JP2013219327A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2013219327A JP2013219327A JP2013016789A JP2013016789A JP2013219327A JP 2013219327 A JP2013219327 A JP 2013219327A JP 2013016789 A JP2013016789 A JP 2013016789A JP 2013016789 A JP2013016789 A JP 2013016789A JP 2013219327 A JP2013219327 A JP 2013219327A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
Abstract
【解決手段】電子の有効質量に比べて正孔の有効質量が重い酸化物半導体材料を用いる。基板上にゲート電極層と、ゲート絶縁層と、有効質量が電子に比べて少なくとも5倍以上、好ましくは10倍以上、さらに好ましくは20倍以上の重い正孔を持つ酸化物半導体層と、酸化物半導体層と接するソース電極層と、酸化物半導体層と接するドレイン電極層とを有するトランジスタとする。
【選択図】図1
Description
半導体装置および半導体装置の作製方法について、図1(A)を用いて説明する。図1(A)は、トランジスタ140の断面図の一例である。
本実施の形態では、半導体装置の一例として、記憶媒体(メモリ素子)を示す。本実施の形態では、実施の形態1において示す酸化物半導体を用いたトランジスタと、酸化物半導体以外の材料を用いたトランジスタとを同一基板上に形成する。
本実施の形態では、半導体装置の一例として、上記実施の形態1に開示したトランジスタを少なくとも一部に用いたCPU(Central Processing Unit)について説明する。
本明細書に開示する半導体装置は、さまざまな電子機器(遊技機も含む)に適用することができる。電子機器としては、テレビ、モニタ等の表示装置、照明装置、デスクトップ型或いはノート型のパーソナルコンピュータ、ワードプロセッサ、DVD(Digital Versatile Disc)などの記録媒体に記憶された静止画又は動画を再生する画像再生装置、ポータブルCDプレーヤ、ラジオ、テープレコーダ、ヘッドホンステレオ、ステレオ、コードレス電話子機、トランシーバ、携帯無線機、携帯電話、自動車電話、携帯型ゲーム機、電卓、携帯情報端末、電子手帳、電子書籍、電子翻訳機、音声入力機器、ビデオカメラ、デジタルスチルカメラ、電気シェーバ、電子レンジ等の高周波加熱装置、電気炊飯器、電気洗濯機、電気掃除機、エアコンディショナーなどの空調設備、食器洗い器、食器乾燥器、衣類乾燥器、布団乾燥器、電気冷蔵庫、電気冷凍庫、電気冷凍冷蔵庫、DNA保存用冷凍庫、煙感知器、放射線測定器、透析装置等の医療機器、などが挙げられる。さらに、誘導灯、信号機、ベルトコンベア、エレベータ、エスカレータ、産業用ロボット、電力貯蔵システム等の産業機器も挙げられる。また、石油を用いたエンジンや、非水系二次電池からの電力を用いて電動機により推進する移動体なども、電気機器の範疇に含まれるものとする。上記移動体として、例えば、電気自動車(EV)、内燃機関と電動機を併せ持ったハイブリッド車(HEV)、プラグインハイブリッド車(PHEV)、これらのタイヤ車輪を無限軌道に変えた装軌車両、電動アシスト自転車を含む原動機付自転車、自動二輪車、電動車椅子、ゴルフ用カート、小型又は大型船舶、潜水艦、ヘリコプター、航空機、ロケット、人工衛星、宇宙探査機や惑星探査機、宇宙船が挙げられる。これらの電子機器の具体例を図10に示す。
102 絶縁膜
104a ソース電極
104b ドレイン電極
108 酸化物半導体膜
110 ゲート絶縁膜
112 ゲート電極
112a ゲート電極
112b 電極
114 絶縁膜
140 トランジスタ
151 絶縁膜
152 絶縁膜
154 電極
156 配線
164 容量素子
200 基板
206 素子分離絶縁膜
208 ゲート絶縁膜
210 ゲート電極
216 チャネル形成領域
220 不純物領域
224 金属間化合物領域
228 絶縁膜
230 絶縁膜
240 トランジスタ
601 伝導帯端
602 価電子帯端
1141 スイッチング素子
1142 メモリセル
1143 メモリセル群
1189 ROMインターフェース
1190 基板
1191 ALU
1192 ALUコントローラ
1193 インストラクションデコーダ
1194 インタラプトコントローラ
1195 タイミングコントローラ
1196 レジスタ
1197 レジスタコントローラ
1198 バスインターフェース
1199 ROM
8000 テレビジョン装置
8001 筐体
8002 表示部
8003 スピーカ部
8200 室内機
8201 筐体
8202 送風口
8203 CPU
8204 室外機
8300 電気冷凍冷蔵庫
8301 筐体
8302 冷蔵室用扉
8303 冷凍室用扉
8304 CPU
9000 テーブル
9001 筐体
9002 脚部
9003 表示部
9004 表示ボタン
9005 電源コード
9033 具
9034 スイッチ
9035 電源スイッチ
9036 スイッチ
9038 操作スイッチ
9201 本体
9202 筐体
9203 表示部
9204 キーボード
9205 外部接続ポート
9206 ポインティングデバイス
9630 筐体
9631 表示部
9631a 表示部
9631b 表示部
9632a 領域
9632b 領域
9633 太陽電池
9634 充放電制御回路
9635 バッテリー
9636 DCDCコンバータ
9637 コンバータ
9638 操作キー
9639 ボタン
9700 電気自動車
9701 二次電池
9702 制御回路
9703 駆動装置
9704 処理装置
Claims (10)
- ゲート電極層と、ゲート絶縁層と、
有効質量が電子に比べて少なくとも5倍以上の重い正孔を持つ酸化物半導体層と、
前記酸化物半導体層と接するソース電極層と、
前記酸化物半導体層と接するドレイン電極層とを有するトランジスタを備え、
前記トランジスタのオフ電流密度は、チャネル幅1μmあたり、100zA/μm以下である半導体装置。 - 請求項1において、前記トランジスタのチャネル長は5nm以上500nm以下であることを特徴とする半導体装置。
- 請求項1または請求項2において、前記酸化物半導体層のバンドギャップは、2eV以上4eV以下である半導体装置。
- 請求項1乃至3のいずれか一において、前記トランジスタのチャネル形成領域におけるキャリア密度は、10−10/cm3以上1017/cm3未満とすることを特徴とする半導体装置。
- 請求項1乃至4のいずれか一において、前記トランジスタのチャネル形成領域は、c軸配向している結晶を含むことを特徴とする半導体装置。
- 請求項1乃至5のいずれか一において、前記酸化物半導体層は、少なくともインジウムを含み、ガリウム、錫、チタン、ジルコニウム、ハフニウム、亜鉛、ゲルマニウムから選ばれる一または複数含むことを特徴とする半導体装置。
- 請求項1乃至5のいずれか一において、前記酸化物半導体層は、インジウム、ガリウム、及び亜鉛を含むことを特徴とする半導体装置。
- 請求項1乃至7のいずれか一において、前記ソース電極層及び前記ドレイン電極層はタングステンを含むことを特徴とする半導体装置。
- 請求項1乃至8のいずれか一において、前記酸化物半導体層が持つ正孔の有効質量は、1以上重いことを特徴とする半導体装置。
- 請求項1乃至8のいずれか一において、前記酸化物半導体層が持つ正孔の有効質量は、10以上重いことを特徴とする半導体装置。
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