JP2013201211A5 - - Google Patents

Download PDF

Info

Publication number
JP2013201211A5
JP2013201211A5 JP2012067662A JP2012067662A JP2013201211A5 JP 2013201211 A5 JP2013201211 A5 JP 2013201211A5 JP 2012067662 A JP2012067662 A JP 2012067662A JP 2012067662 A JP2012067662 A JP 2012067662A JP 2013201211 A5 JP2013201211 A5 JP 2013201211A5
Authority
JP
Japan
Prior art keywords
film
crystallization
electrode
oxygen pressure
drain electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012067662A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013201211A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012067662A priority Critical patent/JP2013201211A/ja
Priority claimed from JP2012067662A external-priority patent/JP2013201211A/ja
Priority to TW102105887A priority patent/TWI500165B/zh
Priority to US13/835,405 priority patent/US8957416B2/en
Priority to KR1020130027981A priority patent/KR20130108133A/ko
Priority to CN2013100846434A priority patent/CN103325817A/zh
Publication of JP2013201211A publication Critical patent/JP2013201211A/ja
Publication of JP2013201211A5 publication Critical patent/JP2013201211A5/ja
Pending legal-status Critical Current

Links

JP2012067662A 2012-03-23 2012-03-23 薄膜トランジスタ、薄膜トランジスタの製造方法および電子機器 Pending JP2013201211A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012067662A JP2013201211A (ja) 2012-03-23 2012-03-23 薄膜トランジスタ、薄膜トランジスタの製造方法および電子機器
TW102105887A TWI500165B (zh) 2012-03-23 2013-02-20 薄膜電晶體、其製造方法及電子設備
US13/835,405 US8957416B2 (en) 2012-03-23 2013-03-15 Thin film transistor, manufacturing method of the same and electronic equipment
KR1020130027981A KR20130108133A (ko) 2012-03-23 2013-03-15 박막 트랜지스터, 그 제조 방법 및 전자 기기
CN2013100846434A CN103325817A (zh) 2012-03-23 2013-03-15 薄膜晶体管、薄膜晶体管制造方法及电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012067662A JP2013201211A (ja) 2012-03-23 2012-03-23 薄膜トランジスタ、薄膜トランジスタの製造方法および電子機器

Publications (2)

Publication Number Publication Date
JP2013201211A JP2013201211A (ja) 2013-10-03
JP2013201211A5 true JP2013201211A5 (enExample) 2015-04-02

Family

ID=49194473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012067662A Pending JP2013201211A (ja) 2012-03-23 2012-03-23 薄膜トランジスタ、薄膜トランジスタの製造方法および電子機器

Country Status (5)

Country Link
US (1) US8957416B2 (enExample)
JP (1) JP2013201211A (enExample)
KR (1) KR20130108133A (enExample)
CN (1) CN103325817A (enExample)
TW (1) TWI500165B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2933825B1 (en) * 2014-03-31 2017-07-05 Flosfia Inc. Crystalline multilayer structure and semiconductor device
US10109707B2 (en) * 2014-03-31 2018-10-23 Flosfia Inc. Crystalline multilayer oxide thin films structure in semiconductor device
US9634097B2 (en) * 2014-11-25 2017-04-25 Sandisk Technologies Llc 3D NAND with oxide semiconductor channel
CN104934330A (zh) * 2015-05-08 2015-09-23 京东方科技集团股份有限公司 一种薄膜晶体管及其制备方法、阵列基板和显示面板
TWI611587B (zh) * 2016-08-31 2018-01-11 明新科技大學 氧化物薄膜電晶體
WO2018111247A1 (en) 2016-12-13 2018-06-21 Intel Corporation Passivation dielectrics for oxide semiconductor thin film transistors
KR102304800B1 (ko) * 2019-12-17 2021-09-24 한양대학교 산학협력단 Igo 채널층 기반의 메모리 장치 및 그 제조방법
JP7326795B2 (ja) * 2019-03-20 2023-08-16 株式会社リコー 電界効果型トランジスタ、表示素子、画像表示装置、及びシステム
JP7180492B2 (ja) * 2019-03-26 2022-11-30 Tdk株式会社 誘電体膜および電子部品
US11616057B2 (en) 2019-03-27 2023-03-28 Intel Corporation IC including back-end-of-line (BEOL) transistors with crystalline channel material
US20250151354A1 (en) * 2021-10-14 2025-05-08 Idemitsu Kosan Co., Ltd. Crystalline oxide thin film, method for producing same, thin film transistor, and method for producing same
WO2024042997A1 (ja) * 2022-08-25 2024-02-29 株式会社ジャパンディスプレイ 酸化物半導体膜、薄膜トランジスタ、および電子機器

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3913756B2 (ja) * 2002-05-22 2007-05-09 雅司 川崎 半導体装置およびそれを用いる表示装置
WO2007058248A1 (ja) * 2005-11-18 2007-05-24 Idemitsu Kosan Co., Ltd. 半導体薄膜、及びその製造方法、並びに薄膜トランジスタ
CN101680081B (zh) * 2007-03-20 2012-10-31 出光兴产株式会社 溅射靶、氧化物半导体膜及半导体器件
JP5242083B2 (ja) 2007-06-13 2013-07-24 出光興産株式会社 結晶酸化物半導体、及びそれを用いてなる薄膜トランジスタ
WO2009093625A1 (ja) * 2008-01-23 2009-07-30 Idemitsu Kosan Co., Ltd. 電界効果型トランジスタ及びその製造方法、それを用いた表示装置、並びに半導体装置
EP2086014B1 (en) * 2008-02-01 2012-12-26 Ricoh Company, Ltd. Method for producing conductive oxide-deposited substrate and MIS laminated structure
KR20120049899A (ko) * 2009-09-04 2012-05-17 스미또모 가가꾸 가부시키가이샤 반도체 기판, 전계 효과 트랜지스터, 집적 회로 및 반도체 기판의 제조 방법
JP2011066070A (ja) * 2009-09-15 2011-03-31 Idemitsu Kosan Co Ltd 多結晶薄膜、その成膜方法、及び薄膜トランジスタ
WO2011070900A1 (en) 2009-12-08 2011-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2011159697A (ja) * 2010-01-29 2011-08-18 Dainippon Printing Co Ltd 薄膜トランジスタ搭載基板、その製造方法及び画像表示装置
WO2011129456A1 (en) * 2010-04-16 2011-10-20 Semiconductor Energy Laboratory Co., Ltd. Deposition method and method for manufacturing semiconductor device
WO2012014952A1 (en) * 2010-07-27 2012-02-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
JP2012169344A (ja) * 2011-02-10 2012-09-06 Sony Corp 薄膜トランジスタならびに表示装置および電子機器

Similar Documents

Publication Publication Date Title
JP2013201211A5 (enExample)
JP5606682B2 (ja) 薄膜トランジスタ、多結晶酸化物半導体薄膜の製造方法、及び薄膜トランジスタの製造方法
CN102473730B (zh) 布线构造及其制造方法、以及具备布线构造的显示装置
TWI500165B (zh) 薄膜電晶體、其製造方法及電子設備
US10096629B2 (en) Semiconductor device and method for manufacturing same
US20150357480A1 (en) Stable metal-oxide thin film transistor and method of making
JP2017034258A5 (ja) 半導体装置、半導体装置の作製方法
KR20150087411A (ko) 박막 트랜지스터 및 그의 제조 방법
JP2011100990A5 (ja) 半導体装置
JP6425508B2 (ja) 薄膜トランジスタ
WO2016045164A1 (zh) 钙钛矿结构的无机金属氧化物半导体薄膜及其金属氧化物薄膜晶体管
JPWO2014168224A1 (ja) 酸化物半導体ターゲット、酸化物半導体膜及びその製造方法、並びに薄膜トランジスタ
Ke et al. Thickness-induced metal-insulator transition in Sb-doped SnO2 ultrathin films: The role of quantum confinement
TWI593807B (zh) 靶材
Zhilova et al. Optical and electrical properties of thin-film hetero-structures of the In2O3–ZnO system
KR20190068171A (ko) 박막 트랜지스터, 그 제조방법 및 이를 포함하는 표시장치
CN105552080B (zh) 基于金属氧化物薄膜晶体管的非挥发性存储器的制备方法
JP5622457B2 (ja) 薄膜トランジスタおよびその製造方法
US11682705B2 (en) Thin film transistor substrate
CN106252203B (zh) 金属氧化物半导体层的结晶方法及半导体结构
JP5416470B2 (ja) 表示装置およびこれに用いるCu合金膜
KR102090289B1 (ko) 산화물 스퍼터링 타겟, 이를 이용한 박막 트랜지스터 및 그 제조 방법
KR20200076008A (ko) 투명 산화물 박막의 제조 방법 및 이를 이용한 트랜지스터의 제조 방법
JP2005191555A5 (enExample)
Srivastava et al. Investigating the properties of nickel oxide thin films prepared via DC reactive magnetron sputtering for potential application in gas sensing