JP2013216975A5 - - Google Patents

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JP2013216975A5
JP2013216975A5 JP2013067757A JP2013067757A JP2013216975A5 JP 2013216975 A5 JP2013216975 A5 JP 2013216975A5 JP 2013067757 A JP2013067757 A JP 2013067757A JP 2013067757 A JP2013067757 A JP 2013067757A JP 2013216975 A5 JP2013216975 A5 JP 2013216975A5
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Japan
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substrate
silver
alkyl
depositing
layer
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JP2013067757A
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JP2013216975A (ja
JP6141664B2 (ja
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Priority claimed from US13/435,683 external-priority patent/US8980077B2/en
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本発明によって、浴可溶性銀イオン源;水;酸電解質;および式
−(CR−S−(CR−S−(CR−Y
(式中、YおよびYは独立してCOH、SOH、PO、CONRおよびOHから選択され;各R、R、RおよびRは独立してH、(C−C)アルキル、COHおよびヒドロキシ置換(C−C)アルキルから選択され;各RおよびRは独立してHおよび(C−C)アルキルから選択され;m=1〜6;n=1〜6;RおよびRは独立してHおよび(C−C)アルキルから選択され;並びに、x=1〜6であり;ただし、Y=OHである場合にはm=3であり;ただし、Y=OHである場合にはn=3であり;ただし、R、R、RおよびRのいずれかがヒドロキシ置換(C−C)アルキルである場合には、このヒドロキシ基は硫黄原子に対して少なくともガンマである炭素原子に結合されている)のスルフィド化合物を含む電気めっき組成物を基体と接触させ:並びに一定期間にわたって電位を適用して、前記基体上にスズ−銀含有層を析出させることを含む、基体上に銀または銀合金層を析出させる方法も提供される。

Claims (1)

  1. 請求項1の組成物を基体と接触させ:
    一定期間にわたって電位を適用して、前記基体上に銀含有層を析出させる;
    ことを含む、スズ−銀層を析出させる方法。
JP2013067757A 2012-03-30 2013-03-28 めっき浴および方法 Active JP6141664B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/435,683 2012-03-30
US13/435,683 US8980077B2 (en) 2012-03-30 2012-03-30 Plating bath and method

Publications (3)

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JP2013216975A JP2013216975A (ja) 2013-10-24
JP2013216975A5 true JP2013216975A5 (ja) 2017-04-13
JP6141664B2 JP6141664B2 (ja) 2017-06-07

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JP2013067757A Active JP6141664B2 (ja) 2012-03-30 2013-03-28 めっき浴および方法

Country Status (7)

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US (1) US8980077B2 (ja)
JP (1) JP6141664B2 (ja)
KR (1) KR102055598B1 (ja)
CN (1) CN103361683B (ja)
DE (1) DE102013005499B4 (ja)
SG (1) SG193763A1 (ja)
TW (1) TWI525223B (ja)

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US9850588B2 (en) * 2015-09-09 2017-12-26 Rohm And Haas Electronic Materials Llc Bismuth electroplating baths and methods of electroplating bismuth on a substrate
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US10428436B2 (en) * 2016-07-18 2019-10-01 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing amine compounds and methods of electroplating indium
CN106098420B (zh) * 2016-07-25 2018-05-25 桂林电子科技大学 一种电触头表面镀层添加材料及电触头制造方法
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