TWI302080B - - Google Patents
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- Publication number
- TWI302080B TWI302080B TW094134841A TW94134841A TWI302080B TW I302080 B TWI302080 B TW I302080B TW 094134841 A TW094134841 A TW 094134841A TW 94134841 A TW94134841 A TW 94134841A TW I302080 B TWI302080 B TW I302080B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- conductor layer
- substrate
- film
- laminated
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims description 160
- 239000000758 substrate Substances 0.000 claims description 88
- 239000004020 conductor Substances 0.000 claims description 60
- 239000010408 film Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000013039 cover film Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 52
- 239000011229 interlayer Substances 0.000 description 38
- 229910052802 copper Inorganic materials 0.000 description 28
- 239000010949 copper Substances 0.000 description 28
- 239000011889 copper foil Substances 0.000 description 24
- 229920001721 polyimide Polymers 0.000 description 23
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 18
- 101100273566 Humulus lupulus CCL10 gene Proteins 0.000 description 13
- 238000007747 plating Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 150000002466 imines Chemical class 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 101710083129 50S ribosomal protein L10, chloroplastic Proteins 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 244000126211 Hericium coralloides Species 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004313814A JP2006128360A (ja) | 2004-10-28 | 2004-10-28 | プリント配線板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200631483A TW200631483A (en) | 2006-09-01 |
| TWI302080B true TWI302080B (enExample) | 2008-10-11 |
Family
ID=36722754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094134841A TW200631483A (en) | 2004-10-28 | 2005-10-05 | Printed wiring board and manufacturing method thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2006128360A (enExample) |
| KR (1) | KR100742679B1 (enExample) |
| CN (1) | CN1767720A (enExample) |
| TW (1) | TW200631483A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9526179B2 (en) | 2014-03-06 | 2016-12-20 | Mutual-Tek Industries Co., Ltd. | Printed circuit board and method thereof |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100754080B1 (ko) | 2006-07-13 | 2007-08-31 | 삼성전기주식회사 | 리지드-플렉서블 인쇄회로기판 및 그 제조방법 |
| KR100771310B1 (ko) | 2006-08-22 | 2007-10-29 | 삼성전기주식회사 | 리지드-플렉서블 인쇄회로기판 및 그 제조방법 |
| US8071883B2 (en) | 2006-10-23 | 2011-12-06 | Ibiden Co., Ltd. | Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same |
| US7982135B2 (en) | 2006-10-30 | 2011-07-19 | Ibiden Co., Ltd. | Flex-rigid wiring board and method of manufacturing the same |
| EP2187720A4 (en) | 2008-03-10 | 2011-11-23 | Ibiden Co Ltd | FLEXIBLE PCB AND MANUFACTURING METHOD THEREFOR |
| JP2010232585A (ja) * | 2009-03-30 | 2010-10-14 | Toppan Printing Co Ltd | 多層配線基板およびその製造方法 |
| JP2011082317A (ja) * | 2009-10-07 | 2011-04-21 | Sumitomo Electric Printed Circuit Inc | フレキシブルプリント配線板及びこれを備える電子機器 |
| CN103327738B (zh) * | 2012-03-22 | 2016-03-09 | 富葵精密组件(深圳)有限公司 | 软硬结合电路板及其制作方法 |
| CN104602448B (zh) * | 2013-10-30 | 2017-11-03 | 鹏鼎控股(深圳)股份有限公司 | 可挠式电路板及其制作方法 |
| JP5913401B2 (ja) * | 2014-02-26 | 2016-04-27 | レノボ・シンガポール・プライベート・リミテッド | 引出構造、キーボードユニット及び携帯用情報機器 |
| CN105592638B (zh) * | 2014-10-20 | 2018-10-30 | 鹏鼎控股(深圳)股份有限公司 | 刚挠结合板及其制作方法 |
| TWI713420B (zh) * | 2019-04-01 | 2020-12-11 | 新揚科技股份有限公司 | 電路板結構 |
| CN110913577A (zh) * | 2019-12-24 | 2020-03-24 | 江苏弘信华印电路科技有限公司 | 一种六层软硬结合板的叠构结构 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2841996B2 (ja) * | 1992-01-13 | 1998-12-24 | 日立化成工業株式会社 | リジッドフレックス配線板の製造方法 |
| JPH0750455A (ja) * | 1993-08-06 | 1995-02-21 | Mitsui Toatsu Chem Inc | リジッドフレックスプリント配線板およびその製造方法 |
| JPH07193370A (ja) * | 1993-12-25 | 1995-07-28 | Ibiden Co Ltd | フレックスリジッドプリント基板及びその製造方法 |
| JPH0955562A (ja) * | 1995-08-11 | 1997-02-25 | Cmk Corp | プリント配線板 |
| US6350387B2 (en) | 1997-02-14 | 2002-02-26 | Teledyne Industries, Inc. | Multilayer combined rigid/flex printed circuit board containing flexible soldermask |
-
2004
- 2004-10-28 JP JP2004313814A patent/JP2006128360A/ja active Pending
-
2005
- 2005-10-05 TW TW094134841A patent/TW200631483A/zh not_active IP Right Cessation
- 2005-10-27 KR KR1020050101764A patent/KR100742679B1/ko not_active Expired - Fee Related
- 2005-10-28 CN CNA200510118461XA patent/CN1767720A/zh active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9526179B2 (en) | 2014-03-06 | 2016-12-20 | Mutual-Tek Industries Co., Ltd. | Printed circuit board and method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006128360A (ja) | 2006-05-18 |
| CN1767720A (zh) | 2006-05-03 |
| KR100742679B1 (ko) | 2007-07-25 |
| TW200631483A (en) | 2006-09-01 |
| KR20060052260A (ko) | 2006-05-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |