JP2013177667A - 反射膜および／または透過膜、もしくは電気配線および／または電極に用いられるＡｇ合金膜、並びにＡｇ合金スパッタリングターゲットおよびＡｇ合金フィラー - Google Patents

反射膜および／または透過膜、もしくは電気配線および／または電極に用いられるＡｇ合金膜、並びにＡｇ合金スパッタリングターゲットおよびＡｇ合金フィラー Download PDF

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Publication number
JP2013177667A
JP2013177667A JP2012171487A JP2012171487A JP2013177667A JP 2013177667 A JP2013177667 A JP 2013177667A JP 2012171487 A JP2012171487 A JP 2012171487A JP 2012171487 A JP2012171487 A JP 2012171487A JP 2013177667 A JP2013177667 A JP 2013177667A
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JP
Japan
Prior art keywords
film
alloy
group
alloy film
atomic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012171487A
Other languages
English (en)
Japanese (ja)
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JP2013177667A5 (enExample
Inventor
Hironori Tauchi
裕基 田内
Yoko Shida
陽子 志田
Hiroyuki Okuno
博行 奥野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP2012171487A priority Critical patent/JP2013177667A/ja
Priority to KR1020147021427A priority patent/KR20140107666A/ko
Priority to KR1020167023358A priority patent/KR20160106184A/ko
Priority to PCT/JP2013/051152 priority patent/WO2013115002A1/ja
Priority to US14/370,153 priority patent/US20140369884A1/en
Priority to CN201380007803.3A priority patent/CN104093865A/zh
Priority to TW102103492A priority patent/TWI485269B/zh
Publication of JP2013177667A publication Critical patent/JP2013177667A/ja
Publication of JP2013177667A5 publication Critical patent/JP2013177667A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/26—Reflecting filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023—Alloys based on aluminium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2012171487A 2012-02-02 2012-08-01 反射膜および／または透過膜、もしくは電気配線および／または電極に用いられるＡｇ合金膜、並びにＡｇ合金スパッタリングターゲットおよびＡｇ合金フィラー Pending JP2013177667A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012171487A JP2013177667A (ja) 2012-02-02 2012-08-01 反射膜および／または透過膜、もしくは電気配線および／または電極に用いられるＡｇ合金膜、並びにＡｇ合金スパッタリングターゲットおよびＡｇ合金フィラー
KR1020147021427A KR20140107666A (ko) 2012-02-02 2013-01-22 반사막 및/또는 투과막, 혹은 전기 배선 및/또는 전극에 사용되는 Ag 합금막, 및 Ag 합금 스퍼터링 타깃 및 Ag 합금 필러
KR1020167023358A KR20160106184A (ko) 2012-02-02 2013-01-22 Ag 합금 스퍼터링 타깃
PCT/JP2013/051152 WO2013115002A1 (ja) 2012-02-02 2013-01-22 反射膜および／または透過膜、もしくは電気配線および／または電極に用いられるＡｇ合金膜、並びにＡｇ合金スパッタリングターゲットおよびＡｇ合金フィラー
US14/370,153 US20140369884A1 (en) 2012-02-02 2013-01-22 Ag alloy film to be used as reflecting film and/or transmitting film or as electrical wiring and/or electrode, ag alloy sputtering target, and ag alloy filler
CN201380007803.3A CN104093865A (zh) 2012-02-02 2013-01-22 用于反射膜和/或透射膜、或者用于电气布线和/或电极的Ag合金膜、以及Ag合金溅射靶及Ag合金填料
TW102103492A TWI485269B (zh) 2012-02-02 2013-01-30 A silver alloy film used for a reflective film and / or a film, or an electrical wiring and / or an electrode, and a silver alloy sputtering target and a silver alloy filler

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012021158 2012-02-02
JP2012021158 2012-02-02
JP2012171487A JP2013177667A (ja) 2012-02-02 2012-08-01 反射膜および／または透過膜、もしくは電気配線および／または電極に用いられるＡｇ合金膜、並びにＡｇ合金スパッタリングターゲットおよびＡｇ合金フィラー

Publications (2)

Publication Number Publication Date
JP2013177667A true JP2013177667A (ja) 2013-09-09
JP2013177667A5 JP2013177667A5 (enExample) 2015-05-28

Family

ID=48905044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012171487A Pending JP2013177667A (ja) 2012-02-02 2012-08-01 反射膜および／または透過膜、もしくは電気配線および／または電極に用いられるＡｇ合金膜、並びにＡｇ合金スパッタリングターゲットおよびＡｇ合金フィラー

Country Status (6)

Country Link
US (1) US20140369884A1 (enExample)
JP (1) JP2013177667A (enExample)
KR (2) KR20140107666A (enExample)
CN (1) CN104093865A (enExample)
TW (1) TWI485269B (enExample)
WO (1) WO2013115002A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140122338A (ko) * 2013-04-09 2014-10-20 쓰리엠 이노베이티브 프로퍼티즈 캄파니 터치패널, 그 제조방법 및 터치패널용 Ag-Pd-Nd 합금
JP5850077B2 (ja) * 2014-04-09 2016-02-03 三菱マテリアル株式会社 Ａｇ合金膜及びＡｇ合金膜形成用スパッタリングターゲット
KR20170038894A (ko) 2014-08-07 2017-04-07 쓰리엠 이노베이티브 프로퍼티즈 컴파니 반사 시트 및 그의 제조 방법
JP6172230B2 (ja) * 2014-09-18 2017-08-02 三菱マテリアル株式会社 Ａｇ合金スパッタリングターゲット、Ａｇ合金膜およびＡｇ合金膜の製造方法
JP5975186B1 (ja) 2015-02-27 2016-08-23 三菱マテリアル株式会社 Ａｇ合金スパッタリングターゲット及びＡｇ合金膜の製造方法
KR20220035992A (ko) * 2016-12-22 2022-03-22 다나카 기킨조쿠 고교 가부시키가이샤 반도체 기판의 이면 전극의 전극 구조 및 그의 제조 방법, 그리고 해당 전극 구조의 제조에 제공되는 스퍼터링 타깃
CN106756836A (zh) * 2017-01-06 2017-05-31 广州市祺虹电子科技有限公司 一种透明电路板用镧系靶材及其制造方法
US11231533B2 (en) * 2018-07-12 2022-01-25 Visera Technologies Company Limited Optical element having dielectric layers formed by ion-assisted deposition and method for fabricating the same
JP7199285B2 (ja) * 2019-03-29 2023-01-05 株式会社ノリタケカンパニーリミテド 銀パラジウム合金粉末およびその利用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003034828A (ja) * 2001-02-15 2003-02-07 Kobe Steel Ltd 電磁波シールド用のＡｇ合金膜、電磁波シールド用Ａｇ合金膜形成体及び電磁波シールド用Ａｇ合金スパッタリングターゲット
WO2006129482A1 (ja) * 2005-05-30 2006-12-07 Sumitomo Electric Industries, Ltd. 金属被膜とその形成方法および金属配線
WO2006132417A1 (ja) * 2005-06-10 2006-12-14 Tanaka Kikinzoku Kogyo K.K. 反射率・透過率維持特性に優れた銀合金
WO2006132413A1 (ja) * 2005-06-10 2006-12-14 Tanaka Kikinzoku Kogyo K.K. 電極、配線及び電磁波遮蔽用の銀合金

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JP3855958B2 (ja) 2001-03-16 2006-12-13 石福金属興業株式会社 スパッタリングターゲット材
JP4105956B2 (ja) 2002-08-08 2008-06-25 株式会社神戸製鋼所 光反射膜およびこれを用いた液晶表示素子、ならびに光反射膜用スパッタリングターゲット
JP4009564B2 (ja) * 2003-06-27 2007-11-14 株式会社神戸製鋼所 リフレクター用Ａｇ合金反射膜、及び、このＡｇ合金反射膜を用いたリフレクター、並びに、このＡｇ合金反射膜のＡｇ合金薄膜の形成用のＡｇ合金スパッタリングターゲット
JP4384453B2 (ja) * 2003-07-16 2009-12-16 株式会社神戸製鋼所 Ａｇ系スパッタリングターゲット及びその製造方法
JP4421394B2 (ja) 2003-07-23 2010-02-24 シャープ株式会社 銀合金材料、回路基板、電子装置、及び回路基板の製造方法
JP4188299B2 (ja) * 2003-12-04 2008-11-26 株式会社神戸製鋼所 フラットパネルディスプレイ用Ａｇ基合金配線電極膜及びＡｇ基合金スパッタリングターゲット並びにフラットパネルディスプレイ
WO2005056849A1 (ja) * 2003-12-10 2005-06-23 Tanaka Kikinzoku Kogyo K.K. 反射率維持特性に優れた銀合金
JPWO2006132412A1 (ja) * 2005-06-10 2009-01-08 田中貴金属工業株式会社 電極、配線及び電磁波遮蔽用の銀合金

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003034828A (ja) * 2001-02-15 2003-02-07 Kobe Steel Ltd 電磁波シールド用のＡｇ合金膜、電磁波シールド用Ａｇ合金膜形成体及び電磁波シールド用Ａｇ合金スパッタリングターゲット
WO2006129482A1 (ja) * 2005-05-30 2006-12-07 Sumitomo Electric Industries, Ltd. 金属被膜とその形成方法および金属配線
WO2006132417A1 (ja) * 2005-06-10 2006-12-14 Tanaka Kikinzoku Kogyo K.K. 反射率・透過率維持特性に優れた銀合金
WO2006132413A1 (ja) * 2005-06-10 2006-12-14 Tanaka Kikinzoku Kogyo K.K. 電極、配線及び電磁波遮蔽用の銀合金

Also Published As

Publication number Publication date
TWI485269B (zh) 2015-05-21
TW201343936A (zh) 2013-11-01
KR20160106184A (ko) 2016-09-09
KR20140107666A (ko) 2014-09-04
WO2013115002A1 (ja) 2013-08-08
CN104093865A (zh) 2014-10-08
US20140369884A1 (en) 2014-12-18

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