JP2013216975A5 - - Google Patents
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- Publication number
- JP2013216975A5 JP2013216975A5 JP2013067757A JP2013067757A JP2013216975A5 JP 2013216975 A5 JP2013216975 A5 JP 2013216975A5 JP 2013067757 A JP2013067757 A JP 2013067757A JP 2013067757 A JP2013067757 A JP 2013067757A JP 2013216975 A5 JP2013216975 A5 JP 2013216975A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- silver
- alkyl
- depositing
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 2
- -1 silver ions Chemical class 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/435,683 | 2012-03-30 | ||
| US13/435,683 US8980077B2 (en) | 2012-03-30 | 2012-03-30 | Plating bath and method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013216975A JP2013216975A (ja) | 2013-10-24 |
| JP2013216975A5 true JP2013216975A5 (enExample) | 2017-04-13 |
| JP6141664B2 JP6141664B2 (ja) | 2017-06-07 |
Family
ID=49154843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013067757A Active JP6141664B2 (ja) | 2012-03-30 | 2013-03-28 | めっき浴および方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8980077B2 (enExample) |
| JP (1) | JP6141664B2 (enExample) |
| KR (1) | KR102055598B1 (enExample) |
| CN (1) | CN103361683B (enExample) |
| DE (1) | DE102013005499B4 (enExample) |
| SG (1) | SG193763A1 (enExample) |
| TW (1) | TWI525223B (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10056636B1 (en) * | 2013-10-03 | 2018-08-21 | Primus Power Corporation | Electrolyte compositions for use in a metal-halogen flow battery |
| US8877630B1 (en) * | 2013-11-12 | 2014-11-04 | Chipmos Technologies Inc. | Semiconductor structure having a silver alloy bump body and manufacturing method thereof |
| US10889907B2 (en) * | 2014-02-21 | 2021-01-12 | Rohm And Haas Electronic Materials Llc | Cyanide-free acidic matte silver electroplating compositions and methods |
| US9368340B2 (en) | 2014-06-02 | 2016-06-14 | Lam Research Corporation | Metallization of the wafer edge for optimized electroplating performance on resistive substrates |
| US10154598B2 (en) * | 2014-10-13 | 2018-12-11 | Rohm And Haas Electronic Materials Llc | Filling through-holes |
| EP3271964A4 (en) * | 2015-03-19 | 2018-10-17 | Primus Power Corporation | Flow battery electrolyte compositions containing a chelating agent and a metal plating enhancer |
| US9850588B2 (en) * | 2015-09-09 | 2017-12-26 | Rohm And Haas Electronic Materials Llc | Bismuth electroplating baths and methods of electroplating bismuth on a substrate |
| JP6834070B2 (ja) * | 2016-06-13 | 2021-02-24 | 石原ケミカル株式会社 | 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いて電着物を形成した電子部品の製造方法 |
| US10428436B2 (en) * | 2016-07-18 | 2019-10-01 | Rohm And Haas Electronic Materials Llc | Indium electroplating compositions containing amine compounds and methods of electroplating indium |
| CN106098420B (zh) * | 2016-07-25 | 2018-05-25 | 桂林电子科技大学 | 一种电触头表面镀层添加材料及电触头制造方法 |
| CN115182004A (zh) | 2016-12-20 | 2022-10-14 | 巴斯夫欧洲公司 | 包含用于无空隙填充的抑制试剂的用于金属电镀的组合物 |
| US11535946B2 (en) | 2017-06-01 | 2022-12-27 | Basf Se | Composition for tin or tin alloy electroplating comprising leveling agent |
| US10329681B2 (en) * | 2017-11-02 | 2019-06-25 | National Chung Shan Institute Of Science And Technology | Copper-silver dual-component metal electroplating solution and electroplating method for semiconductor wire |
| EP3728702B1 (en) | 2017-12-20 | 2021-09-22 | Basf Se | Composition for tin or tin alloy electroplating comprising suppressing agent |
| EP3775325B1 (en) | 2018-03-29 | 2024-08-28 | Basf Se | Composition for tin-silver alloy electroplating comprising a complexing agent |
| KR102769982B1 (ko) | 2018-04-20 | 2025-02-18 | 바스프 에스이 | 억제제를 포함하는 주석 또는 주석 합금 전기도금을 위한 조성물 |
| JP6645609B2 (ja) * | 2018-07-27 | 2020-02-14 | 三菱マテリアル株式会社 | 錫合金めっき液 |
| CN109837572A (zh) * | 2019-04-03 | 2019-06-04 | 浙江亚通焊材有限公司 | 一种Sn-Bi系无铅低温焊料的电沉积方法 |
| JP7754806B2 (ja) | 2019-09-16 | 2025-10-15 | ビーエーエスエフ ソシエタス・ヨーロピア | 錯化剤を含む、スズ－銀合金電気めっきするための組成物 |
| US20210172082A1 (en) * | 2019-12-10 | 2021-06-10 | Rohm And Haas Electronic Materials Llc | Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods |
| JP7770766B2 (ja) * | 2020-02-25 | 2025-11-17 | Ｄｏｗａメタルテック株式会社 | 銀めっき材およびその製造方法 |
| US12297556B2 (en) | 2020-02-25 | 2025-05-13 | Dowa Metaltech Co., Ltd. | Silver-plated product and method for producing same |
| IL303728A (en) | 2020-12-18 | 2023-08-01 | Basf Se | The composition for electrolytic plating of tin or tin alloy that includes a leveling agent |
| US11578418B2 (en) | 2021-03-29 | 2023-02-14 | Rohm And Haas Electronic Materials Llc (Rhem) | Silver electroplating compositions and methods for electroplating silver with low coefficients of friction |
| JP7749358B2 (ja) * | 2021-06-29 | 2025-10-06 | Ｄｏｗａメタルテック株式会社 | 銀めっき材およびその製造方法 |
| WO2023088795A1 (en) | 2021-11-22 | 2023-05-25 | Basf Se | Composition for tin or tin alloy electroplating comprising a pyrazole-type antioxidant |
| KR20250040959A (ko) | 2022-07-26 | 2025-03-25 | 바스프 에스이 | 레벨링제를 포함하는 주석 또는 주석 합금 전기도금을 위한 조성물 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4246077A (en) | 1975-03-12 | 1981-01-20 | Technic, Inc. | Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds |
| US4871429A (en) | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US4582576A (en) | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
| US5256275A (en) | 1992-04-15 | 1993-10-26 | Learonal, Inc. | Electroplated gold-copper-silver alloys |
| JP3012182B2 (ja) | 1995-11-15 | 2000-02-21 | 荏原ユージライト株式会社 | 銀および銀合金めっき浴 |
| US6099713A (en) | 1996-11-25 | 2000-08-08 | C. Uyemura & Co., Ltd. | Tin-silver alloy electroplating bath and tin-silver alloy electroplating process |
| JP3301707B2 (ja) | 1997-01-20 | 2002-07-15 | ディップソール株式会社 | 錫−銀合金酸性電気めっき浴 |
| US5972875A (en) * | 1997-04-23 | 1999-10-26 | Crutcher; Terry | Low-foaming amine oxide surfactant concentrate and method of manufacture |
| JP4296358B2 (ja) * | 1998-01-21 | 2009-07-15 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
| US6210556B1 (en) | 1998-02-12 | 2001-04-03 | Learonal, Inc. | Electrolyte and tin-silver electroplating process |
| JP2000006657A (ja) * | 1998-06-18 | 2000-01-11 | Nissan Motor Co Ltd | 自動車のウインドガラス取付構造およびウインドガラス分離・回収方法 |
| JP3718790B2 (ja) | 1998-12-24 | 2005-11-24 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
| JP3433291B2 (ja) | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品 |
| US7628903B1 (en) * | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
| DE10026680C1 (de) | 2000-05-30 | 2002-02-21 | Schloetter Fa Dr Ing Max | Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten |
| US7122108B2 (en) | 2001-10-24 | 2006-10-17 | Shipley Company, L.L.C. | Tin-silver electrolyte |
| JP4142312B2 (ja) | 2002-02-28 | 2008-09-03 | ハリマ化成株式会社 | 析出型はんだ組成物及びはんだ析出方法 |
| JP4756886B2 (ja) | 2005-03-22 | 2011-08-24 | 石原薬品株式会社 | 非シアン系のスズ−銀合金メッキ浴 |
| SG127854A1 (en) | 2005-06-02 | 2006-12-29 | Rohm & Haas Elect Mat | Improved gold electrolytes |
| JP4162246B2 (ja) * | 2005-08-12 | 2008-10-08 | 石原薬品株式会社 | シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 |
| EP2221396A1 (en) * | 2008-12-31 | 2010-08-25 | Rohm and Haas Electronic Materials LLC | Lead-Free Tin Alloy Electroplating Compositions and Methods |
-
2012
- 2012-03-30 US US13/435,683 patent/US8980077B2/en active Active
-
2013
- 2013-03-28 JP JP2013067757A patent/JP6141664B2/ja active Active
- 2013-03-28 SG SG2013023551A patent/SG193763A1/en unknown
- 2013-03-28 DE DE102013005499.0A patent/DE102013005499B4/de active Active
- 2013-03-29 KR KR1020130034610A patent/KR102055598B1/ko active Active
- 2013-03-29 TW TW102111360A patent/TWI525223B/zh active
- 2013-04-01 CN CN201310192257.7A patent/CN103361683B/zh active Active
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