数の線形基板キャリアの各々は、互いに異なる面内にある状態で、互いに実質的に平行な面内で基板を搬送するように構成される、システム。 - ウエハ処理ツールの空気流管理システムであって、
前記ウエハ処理ツールにろ過空気を提供するためのファンフィルタユニットと、
前記ウエハ処理ツールをウエハ製造設備の減圧排気メカニズムにつなぐための設備結合部と、
前記ファンフィルタユニットの下方につながれ、前記設備結合部との間で空気流を連通させるウエハ移送セクションと、
化学処理セクションを有し、1つ又は2つ以上のウエハ搬送スロットによって前記ウエハ移送セクションにつながれたウエハ処理エリアと、
前記ウエハ移送セクション及び前記ウエハ処理エリアを実質的に内包した処理チャンバであって、前記ろ過空気を受け取るために前記ファンフィルタユニットにつながれるとともに、超過気流の排出を提供するために前記設備結合部につながれ、前記ウエハ処理エリア内を前記ウエハ移送セクションと比べて低い圧力に維持するように構成される処理チャンバと、
を備えるシステム。 - 請求項9に記載のシステムであって、
前記ウエハ処理エリア内を前記ウエハ移送セクションと比べて低い圧力に維持するように構成された前記チャンバは、前記化学処理セクション内の化学物質の蒸気を前記ウエハ移送セクションに達しないように実質的に閉じ込める、システム。 - 請求項9に記載のシステムであって、
前記1つ又は2つ以上のウエハ搬送スロットは、前記ウエハ移送セクションと比べて低い前記ウエハ処理エリア内の圧力を可能にするように配置される、システム。 - 請求項9に記載のシステムであって、更に、
前記ウエハ移送セクション内に実質的に内包された線形ウエハ横移動メカニズムを備え、前記線形ウエハ横移動メカニズムは、その上に複数の線形ウエハキャリアを搭載されており、前記複数の線形ウエハキャリアの各々は、互いに異なる面内にある状態で、互いに実質的に平行な面内でウエハを搬送するように構成される、システム。 - 基板生産ツールにおける空気流管理システムを提供する方法であって、
前記基板生産ツールにろ過空気を提供するファンフィルタユニットに前記基板生産ツールをつなぐための第1のメカニズムを提供することと、
前記基板生産ツール内の超過気流の排出を提供する減圧排気メカニズムに前記基板生産ツールをつなぐための第2のメカニズムを提供することと、
前記基板生産ツールの基板処理エリアを前記基板生産ツールの基板移送セクションの圧力よりも低い圧力に維持することと、
前記基板処理エリアを前記減圧排気メカニズムの圧力よりも高い圧力に維持することと、
前記基板移送セクションを前記減圧排気メカニズムの圧力よりも高い圧力に維持することと、
を備える方法。 - 請求項13に記載の方法であって、更に、
前記基板移送セクションと比べて低い前記基板処理エリア内の圧力を可能にするために、前記基板処理エリアと前記基板移送セクションとの間に1つ又は2つ以上の基板移送スロットを提供することを備える方法。 - 請求項13に記載の方法であって、更に、
前記基板移送セクションと前記基板処理エリアとの間における粒子の移送を低減させるために、前記基板移送セクション及び前記基板処理エリアを互いに実質的に水平に位置するように配置することを備える方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/730,868 US8893642B2 (en) | 2010-03-24 | 2010-03-24 | Airflow management for low particulate count in a process tool |
US12/730,868 | 2010-03-24 | ||
PCT/US2011/029623 WO2011119729A2 (en) | 2010-03-24 | 2011-03-23 | Airflow management for low particulate count in a process tool |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013526009A true JP2013526009A (ja) | 2013-06-20 |
JP5734409B2 JP5734409B2 (ja) | 2015-06-17 |
Family
ID=44654981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013501433A Active JP5734409B2 (ja) | 2010-03-24 | 2011-03-23 | 処理ツールにおける粒子数減少のための空気流管理システム及び空気流管理システムを提供する方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8893642B2 (ja) |
JP (1) | JP5734409B2 (ja) |
KR (1) | KR20130010903A (ja) |
CN (1) | CN102906855B (ja) |
SG (1) | SG184199A1 (ja) |
TW (1) | TWI509724B (ja) |
WO (1) | WO2011119729A2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9117870B2 (en) * | 2008-03-27 | 2015-08-25 | Lam Research Corporation | High throughput cleaner chamber |
WO2010093752A1 (en) * | 2009-02-11 | 2010-08-19 | Dow Agrosciences Llc | Pesticidal compositions |
US8562272B2 (en) * | 2010-02-16 | 2013-10-22 | Lam Research Corporation | Substrate load and unload mechanisms for high throughput |
US8282698B2 (en) | 2010-03-24 | 2012-10-09 | Lam Research Corporation | Reduction of particle contamination produced by moving mechanisms in a process tool |
US8893642B2 (en) | 2010-03-24 | 2014-11-25 | Lam Research Corporation | Airflow management for low particulate count in a process tool |
US9958424B2 (en) | 2012-10-01 | 2018-05-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of identifying airborne molecular contamination source |
CN112892093B (zh) * | 2021-01-25 | 2022-05-10 | 广东钜宏科技股份有限公司 | 一种风量均匀的ffu装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005131772A (ja) * | 2003-10-31 | 2005-05-26 | Ebara Corp | ポリッシング装置 |
Family Cites Families (81)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH067542B2 (ja) | 1984-11-22 | 1994-01-26 | 株式会社日立製作所 | 製造装置 |
US5096364A (en) | 1986-04-28 | 1992-03-17 | Varian Associates, Inc. | Wafer arm handler mechanism |
FR2620049B2 (fr) | 1986-11-28 | 1989-11-24 | Commissariat Energie Atomique | Procede de traitement, stockage et/ou transfert d'un objet dans une atmosphere de haute proprete, et conteneur pour la mise en oeuvre de ce procede |
JPH0237742A (ja) | 1988-07-28 | 1990-02-07 | Nec Corp | 半導体装置の製造装置 |
JP2706665B2 (ja) | 1990-01-18 | 1998-01-28 | 東京エレクトロン株式会社 | 基板移載装置及び処理装置 |
US5843233A (en) | 1990-07-16 | 1998-12-01 | Novellus Systems, Inc. | Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus |
US5133284A (en) | 1990-07-16 | 1992-07-28 | National Semiconductor Corp. | Gas-based backside protection during substrate processing |
JPH0531472A (ja) * | 1990-11-17 | 1993-02-09 | Tokyo Electron Ltd | 洗浄装置 |
EP0496006A1 (en) | 1991-01-19 | 1992-07-29 | International Business Machines Corporation | Wafer transfer apparatus |
JPH04290454A (ja) | 1991-03-19 | 1992-10-15 | Fujitsu Ltd | 基板処理装置および基板搬送方法 |
JP3309416B2 (ja) | 1992-02-13 | 2002-07-29 | 松下電器産業株式会社 | 連結式クリーン空間装置 |
US5229615A (en) | 1992-03-05 | 1993-07-20 | Eaton Corporation | End station for a parallel beam ion implanter |
US5295777A (en) | 1992-12-23 | 1994-03-22 | Materials Research Corporation | Wafer transport module with rotatable and horizontally extendable wafer holder |
KR0179405B1 (ko) | 1993-04-12 | 1999-04-15 | 마스다 쇼오이치로오 | 크린장치가 부착된 하물보관설비 |
DE4340522A1 (de) | 1993-11-29 | 1995-06-01 | Leybold Ag | Vorrichtung und Verfahren zum schrittweisen und automatischen Be- und Entladen einer Beschichtungsanlage |
US5979475A (en) | 1994-04-28 | 1999-11-09 | Hitachi, Ltd. | Specimen holding method and fluid treatment method of specimen surface and systems therefor |
US5765444A (en) | 1995-07-10 | 1998-06-16 | Kensington Laboratories, Inc. | Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities |
US6102164A (en) * | 1996-02-28 | 2000-08-15 | Applied Materials, Inc. | Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers |
WO1997035690A1 (fr) | 1996-03-22 | 1997-10-02 | Komatsu Ltd. | Robot de manutention |
JP3218425B2 (ja) | 1996-03-25 | 2001-10-15 | 東京エレクトロン株式会社 | 処理方法及び処理装置 |
US6082950A (en) | 1996-11-18 | 2000-07-04 | Applied Materials, Inc. | Front end wafer staging with wafer cassette turntables and on-the-fly wafer center finding |
JP3437734B2 (ja) * | 1997-02-26 | 2003-08-18 | 富士通株式会社 | 製造装置 |
US5951770A (en) | 1997-06-04 | 1999-09-14 | Applied Materials, Inc. | Carousel wafer transfer system |
KR20010023014A (ko) | 1997-08-28 | 2001-03-26 | 씨브이씨 프로덕츠 인코포레이티드 | 다중스테이션 장비용 웨이퍼 핸들러 |
US6155768A (en) | 1998-01-30 | 2000-12-05 | Kensington Laboratories, Inc. | Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput |
US6050891A (en) | 1998-02-06 | 2000-04-18 | Applied Materials, Inc. | Vacuum processing system with turbo-axial fan in clean-air supply system of front end environment |
JP4404481B2 (ja) | 1998-02-18 | 2010-01-27 | アプライド マテリアルズ インコーポレイテッド | 真空処理システム、ウェーハハンドラーおよびエンドエフェクタ |
JP2000021947A (ja) | 1998-06-30 | 2000-01-21 | Sony Corp | 乾式処理装置 |
US6158951A (en) | 1998-07-10 | 2000-12-12 | Asm America, Inc. | Wafer carrier and method for handling of wafers with minimal contact |
JP3212951B2 (ja) | 1998-10-22 | 2001-09-25 | 兼房株式会社 | 分割切削型チップソー |
US6328872B1 (en) | 1999-04-03 | 2001-12-11 | Nutool, Inc. | Method and apparatus for plating and polishing a semiconductor substrate |
JP2000174091A (ja) * | 1998-12-01 | 2000-06-23 | Fujitsu Ltd | 搬送装置及び製造装置 |
ATE389237T1 (de) | 1998-12-02 | 2008-03-15 | Newport Corp | Armgreiforgan für probehalteroboter |
US6485250B2 (en) | 1998-12-30 | 2002-11-26 | Brooks Automation Inc. | Substrate transport apparatus with multiple arms on a common axis of rotation |
US6368183B1 (en) | 1999-02-03 | 2002-04-09 | Speedfam-Ipec Corporation | Wafer cleaning apparatus and associated wafer processing methods |
US6882416B1 (en) | 1999-09-07 | 2005-04-19 | Applied Materials, Inc. | Methods for continuous embedded process monitoring and optical inspection of substrates using specular signature analysis |
US6558509B2 (en) | 1999-11-30 | 2003-05-06 | Applied Materials, Inc. | Dual wafer load lock |
US6429139B1 (en) * | 1999-12-17 | 2002-08-06 | Eaton Corporation | Serial wafer handling mechanism |
NL1015397C2 (nl) | 2000-06-07 | 2001-12-10 | Asm Int | Inrichting voor het behandelen van een wafer. |
US20020061248A1 (en) * | 2000-07-07 | 2002-05-23 | Applied Materials, Inc. | High productivity semiconductor wafer processing system |
US20020075478A1 (en) | 2000-12-18 | 2002-06-20 | Applied Materials, Inc. | Inspection device having wafer exchange stage |
KR100433067B1 (ko) | 2001-01-22 | 2004-05-27 | 주식회사 라셈텍 | 반도체 제조장치 |
JP4683453B2 (ja) | 2001-04-27 | 2011-05-18 | 芝浦メカトロニクス株式会社 | 真空処理装置 |
US6663333B2 (en) * | 2001-07-13 | 2003-12-16 | Axcelis Technologies, Inc. | Wafer transport apparatus |
JP4821074B2 (ja) | 2001-08-31 | 2011-11-24 | 東京エレクトロン株式会社 | 処理システム |
US6666928B2 (en) | 2001-09-13 | 2003-12-23 | Micell Technologies, Inc. | Methods and apparatus for holding a substrate in a pressure chamber |
JP2003229466A (ja) | 2002-02-04 | 2003-08-15 | Seiko Instruments Inc | 真空処理装置 |
US20030202865A1 (en) | 2002-04-25 | 2003-10-30 | Applied Materials, Inc. | Substrate transfer apparatus |
TWI282139B (en) | 2002-07-01 | 2007-06-01 | Advanced Display Kabushiki Kai | Carrying vehicle, manufacturing apparatus, and carrying system |
JP2004193418A (ja) | 2002-12-12 | 2004-07-08 | Seiko Epson Corp | 半導体装置の製造方法 |
JP2004200329A (ja) | 2002-12-17 | 2004-07-15 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
KR100483428B1 (ko) | 2003-01-24 | 2005-04-14 | 삼성전자주식회사 | 기판 가공 장치 |
JP4468021B2 (ja) | 2003-03-25 | 2010-05-26 | キヤノン株式会社 | ロードロックシステム及び露光処理システム並びにデバイスの製造方法 |
JP4290454B2 (ja) | 2003-03-28 | 2009-07-08 | 三井化学株式会社 | ガス拡散電極の製造方法、電解槽及び電解方法 |
JP3680083B2 (ja) | 2003-09-26 | 2005-08-10 | バンドー化学株式会社 | 伝動ベルト用プーリ及びベルト伝動装置 |
US7934513B2 (en) | 2003-10-08 | 2011-05-03 | Semes Co., Ltd. | Facility with multi-storied process chamber for cleaning substrates and method for cleaning substrates using the facility |
US20080003171A1 (en) | 2004-04-20 | 2008-01-03 | Smith William L | Microbial Control Using Hypochlorous Acid Vapor |
WO2005121027A2 (en) | 2004-06-04 | 2005-12-22 | Durr Ecoclean, Inc. | An integrated machining module for processing workpieces and a method of assembling the same |
JP2006028577A (ja) | 2004-07-15 | 2006-02-02 | Canon Anelva Corp | Cvd装置 |
KR20060066415A (ko) * | 2004-12-13 | 2006-06-16 | 삼성전자주식회사 | 기판 이송 장치 |
KR100782380B1 (ko) | 2005-01-24 | 2007-12-07 | 삼성전자주식회사 | 반도체 제조장치 |
KR101279819B1 (ko) | 2005-04-12 | 2013-06-28 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 | 방사-편향 연마 패드 |
CN100362620C (zh) | 2005-08-11 | 2008-01-16 | 中微半导体设备(上海)有限公司 | 半导体工艺件装卸装置及其装载和卸载方法 |
US20070218197A1 (en) | 2006-03-15 | 2007-09-20 | Yoichi Kurono | Vacuum processing system and method of making |
KR100814238B1 (ko) | 2006-05-03 | 2008-03-17 | 위순임 | 기판 반송 장치 및 이를 이용한 기판 처리 시스템 |
TWI476855B (zh) | 2006-05-03 | 2015-03-11 | Gen Co Ltd | 基板傳輸設備、和使用該設備的高速基板處理系統 |
KR100818044B1 (ko) | 2006-05-04 | 2008-03-31 | 위순임 | 기판 지지대와 기판 반송 장치 및 이를 이용한 기판 처리시스템 |
US7833351B2 (en) | 2006-06-26 | 2010-11-16 | Applied Materials, Inc. | Batch processing platform for ALD and CVD |
US8113757B2 (en) | 2006-08-01 | 2012-02-14 | Tokyo Electron Limited | Intermediate transfer chamber, substrate processing system, and exhaust method for the intermediate transfer chamber |
KR100803559B1 (ko) | 2007-05-02 | 2008-02-15 | 피에스케이 주식회사 | 기판 반송 유닛 및 방법, 그리고 상기 유닛을 가지는 기판처리 장치 및 상기 유닛을 이용한 기판 처리 방법 |
US20080175694A1 (en) * | 2007-01-19 | 2008-07-24 | Dong-Seok Park | Unit and method for transferring substrates and apparatus and method for treating substrates with the unit |
WO2008140728A2 (en) | 2007-05-08 | 2008-11-20 | Brooks Automation, Inc. | Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism |
US7644757B2 (en) | 2007-07-02 | 2010-01-12 | Stinger Wellhand Protection, Inc. | Fixed-point packoff element with primary seal test capability |
CN101801817B (zh) | 2007-07-17 | 2015-07-22 | 布鲁克斯自动化公司 | 具备集成到室壁上的电动机的基片加工装置 |
JP4359640B2 (ja) | 2007-09-25 | 2009-11-04 | 東京エレクトロン株式会社 | 基板搬送装置及びダウンフロー制御方法 |
JP4251580B1 (ja) * | 2008-01-08 | 2009-04-08 | Tdk株式会社 | 被収容物搬送システム |
US9117870B2 (en) | 2008-03-27 | 2015-08-25 | Lam Research Corporation | High throughput cleaner chamber |
WO2011022870A1 (zh) | 2009-08-24 | 2011-03-03 | Wang Lvsha | 为高强度气体放电灯配置的镇流控制装置及镇流装置 |
US8562272B2 (en) | 2010-02-16 | 2013-10-22 | Lam Research Corporation | Substrate load and unload mechanisms for high throughput |
US8282698B2 (en) * | 2010-03-24 | 2012-10-09 | Lam Research Corporation | Reduction of particle contamination produced by moving mechanisms in a process tool |
US8893642B2 (en) | 2010-03-24 | 2014-11-25 | Lam Research Corporation | Airflow management for low particulate count in a process tool |
-
2010
- 2010-03-24 US US12/730,868 patent/US8893642B2/en active Active
-
2011
- 2011-03-22 TW TW100109752A patent/TWI509724B/zh active
- 2011-03-23 WO PCT/US2011/029623 patent/WO2011119729A2/en active Application Filing
- 2011-03-23 SG SG2012070306A patent/SG184199A1/en unknown
- 2011-03-23 KR KR20127027648A patent/KR20130010903A/ko not_active Application Discontinuation
- 2011-03-23 JP JP2013501433A patent/JP5734409B2/ja active Active
- 2011-03-23 CN CN201180025217.2A patent/CN102906855B/zh active Active
-
2014
- 2014-10-27 US US14/524,518 patent/US9321000B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005131772A (ja) * | 2003-10-31 | 2005-05-26 | Ebara Corp | ポリッシング装置 |
Also Published As
Publication number | Publication date |
---|---|
US20150040757A1 (en) | 2015-02-12 |
JP5734409B2 (ja) | 2015-06-17 |
WO2011119729A2 (en) | 2011-09-29 |
TW201207981A (en) | 2012-02-16 |
US9321000B2 (en) | 2016-04-26 |
CN102906855B (zh) | 2015-09-02 |
SG184199A1 (en) | 2012-10-30 |
US20110232771A1 (en) | 2011-09-29 |
CN102906855A (zh) | 2013-01-30 |
WO2011119729A3 (en) | 2012-01-19 |
US8893642B2 (en) | 2014-11-25 |
TWI509724B (zh) | 2015-11-21 |
KR20130010903A (ko) | 2013-01-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6005624B2 (ja) | 基板に対する粒子汚染を削減するためのシステム | |
JP5734409B2 (ja) | 処理ツールにおける粒子数減少のための空気流管理システム及び空気流管理システムを提供する方法 | |
TWI670782B (zh) | 基板液處理裝置 | |
TW201626494A (zh) | 用以移動晶圓之設備前端模組及方法 | |
JP5673480B2 (ja) | 基板処理装置 | |
US10892172B2 (en) | Removal of process effluents | |
JP6061484B2 (ja) | 基板洗浄装置およびそれを備えた基板処理装置 | |
JP6001896B2 (ja) | 基板洗浄装置およびそれを備えた基板処理装置 | |
TW201631649A (zh) | 基板液處理裝置、排氣切換單元及基板液處理方法 | |
JP2020505783A (ja) | サブナノメートルレベルの光ベースの基板洗浄機構 | |
JP6786732B2 (ja) | サブナノメートルレベルの基板洗浄機構 | |
JP6135617B2 (ja) | 基板処理装置、クリーニング用治具、基板処理装置のパーティクルの除去方法及び記憶媒体 | |
JP2006005072A (ja) | 基板搬送保管容器及びその使用方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140320 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20141125 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141209 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150302 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150324 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150414 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5734409 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |