JP2013216975A5 - - Google Patents

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Publication number
JP2013216975A5
JP2013216975A5 JP2013067757A JP2013067757A JP2013216975A5 JP 2013216975 A5 JP2013216975 A5 JP 2013216975A5 JP 2013067757 A JP2013067757 A JP 2013067757A JP 2013067757 A JP2013067757 A JP 2013067757A JP 2013216975 A5 JP2013216975 A5 JP 2013216975A5
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JP
Japan
Prior art keywords
substrate
silver
alkyl
depositing
layer
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JP2013067757A
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English (en)
Japanese (ja)
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JP2013216975A (ja
JP6141664B2 (ja
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Priority claimed from US13/435,683 external-priority patent/US8980077B2/en
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Publication of JP2013216975A publication Critical patent/JP2013216975A/ja
Publication of JP2013216975A5 publication Critical patent/JP2013216975A5/ja
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Publication of JP6141664B2 publication Critical patent/JP6141664B2/ja
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JP2013067757A 2012-03-30 2013-03-28 めっき浴および方法 Active JP6141664B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/435,683 US8980077B2 (en) 2012-03-30 2012-03-30 Plating bath and method
US13/435,683 2012-03-30

Publications (3)

Publication Number Publication Date
JP2013216975A JP2013216975A (ja) 2013-10-24
JP2013216975A5 true JP2013216975A5 (enExample) 2017-04-13
JP6141664B2 JP6141664B2 (ja) 2017-06-07

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ID=49154843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013067757A Active JP6141664B2 (ja) 2012-03-30 2013-03-28 めっき浴および方法

Country Status (7)

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US (1) US8980077B2 (enExample)
JP (1) JP6141664B2 (enExample)
KR (1) KR102055598B1 (enExample)
CN (1) CN103361683B (enExample)
DE (1) DE102013005499B4 (enExample)
SG (1) SG193763A1 (enExample)
TW (1) TWI525223B (enExample)

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US8877630B1 (en) * 2013-11-12 2014-11-04 Chipmos Technologies Inc. Semiconductor structure having a silver alloy bump body and manufacturing method thereof
US10889907B2 (en) * 2014-02-21 2021-01-12 Rohm And Haas Electronic Materials Llc Cyanide-free acidic matte silver electroplating compositions and methods
US9368340B2 (en) * 2014-06-02 2016-06-14 Lam Research Corporation Metallization of the wafer edge for optimized electroplating performance on resistive substrates
US10154598B2 (en) * 2014-10-13 2018-12-11 Rohm And Haas Electronic Materials Llc Filling through-holes
WO2016149019A1 (en) * 2015-03-19 2016-09-22 Primus Power Corporation Flow battery electrolyte compositions containing a chelating agent and a metal plating enhancer
US9850588B2 (en) * 2015-09-09 2017-12-26 Rohm And Haas Electronic Materials Llc Bismuth electroplating baths and methods of electroplating bismuth on a substrate
JP6834070B2 (ja) * 2016-06-13 2021-02-24 石原ケミカル株式会社 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いて電着物を形成した電子部品の製造方法
US10428436B2 (en) * 2016-07-18 2019-10-01 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing amine compounds and methods of electroplating indium
CN106098420B (zh) * 2016-07-25 2018-05-25 桂林电子科技大学 一种电触头表面镀层添加材料及电触头制造方法
EP3559317B1 (en) 2016-12-20 2025-02-12 Basf Se Composition for metal plating comprising suppressing agent for void free filling
US11535946B2 (en) 2017-06-01 2022-12-27 Basf Se Composition for tin or tin alloy electroplating comprising leveling agent
US10329681B2 (en) * 2017-11-02 2019-06-25 National Chung Shan Institute Of Science And Technology Copper-silver dual-component metal electroplating solution and electroplating method for semiconductor wire
EP3728702B1 (en) 2017-12-20 2021-09-22 Basf Se Composition for tin or tin alloy electroplating comprising suppressing agent
US12054842B2 (en) 2018-03-29 2024-08-06 Basf Se Composition for tin-silver alloy electroplating comprising a complexing agent
SG11202009106XA (en) 2018-04-20 2020-11-27 Basf Se Composition for tin or tin alloy electroplating comprising suppressing agent
JP6645609B2 (ja) * 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
CN109837572A (zh) * 2019-04-03 2019-06-04 浙江亚通焊材有限公司 一种Sn-Bi系无铅低温焊料的电沉积方法
CN114402096A (zh) 2019-09-16 2022-04-26 巴斯夫欧洲公司 用于锡-银合金电镀的包含配位剂的组合物
US20210172082A1 (en) * 2019-12-10 2021-06-10 Rohm And Haas Electronic Materials Llc Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods
US12297556B2 (en) 2020-02-25 2025-05-13 Dowa Metaltech Co., Ltd. Silver-plated product and method for producing same
JP7770766B2 (ja) * 2020-02-25 2025-11-17 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
WO2022129238A1 (en) 2020-12-18 2022-06-23 Basf Se Composition for tin or tin alloy electroplating comprising leveling agent
US11578418B2 (en) 2021-03-29 2023-02-14 Rohm And Haas Electronic Materials Llc (Rhem) Silver electroplating compositions and methods for electroplating silver with low coefficients of friction
JP7749358B2 (ja) * 2021-06-29 2025-10-06 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
CN118284722A (zh) 2021-11-22 2024-07-02 巴斯夫欧洲公司 包含吡唑类抗氧化剂的用于锡或锡合金电镀的组合物
KR20250040959A (ko) 2022-07-26 2025-03-25 바스프 에스이 레벨링제를 포함하는 주석 또는 주석 합금 전기도금을 위한 조성물

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