JP2013151638A - カバーレイフィルム、フレキシブル配線板およびその製造方法 - Google Patents

カバーレイフィルム、フレキシブル配線板およびその製造方法 Download PDF

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Publication number
JP2013151638A
JP2013151638A JP2012170818A JP2012170818A JP2013151638A JP 2013151638 A JP2013151638 A JP 2013151638A JP 2012170818 A JP2012170818 A JP 2012170818A JP 2012170818 A JP2012170818 A JP 2012170818A JP 2013151638 A JP2013151638 A JP 2013151638A
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JP
Japan
Prior art keywords
film
resin
adhesive layer
substrate
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012170818A
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English (en)
Japanese (ja)
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JP2013151638A5 (enExample
Inventor
Satoshi Nakao
敏 中尾
Noriaki Sekine
典昭 関根
Yukio Yamaguchi
幸雄 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Priority to JP2012170818A priority Critical patent/JP2013151638A/ja
Priority to PCT/JP2012/008166 priority patent/WO2013099172A1/ja
Publication of JP2013151638A publication Critical patent/JP2013151638A/ja
Publication of JP2013151638A5 publication Critical patent/JP2013151638A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C09J125/10—Copolymers of styrene with conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2471/00—Presence of polyether

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
JP2012170818A 2011-12-27 2012-08-01 カバーレイフィルム、フレキシブル配線板およびその製造方法 Pending JP2013151638A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012170818A JP2013151638A (ja) 2011-12-27 2012-08-01 カバーレイフィルム、フレキシブル配線板およびその製造方法
PCT/JP2012/008166 WO2013099172A1 (ja) 2011-12-27 2012-12-20 カバーレイフィルム、フレキシブル配線板およびその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011285630 2011-12-27
JP2011285630 2011-12-27
JP2012170818A JP2013151638A (ja) 2011-12-27 2012-08-01 カバーレイフィルム、フレキシブル配線板およびその製造方法

Publications (2)

Publication Number Publication Date
JP2013151638A true JP2013151638A (ja) 2013-08-08
JP2013151638A5 JP2013151638A5 (enExample) 2014-09-04

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JP (1) JP2013151638A (enExample)
WO (1) WO2013099172A1 (enExample)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
KR101549988B1 (ko) * 2014-05-30 2015-09-03 (주)창성 커버레이 분리형 자성시트와 이를 포함하는 연성인쇄회로기판 및 이들의 제조방법
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
JP2017092417A (ja) * 2015-11-17 2017-05-25 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
JPWO2016132424A1 (ja) * 2015-02-16 2017-11-24 日本メクトロン株式会社 フレキシブルプリント配線板の製造方法
WO2020049964A1 (ja) 2018-09-06 2020-03-12 リケンテクノス株式会社 ホットメルト接着剤、補強テープ、及び該補強テープを用いて導体端末を補強されたフレキシブルフラットケーブル
KR20200050920A (ko) * 2020-04-29 2020-05-12 주식회사 두산 프라이머 코팅-동박 및 동박 적층판
WO2020110421A1 (ja) * 2018-11-29 2020-06-04 株式会社ジャパンディスプレイ フレキシブル基板
CN111867242A (zh) * 2019-08-23 2020-10-30 李龙凯 一种高频线路板新型材料层结构的压合成型方法及其制品
CN112339378A (zh) * 2019-08-08 2021-02-09 住友化学株式会社 层叠体
KR20210015745A (ko) * 2018-05-28 2021-02-10 도요보 가부시키가이샤 저유전 접착제 조성물
JPWO2021025056A1 (enExample) * 2019-08-06 2021-02-11
JPWO2021024364A1 (enExample) * 2019-08-06 2021-02-11
KR20210025390A (ko) * 2019-08-27 2021-03-09 주식회사 두산 커버레이 필름 및 이의 제조방법, 상기 커버레이 필름을 포함하는 연성 금속 복합기판
JP2021061409A (ja) * 2015-01-19 2021-04-15 パナソニックＩｐマネジメント株式会社 多層プリント配線板、多層金属張積層板、樹脂付き金属箔
WO2022070900A1 (ja) * 2020-09-29 2022-04-07 日東電工株式会社 粘着剤組成物、粘着剤層、及び粘着シート
WO2022070899A1 (ja) * 2020-09-29 2022-04-07 日東電工株式会社 粘着剤組成物、粘着剤層、及び粘着シート
JP2022056352A (ja) * 2020-09-29 2022-04-08 日東電工株式会社 粘着剤組成物、粘着剤層、及び粘着シート
JP2022056351A (ja) * 2020-09-29 2022-04-08 日東電工株式会社 粘着剤組成物、粘着剤層、及び粘着シート
JP2022100406A (ja) * 2016-03-17 2022-07-05 王子ホールディングス株式会社 粘着剤組成物及び粘着シート
KR102434919B1 (ko) * 2022-04-01 2022-08-24 주식회사 노바텍 보호 케이스용 커버 부재의 제조방법 및 이에 의해 제조된 보호 케이스용 커버 부재

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6022893B2 (ja) * 2012-10-24 2016-11-09 ナミックス株式会社 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法
KR20180001912A (ko) * 2016-06-28 2018-01-05 주식회사 두산 프라이머 코팅-동박 및 동박 적층판
JP7706828B2 (ja) * 2020-12-23 2025-07-14 日鉄ケミカル＆マテリアル株式会社 ポリイミド組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH057067A (ja) * 1990-12-05 1993-01-14 Hitachi Chem Co Ltd カバーレイフイルム付フレキシブル印刷配線板の製造方法
JPH06200218A (ja) * 1993-01-05 1994-07-19 Mitsui Toatsu Chem Inc 耐熱性接着シート
JP2010050225A (ja) * 2008-08-20 2010-03-04 Sharp Corp プリント配線板、プリント配線板製造方法、および電子機器
JP2010219552A (ja) * 2010-06-03 2010-09-30 Nippon Mektron Ltd 配線基板の製造方法
JP2011068713A (ja) * 2009-09-24 2011-04-07 Namics Corp カバーレイフィルム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4825286B2 (ja) * 2009-08-07 2011-11-30 ナミックス株式会社 多層配線板の製造方法
KR101749369B1 (ko) * 2010-03-11 2017-06-20 나믹스 가부시끼가이샤 필름용 조성물, 및 그것에 의한 접착 필름 및 커버레이 필름

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH057067A (ja) * 1990-12-05 1993-01-14 Hitachi Chem Co Ltd カバーレイフイルム付フレキシブル印刷配線板の製造方法
JPH06200218A (ja) * 1993-01-05 1994-07-19 Mitsui Toatsu Chem Inc 耐熱性接着シート
JP2010050225A (ja) * 2008-08-20 2010-03-04 Sharp Corp プリント配線板、プリント配線板製造方法、および電子機器
JP2011068713A (ja) * 2009-09-24 2011-04-07 Namics Corp カバーレイフィルム
JP2010219552A (ja) * 2010-06-03 2010-09-30 Nippon Mektron Ltd 配線基板の製造方法

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
KR101549988B1 (ko) * 2014-05-30 2015-09-03 (주)창성 커버레이 분리형 자성시트와 이를 포함하는 연성인쇄회로기판 및 이들의 제조방법
JP2021061409A (ja) * 2015-01-19 2021-04-15 パナソニックＩｐマネジメント株式会社 多層プリント配線板、多層金属張積層板、樹脂付き金属箔
JP7113297B2 (ja) 2015-01-19 2022-08-05 パナソニックＩｐマネジメント株式会社 多層プリント配線板、多層金属張積層板、樹脂付き金属箔
JPWO2016132424A1 (ja) * 2015-02-16 2017-11-24 日本メクトロン株式会社 フレキシブルプリント配線板の製造方法
US10149392B2 (en) 2015-02-16 2018-12-04 Nippo Mektron, Ltd. Manufacturing method of flexible printed wiring board
JP2017092417A (ja) * 2015-11-17 2017-05-25 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
JP2022100406A (ja) * 2016-03-17 2022-07-05 王子ホールディングス株式会社 粘着剤組成物及び粘着シート
KR102552552B1 (ko) 2018-05-28 2023-07-06 도요보 엠씨 가부시키가이샤 저유전 접착제 조성물
KR20210015745A (ko) * 2018-05-28 2021-02-10 도요보 가부시키가이샤 저유전 접착제 조성물
WO2020049964A1 (ja) 2018-09-06 2020-03-12 リケンテクノス株式会社 ホットメルト接着剤、補強テープ、及び該補強テープを用いて導体端末を補強されたフレキシブルフラットケーブル
WO2020110421A1 (ja) * 2018-11-29 2020-06-04 株式会社ジャパンディスプレイ フレキシブル基板
JPWO2021024364A1 (enExample) * 2019-08-06 2021-02-11
WO2021025056A1 (ja) * 2019-08-06 2021-02-11 株式会社村田製作所 樹脂シート及び樹脂多層基板
JPWO2021025056A1 (enExample) * 2019-08-06 2021-02-11
JP7351912B2 (ja) 2019-08-06 2023-09-27 デクセリアルズ株式会社 接着剤組成物、熱硬化性接着シート及びプリント配線板
JP7127746B2 (ja) 2019-08-06 2022-08-30 株式会社村田製作所 樹脂シート及び樹脂多層基板
US12120817B2 (en) 2019-08-06 2024-10-15 Murata Manufacturing Co., Ltd. Resin multilayer substrate and method for manufacturing resin multilayer substrate
CN112339378A (zh) * 2019-08-08 2021-02-09 住友化学株式会社 层叠体
CN111867242A (zh) * 2019-08-23 2020-10-30 李龙凯 一种高频线路板新型材料层结构的压合成型方法及其制品
KR20210025390A (ko) * 2019-08-27 2021-03-09 주식회사 두산 커버레이 필름 및 이의 제조방법, 상기 커버레이 필름을 포함하는 연성 금속 복합기판
KR102390869B1 (ko) * 2019-08-27 2022-04-26 주식회사 두산 커버레이 필름 및 이의 제조방법, 상기 커버레이 필름을 포함하는 연성 금속 복합기판
KR20200050920A (ko) * 2020-04-29 2020-05-12 주식회사 두산 프라이머 코팅-동박 및 동박 적층판
KR102143318B1 (ko) * 2020-04-29 2020-08-10 주식회사 두산 프라이머 코팅-동박 및 동박 적층판
JP2022056351A (ja) * 2020-09-29 2022-04-08 日東電工株式会社 粘着剤組成物、粘着剤層、及び粘着シート
JP2022056352A (ja) * 2020-09-29 2022-04-08 日東電工株式会社 粘着剤組成物、粘着剤層、及び粘着シート
WO2022070899A1 (ja) * 2020-09-29 2022-04-07 日東電工株式会社 粘着剤組成物、粘着剤層、及び粘着シート
WO2022070900A1 (ja) * 2020-09-29 2022-04-07 日東電工株式会社 粘着剤組成物、粘着剤層、及び粘着シート
KR102434919B1 (ko) * 2022-04-01 2022-08-24 주식회사 노바텍 보호 케이스용 커버 부재의 제조방법 및 이에 의해 제조된 보호 케이스용 커버 부재

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