JP2013207107A - 化合物半導体装置及びその製造方法 - Google Patents
化合物半導体装置及びその製造方法 Download PDFInfo
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Abstract
【解決手段】化合物半導体装置の一態様には、基板11と、基板11上方に形成された電子走行層13及び電子供給層15と、電子供給層15上方に形成されたゲート電極20g、ソース電極20s及びドレイン電極20dと、電子供給層15とゲート電極20gとの間に形成されたp型半導体層17と、電子供給層15とp型半導体層17との間に形成され、ドナ又は再結合中心を含み、正孔を打ち消す正孔打消層16と、が設けられている。
【選択図】図1
Description
先ず、第1の実施形態について説明する。図1は、第1の実施形態に係るGaN系HEMT(化合物半導体装置)を示す図である。図1(a)は断面図であり、図1(b)はバンド図である。
次に、第2の実施形態について説明する。図6は、第2の実施形態に係るGaN系HEMT(化合物半導体装置)を示す図である。図6(a)は断面図であり、図6(b)はバンド図である。
次に、第3の実施形態について説明する。図7(a)は、第3の実施形態に係るGaN系HEMT(化合物半導体装置)の構造を示す断面図である。
次に、第4の実施形態について説明する。図7(b)は、第4の実施形態に係るGaN系HEMT(化合物半導体装置)の構造を示す断面図である。
次に、第5の実施形態について説明する。図9(a)は、第5の実施形態に係るGaN系HEMT(化合物半導体装置)の構造を示す断面図である。
次に、第6の実施形態について説明する。図9(b)は、第6の実施形態に係るGaN系HEMT(化合物半導体装置)の構造を示す断面図である。
第7の実施形態は、GaN系HEMTを含む化合物半導体装置のディスクリートパッケージに関する。図10は、第7の実施形態に係るディスクリートパッケージを示す図である。
次に、第8の実施形態について説明する。第8の実施形態は、GaN系HEMTを含む化合物半導体装置を備えたPFC(Power Factor Correction)回路に関する。図11は、第8の実施形態に係るPFC回路を示す結線図である。
次に、第9の実施形態について説明する。第9の実施形態は、GaN系HEMTを含む化合物半導体装置を備えた電源装置に関する。図12は、第9の実施形態に係る電源装置を示す結線図である。
次に、第10の実施形態について説明する。第10の実施形態は、GaN系HEMTを含む化合物半導体装置を備えた高周波増幅器(高出力増幅器)に関する。図13は、第10の実施形態に係る高周波増幅器を示す結線図である。
基板と、
前記基板上方に形成された電子走行層及び電子供給層と、
前記電子供給層上方に形成されたゲート電極、ソース電極及びドレイン電極と、
前記電子供給層と前記ゲート電極との間に形成されたp型半導体層と、
前記電子供給層と前記p型半導体層との間に形成され、ドナ又は再結合中心を含み、正孔を打ち消す正孔打消層と、
を有することを特徴とする化合物半導体装置。
前記p型半導体層がMgを含有するGaN層であることを特徴とする付記1に記載の化合物半導体装置。
前記正孔打消層は、p型不純物を含有することを特徴とする付記1又は2に記載の化合物半導体装置。
前記正孔打消層は、p型不純物としてMgを含有することを特徴とする付記3に記載の化合物半導体装置。
前記正孔打消層は、前記ドナとしてSiを含有することを特徴とする付記1乃至4のいずれか1項に記載の化合物半導体装置。
前記正孔打消層は、前記再結合中心として、Fe、Cr、Co、Ni、Ti、V及びScからなる群から選択された少なくとも1種を含有することを特徴とする付記1乃至4のいずれか1項に記載の化合物半導体装置。
前記電子供給層と前記p型半導体層との間に形成され、前記電子供給層よりもバンドギャップが大きい正孔障壁層を有することを特徴とする付記1乃至6のいずれか1項に記載の化合物半導体装置。
前記電子供給層の組成がAlxGa1-xN(0<x<1)で表わされ、
前記正孔障壁層の組成がAlyGa1-yN(x<y≦1)で表わされることを特徴とする付記7に記載の化合物半導体装置。
前記電子供給層の組成がAlxGa1-xN(0<x<1)で表わされ、
前記正孔障壁層の組成がInzAl1-zN(0≦z≦1)で表わされることを特徴とする付記7に記載の化合物半導体装置。
前記ゲート電極と前記p型半導体層との間に形成されたゲート絶縁膜を有することを特徴とする付記1乃至9のいずれか1項に記載の化合物半導体装置。
平面視で前記ゲート電極と前記ソース電極との間に位置する領域及び前記ゲート電極と前記ドレイン電極との間に位置する領域において、前記電子供給層を覆う終端化膜を有することを特徴とする付記1乃至10のいずれか1項に記載の化合物半導体装置。
付記1乃至11のいずれか1項に記載の化合物半導体装置を有することを特徴とする電源装置。
付記1乃至11のいずれか1項に記載の化合物半導体装置を有することを特徴とする高出力増幅器。
基板上方に電子走行層及び電子供給層を形成する工程と、
前記電子供給層上方にゲート電極、ソース電極及びドレイン電極を形成する工程と、
を有し、
前記ゲート電極を形成する工程の前に、前記電子供給層と前記ゲート電極との間に位置するp型半導体層を形成する工程を有し、
前記p型半導体層を形成する工程の前に、前記電子供給層と前記p型半導体層との間に位置し、ドナ又は再結合中心を含み、正孔を打ち消す正孔打消層を形成する工程を有することを特徴とする化合物半導体装置の製造方法。
前記p型半導体層がMgを含有するGaN層であることを特徴とする付記14に記載の化合物半導体装置の製造方法。
前記正孔打消層は、p型不純物を含有することを特徴とする付記14又は15に記載の化合物半導体装置の製造方法。
前記正孔打消層は、p型不純物としてMgを含有することを特徴とする付記16に記載の化合物半導体装置の製造方法。
前記正孔打消層は、前記ドナとしてSiを含有することを特徴とする付記14乃至17のいずれか1項に記載の化合物半導体装置の製造方法。
前記正孔打消層は、前記再結合中心として、Fe、Cr、Co、Ni、Ti、V及びScからなる群から選択された少なくとも1種を含有することを特徴とする付記14乃至18のいずれか1項に記載の化合物半導体装置の製造方法。
前記正孔打消層を形成する工程の前に、前記電子供給層と前記正孔打消層との間に位置し、前記電子供給層よりもバンドギャップが大きい正孔障壁層を形成する工程を有することを特徴とする付記14乃至19のいずれか1項に記載の化合物半導体装置の製造方法。
12:バッファ層
13:電子走行層
14:スペーサ層
15:電子供給層
16:ドナ含有層
17:キャップ層
18:化合物半導体積層構造
20g:ゲート電極
20s:ソース電極
20d:ドレイン電極
26:再結合中心含有層
31:正孔障壁層
Claims (10)
- 基板と、
前記基板上方に形成された電子走行層及び電子供給層と、
前記電子供給層上方に形成されたゲート電極、ソース電極及びドレイン電極と、
前記電子供給層と前記ゲート電極との間に形成されたp型半導体層と、
前記電子供給層と前記p型半導体層との間に形成され、ドナ又は再結合中心を含み、正孔を打ち消す正孔打消層と、
を有することを特徴とする化合物半導体装置。 - 前記p型半導体層がMgを含有するGaN層であることを特徴とする請求項1に記載の化合物半導体装置。
- 前記正孔打消層は、p型不純物を含有することを特徴とする請求項1又は2に記載の化合物半導体装置。
- 前記正孔打消層は、p型不純物としてMgを含有することを特徴とする請求項3に記載の化合物半導体装置。
- 前記正孔打消層は、前記ドナとしてSiを含有することを特徴とする請求項1乃至4のいずれか1項に記載の化合物半導体装置。
- 前記正孔打消層は、前記再結合中心として、Fe、Cr、Co、Ni、Ti、V及びScからなる群から選択された少なくとも1種を含有することを特徴とする請求項1乃至4のいずれか1項に記載の化合物半導体装置。
- 前記電子供給層と前記p型半導体層との間に形成され、前記電子供給層よりもバンドギャップが大きい正孔障壁層を有することを特徴とする請求項1乃至6のいずれか1項に記載の化合物半導体装置。
- 請求項1乃至7のいずれか1項に記載の化合物半導体装置を有することを特徴とする電源装置。
- 請求項1乃至7のいずれか1項に記載の化合物半導体装置を有することを特徴とする高出力増幅器。
- 基板上方に電子走行層及び電子供給層を形成する工程と、
前記電子供給層上方にゲート電極、ソース電極及びドレイン電極を形成する工程と、
を有し、
前記ゲート電極を形成する工程の前に、前記電子供給層と前記ゲート電極との間に位置するp型半導体層を形成する工程を有し、
前記p型半導体層を形成する工程の前に、前記電子供給層と前記p型半導体層との間に位置し、ドナ又は再結合中心を含み、正孔を打ち消す正孔打消層を形成する工程を有することを特徴とする化合物半導体装置の製造方法。
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US13/723,527 US20130256683A1 (en) | 2012-03-28 | 2012-12-21 | Compound semiconductor and method of manufacturing the same |
TW101150053A TWI491043B (zh) | 2012-03-28 | 2012-12-26 | 化合物半導體裝置及其製造方法 |
KR20130003408A KR101458292B1 (ko) | 2012-03-28 | 2013-01-11 | 화합물 반도체 장치 및 그의 제조 방법 |
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US20130256683A1 (en) | 2013-10-03 |
KR101458292B1 (ko) | 2014-11-04 |
TWI491043B (zh) | 2015-07-01 |
KR20130109997A (ko) | 2013-10-08 |
CN103367425A (zh) | 2013-10-23 |
TW201340324A (zh) | 2013-10-01 |
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